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DESCRIPTION JP2014187708

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DESCRIPTION JP2014187708
Abstract: In a voice coil speaker including a bobbin in which a multilayer voice coil is formed, a
voice coil speaker in which the bobbin and a circuit board are appropriately disposed is provided.
SOLUTION: A voice coil is processed in front of a diaphragm 24 in a voice coil speaker 1
provided with a bobbin 21 in which a multilayer voice coil 22 is formed in a speaker main body
11, and a diaphragm 24 connected to the bobbin 21. The audio signal processing circuit board
32 is disposed, and a plurality of output terminals 60 for outputting to the multi-layered voice
coil 22 are arranged in the circumferential direction of the audio signal processing circuit board
32. [Selected figure] Figure 1
ボイスコイルスピーカー
[0001]
The present invention relates to a voice coil speaker provided with a bobbin in which a multilayer
voice coil is formed and a diaphragm connected to the bobbin.
[0002]
Conventionally, a speaker (digital speaker) including a bobbin in which a multi-layered voice coil
is formed has been proposed (see, for example, Patent Document 1).
In this type of speaker, a circuit board for audio signal processing is connected to each voice coil
through a tinsel wire, and an audio signal is output from the circuit board to each voice coil
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through the tinsel wire, thereby the voice coil is formed. The formed bobbin vibrates, and sound
is output by the vibration of the diaphragm based on the vibration.
[0003]
Unexamined-Japanese-Patent No. 2010-28785
[0004]
In the speaker as described above, since a multilayer voice coil is formed on the bobbin, a
plurality of tinsel wires connected to each voice coil exist.
Therefore, for example, it is necessary to appropriately design the positional relationship
between the bobbin and the circuit board after reflecting the structure of the speaker, such as
preventing each of the tinsel wires from interfering with each other. The present invention has
been made in view of the above-described circumstances, and provides a voice coil speaker
having a bobbin and a circuit board appropriately disposed in a voice coil speaker including a
bobbin in which a multilayer voice coil is formed. With the goal.
[0005]
In order to achieve the above object, according to the present invention, there is provided a voice
coil speaker including a bobbin having a multi-layered voice coil formed in a speaker body and a
diaphragm connected to the bobbin. A circuit board for processing signals is disposed, a plurality
of output terminals for outputting to the voice coil of the multilayer are arranged in the
circumferential direction of the circuit board, and a damper is provided between the bobbin and
a frame supporting the circuit board. It further comprises a tinsel wire extending from the
plurality of output terminals of the circuit board along the damper to the multilayer voice coil
formed on the bobbin.
[0006]
The present invention is further characterized in that the tinsel wire connecting the output
terminal and the voice coil is woven into the damper.
[0007]
Further, the present invention is characterized in that the tinsel cord is radially woven into the
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damper.
[0008]
Further, the present invention is characterized in that each of the plurality of output terminals is
arranged at intervals in the circumferential direction of the circuit board.
[0009]
Further, the present invention is characterized in that each of the plurality of output terminals is
arranged on the circuit board at intervals on substantially the same circle.
[0010]
Further, the present invention is characterized in that the circuit board is covered with a shield
cover.
[0011]
Further, the present invention is characterized in that an amplifier circuit for audio signal
amplification is mounted on the circuit board.
[0012]
Furthermore, the present invention is characterized in that multi-channel audio digital signals are
input to the circuit board.
[0013]
Further, the present invention is characterized in that the belt-like frame is stretched over the
front portion of the speaker body, and the circuit board is supported by the frame.
[0014]
Further, the present invention is characterized in that a tweeter is disposed in front of the circuit
board.
[0015]
According to the present invention, it is possible to provide a voice coil speaker provided with a
bobbin in which a multilayer voice coil is formed, in which the bobbin and the circuit board are
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appropriately arranged.
[0016]
It is a figure which shows a voice coil speaker, FIG. 1 (A) is a front view, FIG. 1 (B) is an AO-B
sectional view in FIG. 1 (A).
It is a principal part enlarged view in FIG. 1 (B).
It is a figure which shows a bobbin and a voice coil typically.
It is a figure which shows typically another example of a bobbin and a voice coil.
