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DESCRIPTION JP2012217029

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DESCRIPTION JP2012217029
An object of the present invention is to prevent the loss of polarization characteristics of a
piezoelectric body when driving an oscillation device having a piezoelectric vibrator, and to
improve the reliability of an electronic device. A vibrating member (20) includes a piezoelectric
vibrator (10) having a polarized piezoelectric body, a vibrating member (20) for restraining the
piezoelectric vibrator (10) on one side, and a support member (30) for holding an edge of the
vibrating member (20). Is formed by a film 22 made of a liquid crystal material on one side and a
film 24 made of a metal material on the other side opposite to the one side, and the phase
transition temperature of the liquid crystal material between the crystalline state and the liquid
crystalline state Is lower than the temperature at which the piezoelectric body depolarizes.
[Selected figure] Figure 1
Oscillator, method of manufacturing oscillator, and electronic device
[0001]
The present invention relates to an oscillation device, a method of manufacturing the oscillation
device, and an electronic device.
[0002]
In the electronic device, it is important to improve the reliability of the electronic device from the
viewpoint of improving the heat resistance, the thermal diffusion and the like.
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1
For example, the technology described in Patent Document 1 is to improve the adhesion between
the housing and the package and the heat resistance of the semiconductor device by using a
liquid crystal polymer for the package of the semiconductor device. Patent Document 2 discloses
a technique relating to a thermally conductive polymer composition containing a liquid crystal
polymer
[0003]
The techniques described in Patent Documents 3 to 5 relate to an oscillator. In particular, the
techniques described in Patent Literatures 4 and 5 relate to suppressing the characteristic
deterioration due to heat load in the oscillation devices having the piezoelectric vibrators
described in Patent Literatures 3 and 4.
[0004]
In addition, as a technique regarding an oscillation device, there are, for example, those described
in Patent Documents 6-8. The technology described in Patent Document 6 relates to a
piezoelectric electroacoustic transducer using a liquid crystal polymer as a vibrating film. The
technique described in Patent Document 7 is to form an elastic conductive material on the upper
and lower surfaces of the piezoelectric diaphragm. The technique described in Patent Document
8 is to provide a single diaphragm on a plurality of ultrasonic elements. Moreover, as a technique
regarding a piezoelectric element, there also exists a thing regarding the ultrasonic delay line
described, for example in patent document 9. FIG.
[0005]
JP, 2003-133484, A JP, 2010-525145, A JP, 2008-218953, A real opening Sho 58-30,399, JP,
1-270492, A JP, 2-171100, A JP, 2010-124099, A JP, 2007-215119, A JP, 61-139, 113 A
[0006]
In an electronic device internally having an oscillation device having a piezoelectric vibrator,
when it is driven, it receives a heat load due to heat generation of the piezoelectric vibrator or the
like, and the polarization of the piezoelectric material constituting the piezoelectric vibrator is
lost (depolarization ) May be.
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In addition, in the manufacture of the oscillation device having the piezoelectric vibrator, when
forming a terminal on the electrode of the piezoelectric vibrator by, for example, soldering or
spot welding, a thermal load may be applied to the piezoelectric body constituting the
piezoelectric vibrator. Also in this case, the polarization characteristics of the piezoelectric body
may be lost. As a result, the reliability of the electronic device having the oscillation device is
impaired.
[0007]
The present invention improves the reliability of electronic devices by preventing the loss of the
polarization characteristics of the piezoelectric body when driving the oscillation device having
the piezoelectric vibrator or in the manufacturing process of the oscillation device having the
piezoelectric vibrator. The purpose is to
[0008]
According to the present invention, a piezoelectric vibrator having a polarized piezoelectric body,
a vibrating member which holds the piezoelectric vibrator on one surface, and a support member
which holds an edge of the vibrating member, the vibrating member The one surface side is
formed of a film made of a liquid crystal material, and the other surface side opposite to the one
surface is formed of a film made of a metal material, and the liquid crystal material has a phase
transition temperature between a crystalline state and a liquid crystalline state. An oscillator is
provided that is lower than the temperature at which the piezoelectric body depolarizes.
[0009]
Further, according to the present invention, a step of forming a heat dissipation film having an
opening for exposing a part of the electrode on the electrode of the piezoelectric vibrator and the
piezoelectric vibrator having the electrode provided on the piezoelectric body; A method of
manufacturing an oscillation device is provided, comprising the steps of: forming a terminal for
connecting the electrode to the outside on the electrode exposed from the opening of the heat
dissipation film; and removing the heat dissipation film.
