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DESCRIPTION JP2009100425

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DESCRIPTION JP2009100425
An object of the present invention is to suppress the generation of an impact sound when an
impact is applied to a microphone. Two containers (15, 16) are fixedly arranged on the same side
of a device substrate (11). The condenser microphones 12 and 14 are fixedly arranged in the
respective containers 15 and 16 with the same surface facing in the same direction. An acoustic
hole 18 is formed in the ceiling plate 15 a of the container 15. An acoustic hole 24 is formed
coaxially with the condenser microphone element 14 from the floor plate 16 b of the container
16 to the device substrate 11. Sound waves are incident from the acoustic holes 18 and 24 to
vibrate the diaphragms 32 and 40 of the condenser microphone elements 12 and 14 in opposite
phases. The impact causes the diaphragms 32, 40 to vibrate in phase with each other. The output
signals of the condenser microphone elements 12 and 14 are subtracted from each other and
output. [Selected figure] Figure 1
Condenser microphone device
[0001]
The present invention relates to an improvement of a condenser microphone device (including an
electret condenser microphone device) and suppresses generation of an impact sound when an
impact is given to the condenser microphone device by hitting the condenser microphone device
on an object or the like.
[0002]
If the microphone device is accidentally hit against an object or the like while using it, the
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diaphragm of the microphone device may vibrate (pick up) due to the impact due to the shock.
As a prior art which suppresses generation | occurrence | production of such an impact sound,
there existed a method of the following patent documents 1 and 2 following. In the method
described in Patent Document 1, the microphone unit portion is moved with respect to the
housing, and when an impact or vibration is applied to the microphone device, the unit portion
moves to absorb the vibration. As a result, vibration of the diaphragm is suppressed and noise is
reduced. The method described in Patent Document 2 incorporates a shock sensor in the
microphone device, and adds an operation such as attenuating the microphone output according
to the output from the shock sensor.
[0003]
JP-A-2006-217003 JP-A-H11-331987
[0004]
If a new structure that moves the microphone unit portion relative to the housing as in the
method described in Patent Document 1, the size of the entire microphone device increases.
The techniques described in Patent Documents 1 and 2 can not cope with thermal noise and
electrical noise. The present invention has been made in view of the above-described point, and it
is a relatively small configuration that can suppress the generation of impact noise against
impact, and can also be configured to suppress thermal noise and electrical noise. Is to provide.
[0005]
According to the first aspect of the present invention, the first and second condenser microphone
elements having the same characteristics, in which the diaphragm and the back plate are
disposed opposite to each other with an appropriate gap, in the same direction in the same
direction, are stored in different housing spaces. The housing space is divided into a space facing
the diaphragm and a space facing the back plate by the first and second condenser microphone
elements, and the housing of the first condenser microphone element is performed. In the
partition dividing the space from the external space, an acoustic hole communicating with the
space on the side facing the back plate of the accommodation space is formed, and the partition
separating the accommodation space of the second condenser microphone element from the
external space is formed. Forming an acoustic hole communicating with the space of the
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accommodation space on the side facing the diaphragm, and setting the difference between the
outputs of the first and second condenser microphone elements Outputs Te, or first to a
difference in subsequent circuit, in which the outputs of the second microphone chip respectively
output.
[0006]
According to the first aspect of the invention, the diaphragms of the first and second condenser
microphone elements vibrate in opposite phase to each other with respect to sound, and
therefore, each element is used alone by taking the difference between the outputs of the two
elements. You will get more power than in the case.
On the other hand, since the diaphragms of both elements vibrate in phase with each other in
response to an impact, by taking the difference between the outputs of both elements, the signals
due to the impact can cancel each other and the generation of an impact sound can be
suppressed. Further, by taking the difference between the outputs of both elements, it is possible
to suppress the generation of the noise because the signals due to the thermal noise and the
electrical noise generated commonly to both elements cancel each other.
