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BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing an example of an
electret microphone according to the present invention. 11 иии Capsules 16 и и и и и и и Electret
diaphragm, 18 и и и и и и и и и и и и и и и и и и и и и и и и и и и и и metal plate, 22
иииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииииии Impedance conversion element
Element accommodating part, 29 ..... Air chamber.
DETAILED DESCRIPTION OF THE INVENTION The present invention is an electret microphone
VC @@ provided with an invertance conversion element in a capsule. 14, t, -v, ... In a conventional
type electret microphone, if it is 4s to convert its electrical output signal into impedance, an
impedance conversion element such as a field effect transistor is encapsulated in a capsule t -S.
Therefore, sometimes the pressure on the air chamber on the back of the back electrode plate
changes due to the heat, and the sensitivity of the terminal is distorted due to the deflection of
the diaphragm. However, there is a disadvantage in that the frequency characteristics deteriorate
due to the fact that the rt air chamber communicates with the outside. In this device, a metal
plate is placed at a distance from the back plate to the diaphragm of the back plate, and the air
space in which the impedance element is designed and separated by this metal plate is connected
to the back plate. The metal plate is bent and extended to electrically and mechanically contact
the back electrode plate K11, and 1-connected to the impedance conversion element and back
electrode plate through the metal plate. Because the impedance conversion element housing is
metallized by the metal plate and the load on the back electrode side is one cut tl, therefore the
soldering of the impedance element sometimes causes vibration ? to occur even if the air
pressure of the conversion element housing changes. Affected pipes are affected by f'Irt (2). Next,
an electret microphone according to the invention will be described with reference to the
drawings. In the figure, for example, a capsule 11 made of an aluminum cylinder is shown, and a
front plate 12 is integrally provided on one end face thereof, a front face @, and a central hole IR
for capturing a sound in the center of the front plate 12. It is open. A cross 14 is attached to the
front of the front plate 12 of the capsule, and the center hole 18 is closed. In the capsule 11, a
ring 15 is disposed in contact with the surface of the front plate 12 and an electret diaphragm 16
is attached to the ring 15 on the opposite side of the front plate 12 j. A back electrode plate 18 is
disposed to face the diaphragm 16 via a spacer 17 of an insulating material. A ring-shaped
cushion 19 is disposed behind the back electrode plate 18, and a metal plate 21 is disposed
behind the same. At its back side, the back pole holder 22 is inserted into the capsule 11 and the
holder 22 t '! The capsule 11 is in the form of an ?i? coaxial cylindrical body, and is made of,
for example, a synthetic resin material. The inner diameter of the back electrode holder 22 of the
portion where the back electrode plate 18, the Knoshi branch 19 (R) and the metal plate 21 are
held is made large, and the step between the large diameter portion and the small diameter
portion 28 is formed, the metal 4 [21 contacts the step 28 and the metal plate 21 is pushed by
the step 28 to the back electrode 18 ?, that is, the front plate 12 @ of the capsule through the
cushion 19.
The end face on the back side of the holder 22 is closed by the wiring board 24 ? The rear end
of the capsule 11 is bent on the back side of the board 24 and crimped, all of which are
mechanically fixed ?On the substrate 24, the impedance conversion element 25 composed of a
semiconductor integrated circuit is disposed on the front pole holder 22 and the resistance
element 26 is also attached. That is, the terminals of these elements are exposed to the outside
through the holes t'L and nine small holes in the substrate 24 and the protruding part is
connected to the wiring # 1 formed on the substrate 24 by the solder 27. Metal Between the
contact plate 21 and the back electrode plate 18, an impedance conversion element collecting
portion 28 to which the impedance conversion element 2S of the substrate 24 'is transferred
from the metal plate 21 and an air amount 29 divided by 1 are formed. Ru. An air vent 81
communicating with the air chamber 29 and passing through the diaphragm 16 'is formed in the
back fi plate 18 (4). For example, the central portion of the metal plate 21 is pushed out to the
back electrode plate 1811 so that the convex portion R2 is integrated, and the negative contacts
the back electrode plate 18 and electrically KII thickness 1, this metal plate 21 On the other
hand, 1 of impedance conversion element 25! l The control terminal 88 has contact hardness n.
For example, the contact surface with the back electrode plate 8 is a rough surface 84, and the
peripheral portion of the large diameter portion of the holder 22, such as a thick blue pole plate
18 etc. A notch 8S may be formed in -m of the portion to be held, and the air tight 1129 may be
in slight communication with the outside through the uneven surface 84. The conventional
electret microphone is integrated with the back # B111 of the back electrode plate 18 and the air
conditioner / impact element accommodating portion 28 without the presence of the metal plate
21 and the Knosyn 19d that go to the WWJ. Therefore, sometimes the air in the air chamber 28
expands due to the soldering of the solder 27, and this expands the diaphragm 16 through the
vent holes 81 and the feeling I may be distorted Q (5) 2! Because there is no escape place for the
expanded air, it escapes to the outside through the terminal insertion hole of the distribution
board 25, the hole is opened in the solder 27, and the air chamber 28 communicates with the
outside to create air leakage nail, frequency characteristic Sometimes deteriorated. However,
since the electret microphone according to this invention is separated from the air chamber 29ri
impedance conversion element housing s28, the air chamber 29 is affected even if the air inside
thereof is expanded when soldered to the solder 27. No, therefore, the diaphragm 16 does not
swell, and there is no risk that the frequency characteristics will be affected even if air leaks in
the solder 27 because there is no loss of frequency characteristics. .
The contact is given to the terminal to which the solder 27 is attached, and the inspection is
performed, but at that time, the pressure of the air chamber 29 may be affected even if the
storage portion 280 atmospheric pressure is caused by strongly pressing the contact. Therefore,
there is no possibility that the diaphragm 16 is affected and the sensitivity is lost. As described
above, since it does not matter even if it communicates with the impedance cost conversion
element accommodation part 28Fi and (6) O- ? ? 1 part, it is for positioning in the case of
automatically measuring this microphone ? S in the hole It can be used. Since the volume of the
air type 29ri separated from the impedance fluorescent element housing portion 28 is small, the
sensitivity is high up to a high frequency, that is, the extended characteristic of Takatsuka is
obtained and the model number to the frequency characteristic by the cross 14 is As a result, the
cloth may be easily attached and attached, or it may be used as a glaring cloth. Mechanizing this
bonding is also nine years old. Furthermore, the use of the cushion 19 makes it possible to
secure the entire tube sufficiently mechanically by caulking with the capsule 11 utilizing its
elasticity. In particular, the crimping of the end wire provided on the periphery of the outer
surface of the distribution substrate 24 and the capsule 11 can be in good contact with the
portion tW. ?? As shown in this embodiment, by the formation of the uneven surface 84 and
the notch R5, the air in the air chamber 29 can be communicated with the outside from the small
gap by the influence of the leakage of the air (7) to 1). Not 1iIll! ?? Inside, the inside of the air
chamber 29 can be made to follow the outside pressure. The notch 85 may be extended to the
entire outer periphery lii of the Knoshin 1 19. Thus, even if the internal air pressure is increased
due to temperature change, the external air pressure can be made to follow 0
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description, jps54123825
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