[0010]
Further, according to the present invention, it comprises: a casing having an oscillation device
inside; and a film made of a liquid crystal material provided on the inner surface of the casing
and in contact with a portion facing the oscillation device. The oscillation device includes a
piezoelectric vibrator having a polarized piezoelectric body, and an electron whose phase
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transition temperature between a crystalline state and a liquid crystal state of the liquid crystal
material is lower than a temperature at which the piezoelectric body is depolarized Equipment is
provided.
[0011]
The present invention improves the reliability of electronic devices by preventing the loss of the
polarization characteristics of the piezoelectric body when driving the oscillation device having
the piezoelectric vibrator or in the manufacturing process of the oscillation device having the
piezoelectric vibrator. It can be done.
[0012]
FIG. 2 is a cross-sectional view showing an oscillation device according to the present
embodiment.
FIG. 7 is a cross-sectional view showing an oscillator according to a first modification of the
oscillator shown in FIG. 1;
It is sectional drawing which shows the oscillator which concerns on the 2nd modification of the
oscillator shown in FIG.
It is sectional drawing which shows the piezoelectric vibrator shown in FIG.
FIG. 7 is a cross-sectional view showing the method of manufacturing the oscillator shown in FIG.
1;
It is sectional drawing which shows the electronic device which has an oscillation apparatus
shown in FIG. It is sectional drawing which shows the electronic device which concerns on the
modification of the electronic device shown in FIG.
[0013]
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Hereinafter, embodiments of the present invention will be described with reference to the
drawings. In all the drawings, the same components are denoted by the same reference numerals,
and the description thereof will be appropriately omitted.
[0014]
FIG. 1 is a cross-sectional view showing an oscillation device 100 according to the present
embodiment. The oscillation device 100 includes the piezoelectric vibrator 10, the vibration
member 20, and the support member 30. The oscillation device 100 is mounted on an electronic
device such as a mobile phone, for example.
[0015]
The piezoelectric vibrator 10 has a polarized piezoelectric body. The vibrating member 20
restrains the piezoelectric vibrator 10 on one side. The support member 30 supports the edge of
the vibrating member 20. The vibrating member 20 is constituted by a film 22 made of a liquid
crystal material on one side and a film 24 made of a metal material on the other side opposite to
the one side. The phase transition temperature between the crystalline state and the liquid
crystal state of the liquid crystal material constituting the film 22 is lower than the temperature
at which the piezoelectric body depolarizes. Hereinafter, the configuration and the like of the
oscillation device 100 will be described in detail.
[0016]
The piezoelectric vibrator 10 is constrained to the vibrating member 20 via, for example, an
elastic member 26.
[0017]
The liquid crystal material constituting the film 22 is, for example, a phenylcyclohexane type, a
cyclohexane type, a phenyl pyridin type, a dioxane dielectric, or a polymer liquid crystal material.
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The liquid crystal material constituting the film 22 has a crystalline state at normal temperature.
Then, the heat generated from the piezoelectric vibrator 10 is absorbed when the oscillation
device 100 is driven, and the phase transition from the crystalline state to the liquid crystal state
occurs. The liquid crystal material constituting the film 22 can absorb the heat generated from
the piezoelectric vibrator 10 by the heat absorption effect due to the heat of solution at the time
of the phase transition from the crystalline state to the liquid crystal state. Further, the liquid
crystal material constituting the film 22 can efficiently diffuse the heat absorbed from the
piezoelectric vibrator 10 to the outside by the flow characteristic in the liquid crystal state.
[0018]
The phase transition temperature between the crystalline state and the liquid crystal state of the
liquid crystal material constituting the film 22 is lower than the temperature at which the
piezoelectric body depolarizes. Therefore, the temperature of the piezoelectric vibrator 10 can be
suppressed from rising to the temperature at which the piezoelectric body depolarizes.
[0019]
The liquid crystal material constituting the film 22 in the present embodiment is designed to
support the piezoelectric vibrator 10 and the elastic member 26 and maintain the rigidity to the
extent of functioning as a vibrating member when the oscillation device 100 is driven. Ru.
[0020]
The heat absorbed by the film 22 from the piezoelectric vibrator 10 is transferred to the film 24
made of a metal material having high thermal conductivity, and emitted from the interface
between the film 24 and air.