[0007]
In the first invention, specifically, for example, the housing spaces of the first and second
condenser microphone elements are respectively constituted by individual containers, and the
respective containers are respectively fixed to the same surface side of the device substrate, The
first and second condenser microphone elements are respectively fixed to the floor plate in each
of the containers in a posture in which the diaphragm side faces the floor plate, and the acoustic
hole on the first condenser microphone element side is the ceiling plate of the containers The
acoustic hole on the side of the second condenser microphone element may be formed from the
floor plate of the container to the device substrate. In this case, the respective containers and the
device substrate are accommodated and arranged in one housing, and acoustic holes
communicating with the respective acoustic holes on the first and second condenser microphone
elements are formed in the housing. Can be configured.
[0008]
According to the second aspect of the present invention, the first and second condenser
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microphone elements having the same characteristics and facing each other, in which the
diaphragm and the back plate are disposed opposite to each other with an appropriate gap, face
each other in different directions. The first and second condenser microphone elements are
respectively divided into a space facing the diaphragm and a space facing the back plate by the
first and second condenser microphone elements. In the partition dividing the storage space from
the external space, acoustic holes communicating with the space on the side facing the back plate
of the storage space are formed respectively, or in the space on the side facing the diaphragm of
the storage space. The communicating acoustic holes are respectively formed, and the outputs of
the first and second condenser microphone elements are summed and output, or the sum is
output in the subsequent stage circuit. First, in which the outputs of the second microphone chip
respectively output in order.
[0009]
According to the second aspect of the invention, the diaphragms of the first and second
condenser microphone elements vibrate in phase with each other with respect to voice. Can also
produce a large output.
On the other hand, since the diaphragms of the two elements vibrate in opposite phases with
respect to an impact, by summing the outputs of the two elements, the signals due to the impact
can cancel each other and the generation of an impact sound can be suppressed.
[0010]
In the second invention, specifically, for example, the housing spaces of the first and second
condenser microphone elements are respectively constituted by individual containers, and the
respective containers are respectively fixed to the same surface side of the device substrate, The
first condenser microphone element is fixed to the floor plate in the container in a posture in
which the diaphragm side faces the floor plate, and the second condenser microphone element is
the ceiling plate in the container, the diaphragm side is the ceiling plate The acoustic hole on the
side of the first condenser microphone element is formed in the ceiling plate of the container,
and the acoustic hole on the side of the second condenser microphone element is the floor plate
of the container from the floor plate of the container. It can be configured to be formed over the
substrate. In this case, the respective containers and the device substrate are accommodated and
arranged in one housing, and acoustic holes communicating with the respective acoustic holes on
the first and second condenser microphone elements are formed in the housing. Can be
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configured.
[0011]
The first and second condenser microphone elements of the present invention can be constituted
by, for example, a MEMS (Micro Electro Mechanical Systems) element, or can be constituted by
assembling individual parts.
[0012]
<< First Embodiment >> A first embodiment of the present invention is shown in FIG.
In FIG. 1, (a) is an elevation view showing an internal structure, a view showing the entire
condenser microphone device in half along the longitudinal direction (cross-sectional view taken
along the line B-B in (b)), (b) It is the top view which shows an internal structure, and AA arrow
sectional drawing of (a), (c) is a top view, (d) is a bottom view. In the condenser microphone
device 10, two containers 15 and 16 are fixedly arranged on the same surface side of one device
substrate 11. Condenser microphone devices 12 and 14 are accommodated and fixedly arranged
in the respective containers 15 and 16, respectively. That is, the two condenser microphone
elements 12 and 14 are fixed on the floor plates 15 b and 16 b of the containers 15 and 16 with
an adhesive or the like, with the same surface directed in the same direction. An acoustic hole 18
is formed in the ceiling plate 15 a of the container 15. The internal space 20 of the container 15
and the external space 22 communicate only through the acoustic hole 18. From the floor plate
16b of the container 16 to the device substrate 11, an acoustic hole 24 (having the acoustic hole
24a on the container 16 side and the acoustic hole 24b on the device substrate 11 coaxial with
the condenser microphone element 14) is formed. . The internal space 26 of the container 16
and the external space 22 communicate only through the acoustic hole 24. When the capacitor
microphone device 10 is mounted on a device such as a mobile telephone terminal, the capacitor
microphone device 10 is mounted so that the acoustic holes 18 and 24 are not closed. Further,
an impedance converter (not shown) is attached to the device substrate 11 (or the impedance
converter can be disposed at a location other than the device substrate 11).