Thereby, the heat diffusion from the oscillation device 100 can be effectively performed. In
addition, the film 24 made of a metal material has a high elastic modulus as compared with the
film 22 made of a liquid crystal material. Therefore, it is possible to realize the vibrating member
20 having sufficient strength to withstand the vibration generated at the time of driving the
oscillation device 100.
[0021]
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FIG. 2 is a cross-sectional view showing an oscillation device 102 according to a first
modification of the oscillation device 100 shown in FIG. The oscillation device 102 has the same
configuration as the oscillation device 100 except that it has a film 28 made of a liquid crystal
material provided on the piezoelectric vibrator 10 as shown in FIG. As the liquid crystal material
constituting the film 28, the same one as the film 22 can be used. The heat generated from the
piezoelectric vibrator 10 can be absorbed by utilizing the heat absorption effect of the heat of
solution in the phase transition from the crystalline state to the liquid crystal state of the liquid
crystal material constituting the film 28.
[0022]
FIG. 3 is a cross-sectional view showing an oscillation device 104 according to a second
modification of the oscillation device 100 shown in FIG. As shown in FIG. 3, the oscillating device
104 is the oscillating device 100 except that one surface side of the vibrating member 20 is
formed by the film 24 made of a metal material and the other surface side is formed by the film
22 made of a liquid crystal material. It has the same configuration as that of Also in this case, the
heat generated from the piezoelectric vibrator 10 is transferred to the film 22 made of a liquid
crystal material through the film 24 made of a metal material having high thermal conductivity.
Then, the heat generated from the piezoelectric vibrator 10 can be absorbed by utilizing the heat
absorption effect of the heat of solution when the liquid crystal material constituting the film 22
transitions from the crystalline state to the liquid crystal state.
[0023]
FIG. 4 is a cross-sectional view showing the piezoelectric vibrator 10 shown in FIG. As shown in
FIG. 4, the piezoelectric vibrator 10 has a piezoelectric body 70, an upper electrode 72 and a
lower electrode 74. The piezoelectric body 70 is sandwiched between the upper electrode 72 and
the lower electrode 74. The piezoelectric body 70 is polarized in the thickness direction (vertical
direction in FIG. 4). The piezoelectric vibrator 10 has, for example, a circular shape or an
elliptical shape in a plane direction parallel to one surface of the vibrating member 20.
[0024]
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The piezoelectric body 70 is made of a material having a piezoelectric effect, and is made of, for
example, lead zirconate titanate (PZT) or barium titanate (BaTiO 3) as a material having high
electromechanical conversion efficiency. The thickness of the piezoelectric body 70 is preferably
10 μm to 1 mm. When the thickness is less than 10 μm, since the piezoelectric body 70 is
made of a brittle material, breakage or the like is likely to occur during handling. On the other
hand, when the thickness exceeds 1 mm, the electric field strength of the piezoelectric body 70 is
reduced. This leads to a decrease in energy conversion efficiency. The thermal conductivity of the
piezoelectric body 70 is, for example, 5 to 20 W / mK.
[0025]
The upper electrode 72 and the lower electrode 74 are made of a material having electrical
conductivity, such as silver or silver / palladium alloy. Silver is a general purpose material with
low resistance, and is advantageous in terms of manufacturing cost and manufacturing process.
In addition, a silver / palladium alloy is a low resistance material excellent in oxidation resistance
and excellent in reliability. The thickness of the upper electrode 72 and the lower electrode 74 is
preferably 1 to 50 μm. If the thickness is less than 1 μm, uniform molding becomes difficult.
On the other hand, if it exceeds 50 μm, the upper electrode 72 or the lower electrode 74
becomes a constraining surface with respect to the piezoelectric body 70, resulting in a decrease
in energy conversion efficiency. The thermal conductivity of the upper electrode 72 and the
lower electrode 74 is, for example, 420 W / mK.
[0026]
FIG. 5 is a cross-sectional view showing the method of manufacturing the oscillation device 100.
As shown in FIG. Specifically, the process of forming the terminal 86 on the piezoelectric vibrator
10 is shown. In the method of manufacturing the oscillation device 100 shown in FIG. 5, an
opening for exposing a part of the upper electrode 72 on the upper electrode 72 of the
piezoelectric vibrator 10 having the piezoelectric body 70 and the upper electrode 72 provided
on the piezoelectric body 70. Removing the heat dissipation film 80, forming a terminal 86 for
connecting the upper electrode 72 to the outside on the upper electrode 72 exposed from the
opening 84 of the heat dissipation film 80; And a process of Hereinafter, a method of
manufacturing the oscillation device 100 shown in FIG. 5 will be described in detail.
[0027]
First, as shown in FIG. 5A, an opening for exposing a portion of the upper electrode 72 on the
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upper electrode 72 of the piezoelectric vibrator 10 having the piezoelectric body 70 and the
upper electrode 72 provided on the piezoelectric body 70 A heat dissipation film 80 having 84 is
formed.
[0028]
For the heat dissipation film 80, for example, a material such as copper, aluminum or carbon
fiber having high thermal conductivity with respect to the piezoelectric ceramic can be used.
In this case, the amount of heat applied to the upper electrode 72 can be effectively transferred
to the heat dissipation film 80 by the formation of the terminal 86 as described later. The
thermal conductivity of the heat dissipation film 80 is, for example, 380 W / mK. The film
thickness of the heat dissipation film 80 can be, for example, larger than the film thickness of the
piezoelectric vibrator 10, and is, for example, 200 μm. Thermal conductivity depends on the
thickness of the material. Therefore, when the film thickness of the heat dissipation film 80 is
larger than the film thickness of the piezoelectric vibrator 10, the heat amount applied to the
upper electrode 72 due to the formation of the terminal 86 can be concentrated to the heat
dissipation film 80 as described later. .
[0029]
Further, in the present embodiment, as shown in FIG. 5A, a heat transport film having an opening
85 for exposing a part of the upper electrode 72 on the upper electrode 72 prior to the step of
forming the heat dissipation film 80 82 is provided. In this case, in the step of forming the heat
dissipation film 80, the heat dissipation film 80 is formed on the upper electrode 72 via the heat
transport film 82 so that the opening 84 of the heat dissipation film 80 overlaps the opening 85
of the heat transport film 82 in plan view. It is formed. At this time, a part of the upper electrode
72 is exposed from the opening composed of the opening 85 of the heat transport film 82 and
the opening 84 of the heat dissipation film 80.
[0030]
The heat transport film 82 is made of, for example, silicone grease or the like. Since the heat
dissipation film 80 is in contact with the upper electrode 72 via the heat transport film 82, the
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heat load applied to the upper electrode 72 can be efficiently transferred to the heat dissipation
film 80. The film thickness of the heat transport film 82 is, for example, 5 μm. The thermal
conductivity of the heat transport film 82 is, for example, 5 W / mK.
[0031]
Next, as shown in FIG. 5B, on the upper electrode 72 exposed from the opening 84 of the heat
dissipation film 80, a terminal 86 for connecting the upper electrode 72 to the outside is formed.
The terminal 86 is bonded onto the upper electrode 72 by, for example, soldering or spot
welding.
[0032]
Since the heat dissipation film 80 is provided on the upper electrode 72, the amount of heat
applied to the upper electrode 72 at the time of formation of the terminal 86 moves to the heat
dissipation film 80. Thus, the heat load applied to the piezoelectric body 70 can be reduced when
the terminal 86 is formed.
[0033]
Next, as shown in FIG. 5C, the heat dissipation film 80 is removed. At this time, the heat transport
film 82 is removed together with the heat radiation film 80 in the present embodiment. Thereby,
the piezoelectric vibrator 10 in which the terminal 86 is formed can be obtained.
[0034]
Although the process of forming the terminal 86 on the upper electrode 72 is described in the
present embodiment, the terminal can be formed on the lower electrode 74 in the same process.
[0035]
As shown in FIG. 1, the oscillation device 100 includes a control unit 90 and a signal generation
unit 92.
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The signal generation unit 92 is connected to the piezoelectric vibrator 10 and generates an
electric signal to be input to the piezoelectric vibrator 10. The control unit 90 is connected to the
signal generation unit 92, and controls the generation of the signal by the signal generation unit
92. The control unit 90 controls the generation of the signal of the signal generation unit 92
based on the information input from the outside, whereby the output of the oscillation device
100 can be controlled.