[0013]
The capacitor microphone elements 12 and 14 are configured to have the same structure and
characteristics as each other, and can be formed of, for example, a known silicon microphone
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using a MEMS element. Also in FIG. 1, the case where the condenser microphone elements 12
and 14 are comprised with a silicon microphone is shown. The condenser microphone element
12 comprises a substrate 28 made of silicon or the like. The lower end portion of the substrate
28 is fixed on the floor plate 15 b of the container 15 with an adhesive or the like. An opening
30 in the vertical direction (axial direction) is formed in the substrate 28. The lower end of the
opening 30 is closed by the floor plate 15 b of the container 15. At the upper end portion of the
substrate 28, a diaphragm 32 and a back plate 34 are disposed on the lower side and the upper
side so as to close the opening 30, with an appropriate gap therebetween. At the peripheral
portion of the diaphragm 32, a minute through hole 32a for pressure adjustment is formed. A
plurality of through holes 34 a are formed in the surface of the back plate 34. The acoustic hole
18 of the container 15 is formed coaxially with the condenser microphone element 12 or at a
position deviated from the axis of the condenser microphone element 12. The sound waves in the
external space 22 enter through the acoustic holes 18 and pass through the through holes 34 a
of the back plate 34 to vibrate the diaphragm 32. The internal space 20 is divided by the
condenser microphone element 12 into a space 20 a on the side facing the diaphragm 32 and a
space 20 b on the side facing the back plate 34. The acoustic hole 18 communicates with the
space 20 b on the side facing the back plate 34.
[0014]
The condenser microphone element 14 comprises a substrate 36 made of silicon or the like. The
lower end portion of the substrate 36 is fixed on the floor plate 16 b of the container 16 with an
adhesive or the like. An opening 38 in the vertical direction (axial direction) is formed in the
substrate 36. The lower end of the opening 38 is in coaxial communication with the acoustic hole
24. At the upper end portion of the substrate 36, a diaphragm 40 is disposed on the lower side
so as to close the opening 38, and a back plate 42 is disposed on the upper side so as to be
separated by an appropriate gap. In the peripheral portion of the diaphragm 40, a minute
through hole 40a for pressure adjustment is formed. A plurality of through holes 42 a are
formed in the surface of the back plate 42. The sound waves in the external space 22 enter
through the acoustic holes 24 and vibrate the diaphragm 40. The internal space 26 is partitioned
by the condenser microphone element 14 into a space 26 a on the side facing the diaphragm 40
and a space 26 b on the side facing the back plate 42. The acoustic hole 24 communicates with
the space 26 a on the side facing the diaphragm 40.
[0015]
The operation of the condenser microphone 10 having the above configuration will be described.
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FIG. 2 shows the operation when the sound wave S1 is incident from the outside. At this time, the
sound wave S1 from the outside is made incident to the condenser microphone element 12 from
the acoustic hole 18 and is made incident to the condenser microphone element 14 from the
acoustic hole 24 to vibrate the diaphragms 32 and 40 in opposite phases. . FIG. 3 shows output
signal waveforms of the condenser microphone elements 12 and 14 at this time. Since the
diaphragms 32 and 40 vibrate in opposite phase to each other, the output signal waveforms
become opposite to each other.
[0016]
FIG. 4 shows the operation when an external impact is applied. At this time, since the impact is
applied to the diaphragms 32 and 40 of the condenser microphone elements 12 and 14 in the
same direction, the diaphragms 32 and 40 are displaced in the same direction by inertia due to
the impact and vibrate in the same phase. FIG. 5 shows output signal waveforms of the
condenser microphone elements 12 and 14 at this time. Since the diaphragms 32 and 40 vibrate
in phase with each other by the impact, the output signal waveforms become in phase with each
other.