[0036]
When using the oscillation device 100 as a parametric speaker, the control unit 90 inputs a
modulation signal as a parametric speaker via the signal generation unit 92. In this case, the
piezoelectric vibrator 10 uses a sound wave of 20 kHz or more, for example, 100 kHz as the
transport wave of the signal. When the oscillation device 100 is used as a normal speaker, the
control unit 90 may directly input an audio signal to the piezoelectric vibrator 10 via the signal
generation unit 92. Moreover, when using the oscillation apparatus 100 as a sound wave sensor,
the signal input into the control part 90 is a command signal to the effect of oscillating a sound
wave. When the oscillation device 100 is used as a sound wave sensor, the signal generation unit
92 causes the piezoelectric vibrator 10 to generate a sound wave of the resonance frequency of
the piezoelectric vibrator 10.
[0037]
FIG. 6 is a cross-sectional view showing an electronic device 200 having the oscillation device
100 shown in FIG. The electronic device 200 includes a case 40 having the oscillation device 100
inside, and a film 42 made of a liquid crystal material provided on the inner surface of the case
40 and in contact with a portion facing the oscillation device 100. ing. The phase transition
temperature between the crystalline state and the liquid crystal state of the liquid crystal material
constituting the film 42 is lower than the temperature at which the piezoelectric substance
constituting the piezoelectric vibrator 10 depolarizes. As shown in FIG. 6, a plurality of electronic
components 202 including the oscillation device 100 are provided in the housing 40.
[0038]
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The housing 40 is made of, for example, a resin material. The housing 40 can also be made of a
metal material. The film 42 is provided, for example, on the entire inner surface of the housing
40 as shown in FIG. The housing 40 and the film 42 provided to be in contact with the inner
surface of the housing 40 constitute a housing structure of the electronic device 200.
[0039]
The liquid crystal material constituting the film 42 is, for example, a phenylcyclohexane type, a
cyclohexane type, a phenyl pyridin type, a dioxane dielectric, or a polymer liquid crystal material.
The liquid crystal material constituting the film 42 has a crystalline state at normal temperature.
Then, when the electronic device 200 is driven, the heat generated from the electronic
component 202 including the oscillation device 100 is absorbed, and the phase transition from
the crystalline state to the liquid crystal state occurs.
[0040]
The liquid crystal material constituting the film 42 can absorb the heat generated from the
electronic component 202 due to the heat absorption effect due to the heat of solution at the
time of the phase transition from the crystalline state to the liquid crystal state. Thereby, the
temperature rise inside the electronic device 200 can be suppressed. Further, the heat
conductivity of the case structure including the case 40 and the film 42 is increased due to the
heat absorption effect of the liquid crystal material forming the film 42. Therefore, even if the
thickness of the housing structure is reduced, heat can be efficiently diffused from the inside of
the electronic device 200 to the outside. Thereby, the temperature rise inside the electronic
device 200 can be suppressed.
[0041]
The phase transition temperature between the crystalline state and the liquid crystal state of the
liquid crystal material constituting the film 42 is lower than the temperature at which the
piezoelectric substance constituting the piezoelectric vibrator 10 depolarizes. Therefore, the
temperature of the piezoelectric vibrator 10 can be suppressed from rising to the temperature at
which the piezoelectric body depolarizes.
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[0042]
Further, since the thermal conductivity of the housing structure can be increased, sufficient heat
diffusion from the inside to the outside of the electronic device 200 can be performed even if a
resin material having a thermal conductivity lower than that of a metal material or the like is
used. Can. When a resin material is used for the housing 40 of the electronic device 200, the
weight of the electronic device 200 can be reduced, and problems such as electromagnetic
interference can be avoided.
[0043]
FIG. 7 is a cross-sectional view showing an electronic device 201 according to a modification of
the electronic device 200 shown in FIG. As shown in FIG. 6, the electronic device 200 may have a
film 44 provided on a portion of the film 42 made of a liquid crystal material facing the
oscillation device 100.
[0044]
The film 44 is made of, for example, a metal material having a thermal conductivity higher than
that of the liquid crystal material. By providing the film 44 made of a metal material on the film
42 and between the film 42 and the electronic component 202, it is possible to effectively
transfer the heat emitted from the electronic component 202 to the film 42. .
[0045]
Next, the effects of the present embodiment will be described. In an oscillation device having a
piezoelectric vibrator, by applying a voltage to electrodes provided on both sides of a polarized
piezoelectric material, sound waves are output using the piezoelectric effect of the piezoelectric
material. However, if the heat load due to the heat generation of the piezoelectric vibrator is
received during driving of the oscillation device, the polarization characteristics of the
piezoelectric body may be lost.
[0046]
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According to the present embodiment, the vibrating member 20 for restraining the piezoelectric
vibrator 10 having the polarized piezoelectric material is constituted by the film 22 made of a
liquid crystal material on one side and the film 24 made of a metal material on the other side.
ing. The phase transition temperature between the crystalline state and the liquid crystal state of
the liquid crystal material constituting the film 22 is lower than the temperature at which the
piezoelectric body is depolarized. The liquid crystal material constituting the film 22 can absorb
the heat generated from the piezoelectric vibrator 10 by the heat absorption effect due to the
heat of solution at the time of the phase transition from the crystalline state to the liquid crystal
state. Then, the heat absorbed by the film 22 from the piezoelectric vibrator 10 is transferred to
the film 24 made of a metal material having high thermal conductivity, and is radiated from the
interface between the film 24 and air. Thus, the thermal diffusion from the oscillation device 100
can be effectively performed. In addition, the phase transition temperature between the
crystalline state and the liquid crystal state of the liquid crystal material constituting the film 22
is lower than the temperature at which the piezoelectric body is depolarized. Therefore, the
temperature of the piezoelectric vibrator 10 can be suppressed from rising to the temperature at
which the piezoelectric body depolarizes. As a result, it is possible to suppress the loss of the
polarization characteristics of the piezoelectric body. Therefore, the reliability of the electronic
device having the oscillation device can be improved.
[0047]
In addition, in the manufacture of the oscillation device, the polarization characteristics of the
piezoelectric body may be lost due to the heat load due to solder or spot welding when forming
the terminal on the electrode.
[0048]
According to the present embodiment, in the manufacture of the oscillation device having the
piezoelectric vibrator, the step of forming the heat dissipation film 80 having the opening 84 on
the electrode provided on the piezoelectric body 70 and the exposure from the opening 84 of the
heat dissipation film 80 Forming a terminal 86 on the formed electrode.
Since the heat dissipation film 80 is provided on the electrode, the amount of heat applied to the
electrode when forming the terminal 86 moves to the heat dissipation film 80. Thus, the heat
load applied to the piezoelectric body 70 can be reduced when the terminal 86 is formed.
Therefore, it is possible to prevent the polarization characteristic of the piezoelectric body from
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being lost in the manufacturing process of the oscillation device, and to improve the reliability of
the oscillation device.
[0049]
In addition, in an electronic device internally having an oscillation device or the like having a
piezoelectric vibrator, the polarization characteristic of the piezoelectric body constituting the
piezoelectric vibrator is lost due to heat load due to heat generation of the piezoelectric vibrator
or the like during driving thereof. There is a possibility that
[0050]
According to the present embodiment, the film 42 made of a liquid crystal material is formed to
be in contact with the inner surface of the casing 40 having the oscillation device 100 inside, and
the portion facing the oscillation device 100.
The phase transition temperature between the crystalline state and the liquid crystal state of the
liquid crystal material constituting the film 42 is lower than the temperature at which the
piezoelectric body is depolarized. The liquid crystal material constituting the film 42 can absorb
the heat generated from the electronic component 202 due to the heat absorption effect due to
the heat of solution at the time of the phase transition from the crystalline state to the liquid
crystal state. Thereby, the temperature rise inside the electronic device 200 can be suppressed.
In addition, the phase transition temperature between the crystalline state and the liquid crystal
state of the liquid crystal material constituting the film 42 is lower than the temperature at which
the piezoelectric body depolarizes. Therefore, the temperature of the piezoelectric vibrator 10
can be suppressed from rising to the temperature at which the piezoelectric body depolarizes. As
a result, it is possible to suppress the loss of the polarization characteristics of the piezoelectric
body. Therefore, the reliability of the electronic device can be improved.
[0051]
Although the embodiments of the present invention have been described above with reference to
the drawings, these are merely examples of the present invention, and various configurations
other than the above can also be adopted.
[0052]
DESCRIPTION OF SYMBOLS 10 piezoelectric vibrator 20 vibration member 22 film 24 film 26
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elastic member 28 film 30 support member 40 housing 42 film 44 film 70 piezoelectric body 72
upper electrode 74 lower electrode 80 heat dissipation film 82 heat transport film 84 opening
85 opening 86 terminal 90 control Unit 92 Signal generation unit 100 Oscillator 102 Oscillator
104 Oscillator 200 Electronic device 201 Electronic device 202 Electronic component
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