[0017]
FIG. 6 shows an equivalent circuit of the signal processing circuit of the condenser microphone
10 (the impedance converter is not shown). The output signals of the condenser microphone
elements 12 and 14 are subtracted from each other by the subtractor 44 via an impedance
converter and output. Among the outputs of the condenser microphone elements 12 and 14, a
component due to sound wave is S, a component due to impact is N, and a component due to
thermal noise or electrical noise is n. The components S in the capacitor microphone elements 12
and 14 are in opposite phase to each other, and the components N and n are in phase to each
other, so the outputs of the capacitor microphone elements 12 and 14 are as follows. The output
of the condenser microphone element 12 = + S + N + n The output of the condenser microphone
element 14 = −S + N + n Therefore, the output of the subtractor 44 = + 2S. That is to say, the
sound can be output twice as much as when each of the elements 12 and 14 alone is used, and
shock noise, thermal noise and electrical noise can be canceled out.
[0018]
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The subtractor 44 can be mounted on the device substrate 11 or disposed outside the capacitor
microphone device 10. When the subtractor 44 is mounted on the device substrate 11, the
condenser microphone device 10 outputs the subtraction result. When the subtractor 44 is
disposed outside the condenser microphone device 10, the output signals of the condenser
microphone elements 12 and 14 subjected to impedance conversion are output from the
condenser microphone device 10.
[0019]
Second Embodiment A second embodiment of the present invention is shown in FIG. In FIG. 7, (a)
is an elevation view showing the internal structure, a view showing the entire condenser
microphone device in half along the longitudinal direction (C-C arrow sectional view of (b)), (b) A
top view, (c) is a bottom view. The same reference numerals are used for parts common to the
first embodiment of FIG. In the condenser microphone device 50, two containers 15 and 16 are
fixedly arranged on the same surface side of one device substrate 11. Condenser microphone
devices 12 and 14 are accommodated and fixedly arranged in the respective containers 15 and
16, respectively. That is, the condenser microphone element 12 is fixed on the floor plate 15 b of
the container 15 with an adhesive or the like. An acoustic hole 18 is formed in the ceiling plate
15 a of the container 15. The internal space 20 of the container 15 and the external space 22
communicate only through the acoustic hole 18. In the container 16, the condenser microphone
element 14 is fixed to the ceiling plate 16 a of the container 16 with an adhesive or the like with
the condenser microphone element 12 turned upside down (that is, the same surface faces in the
opposite direction). The acoustic hole 24 (the acoustic hole 24 a on the container 16 side and the
acoustic hole 24 b on the device substrate 11 side of the floor plate 16 b of the container 16 to
the device substrate 11 coaxially with the condenser microphone element 14 or off the axis of
the condenser microphone device 14) Are arranged coaxially). The internal space 26 of the
container 16 and the external space 22 communicate only through the acoustic hole 24. When
the capacitor microphone device 50 is mounted on a device such as a mobile phone terminal, it is
mounted so that the acoustic holes 18 and 24 are not blocked. Further, an impedance converter
(not shown) is attached to the device substrate 11 (or the impedance converter can be disposed
at a location other than the device substrate 11). The same condenser microphone elements 12
and 14 as the condenser microphone elements 12 and 14 of FIG. 1 are used. The internal space
20 is divided by the condenser microphone element 12 into a space 20 a on the side facing the
diaphragm 32 and a space 20 b on the side facing the back plate 34. The acoustic hole 18
communicates with the space 20 b on the side facing the back plate 34. Further, the internal
space 26 is partitioned by the condenser microphone element 14 into a space 26 a on the side
facing the diaphragm 40 and a space 26 b on the side facing the back plate 42. The acoustic hole
24 communicates with the space 26 b on the side facing the back plate 42.
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[0020]
The operation of the condenser microphone device 50 having the above configuration will be
described. FIG. 8 shows the operation when the sound wave S1 is incident from the outside. At
this time, the sound wave S1 from the outside is incident to the condenser microphone element
12 from the acoustic hole 18 and is incident to the condenser microphone element 14 from the
acoustic hole 24 to vibrate the diaphragms 32 and 40 in the same phase. The output signal
waveforms of the condenser microphone elements 12 and 14 at this time are the same as those
in which the waveforms (a) and (b) of FIG. 3 described above are in phase with each other.
[0021]
FIG. 9 shows the operation when an external impact is applied. At this time, since the impact is
applied to the diaphragms 32 and 40 of the condenser microphone elements 12 and 14 in the
same direction, the diaphragms 32 and 40 are displaced in the same direction by inertia due to
the impact and vibrate in opposite phases. The output signal waveforms of the condenser
microphone elements 12 and 14 at this time are the same as the waveforms (a) and (b) of FIG.
[0022]
FIG. 10 shows an equivalent circuit of the signal processing circuit of the capacitor microphone
device 50. As shown in FIG. The output signals of the condenser microphone elements 12 and 14
are mutually added by the adder 52 and output. Assuming that the component due to sound
wave is S, the component due to impact is N, and the component due to thermal noise or
electrical noise is n among the outputs of capacitor microphone elements 12 and 14,
components S are in phase with each other in capacitor microphone elements 12 and 14, Since
the component N is in opposite phase to each other and the component n is in phase to each
other, the outputs of the capacitor microphone elements 12 and 14 are as follows. The output of
the condenser microphone element 12 = + S + N + n The output of the condenser microphone
element 14 = + S−N + n Therefore, the output of the adder 52 = + 2S + 2n. That is, an output
twice as high as that obtained by using each of the elements 12 and 14 alone is obtained. Also,
thermal noise and electrical noise remain, but the shock noise is canceled.
[0023]
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The adder 52 can be mounted on the device substrate 11 or disposed outside the capacitor
microphone device 10. When the adder 52 is mounted on the device substrate 11, the capacitor
microphone device 10 outputs the addition result. When the adder 52 is disposed outside the
capacitor microphone device 10, the output signals of the capacitor microphone elements 12 and
14 subjected to impedance conversion are respectively output from the capacitor microphone
device 10.
[0024]
Third Embodiment A third embodiment of the present invention is shown in FIG. The same
reference numerals as in the first and second embodiments shown in FIGS. 1 and 7 denote the
same parts. In this condenser microphone device 60, both condenser microphone elements 12
and 14 are fixedly arranged on the ceiling plates 15a and 16a of the containers 15 and 16 with
the same surface directed in the same direction. An acoustic hole 18 on the condenser
microphone element 12 side (having the acoustic hole 18a on the container 15 side and the
acoustic hole 18b on the device substrate 11 coaxially arranged) is formed from the floor plate
15b of the container 15 to the device substrate 11. The acoustic hole 18 communicates with the
space 20 b on the side facing the back plate 34. The acoustic hole 24 on the side of the
condenser microphone element 14 is formed coaxially with the condenser microphone element
14 at the center of the ceiling plate 16 a of the container 16. According to this condenser
microphone device 60, the diaphragms 32, 40 of the condenser microphone elements 12, 14
vibrate in opposite phases with respect to sound waves, and vibrate in phase with each other
with respect to impact. Therefore, the outputs of the condenser microphone elements 12 and 14
become the same as those of the first embodiment (waveforms of FIGS. 3 and 5), and can be
processed by the circuit of FIG. 6 described above. The acoustic hole 24 communicates with the
space 26 a on the side facing the diaphragm 40.
[0025]
Fourth Preferred Embodiment A fourth preferred embodiment of the present invention is shown
in FIG. The same reference numerals as in the first, second, and third embodiments of FIGS. 1, 7,
and 11 denote the same parts. In the condenser microphone device 70, the condenser
microphone element 12 is fixed to the floor plate 15 b in the container 15, and the condenser
microphone element 14 is fixed to the ceiling plate 16 a in the container 16. That is, the
condenser microphone elements 12 and 14 are disposed with the same surface facing in the
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opposite direction. The acoustic hole 18 on the condenser microphone element 12 side (the
acoustic hole 18 a on the container 15 side and the acoustic hole 18 b on the device substrate 11
are coaxially arranged) is coaxial with the condenser microphone element 12 from the floor plate
15 b of the container 15 to the device substrate 11 Is formed. The acoustic hole 18
communicates with the space 20 a on the side facing the diaphragm 32. The acoustic hole 24 on
the side of the condenser microphone element 14 is formed coaxially with the condenser
microphone element 14 at the center of the ceiling plate 16 a of the container 16. The acoustic
hole 24 communicates with the space 26 a on the side facing the diaphragm 40. According to
this condenser microphone device 70, the diaphragms 32 and 40 of the condenser microphone
elements 12 and 14 vibrate in phase with each other with respect to sound waves, and vibrate in
opposite phases with respect to impact. Therefore, the outputs of the condenser microphone
elements 12 and 14 become the same as those of the second embodiment, and can be processed
by the circuit of FIG. 10 described above.
[0026]
Implementation Example An implementation example of the condenser microphone device of the
present invention is shown in FIG. This is a condenser microphone device of the type of the
second embodiment (FIG. 7). (A) is a cross-sectional elevation view which shows an internal
structure, (b) is a top view. The same reference numerals are used for parts common to FIG. The
condenser microphone device 80 fixes and supports the device substrate 11 on the support legs
84 installed on the floor plate 82 b in the housing 82. The container 15 is attached and fixed on
the substrate 11 by solder 86, and the container 16 is attached and fixed by solder 88. The
solder 86 constitutes a wire connecting the capacitor microphone element 12 housed and fixed
in the container 15 and a wire (not shown) formed on the device substrate 11. The solder 88
constitutes a wire connecting the capacitor microphone element 14 housed and fixed in the
container 16 and a wire (not shown) formed on the device substrate 11. The wiring of the device
substrate 11 is connected to the wiring (not shown) outside the housing 82. The impedance
converter can be disposed on the device substrate 11 within the housing 82. Alternatively, the
impedance converter can be disposed outside the housing 82.
[0027]
An acoustic hole 90 is formed in the ceiling plate 82 a of the housing 82 coaxially with the
acoustic hole 18 formed in the ceiling plate 15 a of the container 15. A rubber O-ring 92 is
sandwiched between the ceiling plate 82 a of the housing 82 and the ceiling plate 15 a of the
container 15 so as to surround the acoustic holes 18 and 90. Thus, the acoustic holes 18 and 90
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communicate with each other, and the sound waves in the external space 22 entering from the
acoustic hole 90 enter the internal space 20 of the container 15 through the acoustic holes 18
and vibrate the diaphragm 32 of the condenser microphone element 12 .
[0028]
The floor plate 82b of the housing 82 is coaxial with the acoustic hole 24 (the acoustic hole 24a
on the container 16 side and the acoustic hole 24b on the device substrate 11 are coaxially
formed) formed from the floor plate 16b of the container 16 to the device substrate 11 An
acoustic hole 94 is formed in A solder seal 96 is mounted between the floor plate 16a of the
container 16 and the device substrate 11 so as to surround the acoustic holes 24a and 24b.
Further, a rubber O-ring 98 is sandwiched between the device substrate 11 and the floor plate
82 b of the housing 82 so as to surround the acoustic holes 24 b and 94. Thereby, the acoustic
holes 24a, 24b, 94 communicate with each other, and the sound waves in the external space 22
entering from the acoustic hole 94 enter the internal space 26 of the container 16 through the
acoustic holes 24b, 24a, and the diaphragm of the condenser microphone element 14 Vibrate 40.
[0029]
Although the condenser microphone elements 12 and 14 are disposed on the same surface side
of the device substrate 11 in the above-described embodiments, they may be disposed on the
opposite surface sides of the device substrate 11. Also in this case, the condenser microphone
elements 12 and 14 are fixed to the ceiling plates 15a and 16a of the containers 15 and 16 or to
the floor plates 15b and 16b of the containers 15 and 16, and the acoustic holes 18 and 24 are
fixed to the containers 15 and 16 Various combinations are possible such as forming from the
floor plates 15 b and 16 b to the device substrate 11 or forming the container 15 and 16 on the
ceiling plates 15 a and 16 a side. In each of the above embodiments, the containers 15 and 16
are separately provided for each of the condenser microphone elements 12 and 14. However,
one container is provided and a partition is provided therein to form two internal spaces, and the
respective internal spaces are provided. The condenser microphone elements 12 and 14 can be
accommodated in each of the above.
[0030]
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In each of the above-described embodiments, the housing spaces 20 and 26 of the condenser
microphone elements 12 and 14 are configured by only the containers 15 and 16, but the
present invention is not limited to this. For example, the floor plates 15b and 16b of the
containers 15 and 16 are eliminated and the portion is opened, and the opened lower end
surfaces of the containers 15 and 16 are airtightly joined to the device substrate 11 to form the
containers 15 and 16 and the device substrate 11 And the housing spaces 20 and 26 can be
configured. In this case, the condenser microphone elements bonded and fixed to the floor plates
15b and 16b of the containers 15 and 16 in the respective embodiments (both the elements 12
and 14 in FIG. 1, the element 12 in FIG. In FIG. 12, the element 12) is adhesively fixed directly
onto the device substrate 11.
[0031]
BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows Embodiment 1 of this
invention, (a) is a cross-sectional elevation view which shows an internal structure, (b) is a crosssectional top view which shows an internal structure, (c) is a top view, (d) is a bottom view. It is.
It is a schematic diagram which shows operation | movement of a diaphragm when sound wave
S1 injects into the condenser microphone apparatus 10 of FIG. 1 from the exterior. FIG. 5 is an
output signal waveform diagram of capacitor microphone elements 12 and 14 according to the
operation of FIG. 2. It is a schematic diagram which shows operation | movement of a diaphragm
when an impact is added to the condenser microphone apparatus 10 of FIG. 1 from the outside.
FIG. 5 is an output signal waveform diagram of capacitor microphone elements 12 and 14
according to the operation of FIG. 4. It is an equivalent circuit schematic of the signal processing
circuit of the capacitor microphone apparatus 10 of FIG. It is a figure which shows Embodiment
2 of this invention, (a) is a cross-sectional elevation view which shows an internal structure, (b) is
a top view, (c) is a bottom view. It is a schematic diagram which shows the operation | movement
of a diaphragm when sound wave S1 injects into the condenser microphone apparatus 50 of FIG.
7 from the exterior. It is a schematic diagram which shows operation | movement of a diaphragm
when an impact is added to the capacitor microphone apparatus 50 of FIG. 7 from the outside. It
is an equivalent circuit schematic of the signal processing circuit of the capacitor microphone
apparatus 50 of FIG. It is a cross-sectional elevation view which shows the internal structure of
Embodiment 3 of this invention. It is a cross-sectional elevation view which shows the internal
structure of Embodiment 4 of this invention. It is a figure which shows the example of mounting
of the capacitor | condenser microphone apparatus of the type of Embodiment 2 (FIG. 7), (a) is a
cross-sectional elevation view which shows an internal structure, (b) is a top view.
Explanation of sign
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[0032]
10, 50, 60, 70, 80: condenser microphone device, 11: device substrate, 12, 14: condenser
microphone element, 15, 16: container, 15a, 16a: container ceiling plate, 15b, 16b: container
floor plate, 18, 24 (24a, 24b) ... acoustic hole, 20, 26 ... accommodation space (internal space),
20a, 26a ... space on the side facing the diaphragm, 20b, 26b ... space on the side facing the back
plate, 22 ... outside space 32, 40 ... diaphragm, 34, 42 ... back plate, 44 ... subtractor, 52 ... adder,
82 ... housing, 90, 92 ... acoustic hole in the housing
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