[0017]
Hereinafter, embodiments of the present invention will be described with reference to the
drawings.
FIG. 1 is a view showing a voice coil speaker 1 according to the present embodiment, FIG. 1 (A) is
a front view, and FIG. 1 (B) is a cross-sectional view taken along line A-O-B of FIG.
FIG. 2 is an enlarged view of a main part in FIG.
In the figure, the central axis of the voice coil speaker 1 is shown with a reference L1.
The voice coil speaker 1 according to the present embodiment is, for example, a speaker that is
attached to the side of a door of a vehicle, receives a digital audio signal from an on-vehicle
audio, and outputs audio based on the digital audio signal.
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As shown in FIG. 1, the voice coil speaker 1 has a circular bottomed speaker opening 10 formed
on the front surface, and a bottomed cylindrical shape in which a speaker main body housing
portion 12 which is a space for housing the speaker main body 11 is formed. Speaker frame 13
(frame).
At the rear of the speaker frame 13, a bowl-shaped frame rear 15 (FIG. 1 (B)) having a circular
opening that is expanded in diameter toward the front and is formed on the front is formed. The
magnetic circuit unit 16 (FIG. 1 (B)) provided for driving the speaker main body 11 is provided at
the rear of the.
[0018]
Further, the speaker frame 13 extends coaxially with the central axis L1 of the voice coil speaker
1 and extends outward along the circumferential direction of the opening from the edge of the
circular opening formed on the front surface of the rear portion 15 of the frame. An annular
frame flat portion 17 (FIG. 1 (B)) is formed.
The base end of a cylindrical frame cylindrical portion 18 having a circular speaker opening 10
formed on the front surface is connected to the outer periphery of the frame flat portion 17 so as
to increase in diameter toward the front.
The main damper 20 is connected to the edge of the circular opening formed on the front of the
frame rear portion 15 so as to close the opening, and the center of the main damper 20 is coaxial
with the central axis L1 of the voice coil speaker 1 The cylindrical bobbin 21 extending to the
upper and lower sides is supported, whereby the bobbin 21 is supported and fixed to the speaker
frame 13. The main damper 20 and the bobbin 21 are coaxially arranged such that the central
axes thereof coincide with the central axis L 1 of the voice coil speaker 1.
[0019]
FIG. 3 is a top view of the bobbin 21. As shown in FIG. In this figure, in order to clarify the
relationship between the bobbin 21 and the voice coil 22, the shapes of the bobbin 21 and the
voice coil 22 are schematically described after being simplified. As shown in FIG. 3, the bobbin
21 holds a plurality of voice coils 22 formed by aligning and winding a tinsel wire made of a wire
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such as a copper wire in the axial direction of the bobbin 21. In the present embodiment, a
plurality of voice coils 22 are provided so as to be multilayered in the circumferential direction of
the bobbin 21. Each of the tinsel cords 61 to be described later is connected to each of the voice
coils 22 of each layer, and each of the voice coils 22 of each class vibrates the bobbin 21 based
on the drive signal input from the tinsel cords 61. It is a structure.
[0020]
FIG. 4 is a side view of the bobbin 21 of another example. In this figure, in order to clarify the
relationship between the bobbin 21 and the voice coil 22 as in FIG. 3, the shapes of the bobbin
21 and the voice coil 22 are schematically described and schematically described. As shown in
FIG. 4, the bobbin 21 holds a multi-layered voice coil 22 formed by winding a tinsel wire made of
a wire such as a copper wire in multiple layers. In this another example, the plurality of voice
coils 22 are formed with an interval in each layer in the axial direction of the bobbin 21 (= the
axial direction of the central axis L1 of the voice coil speaker 1), and Each of the tinsel cords 61
to be described later is connected to each, and each of the voice coils 22 of each layer formed on
the bobbin 21 vibrates the bobbin 21 based on the drive signal related to the sound to be output.
It is a structure.
[0021]
A proximal end 25 (FIG. 1 (B), FIG. 2) of a conical diaphragm 24 which is expanded in diameter
toward the front is connected to the bobbin 21, and the distal end 26 of the diaphragm 24 is also
connected. The outer circumference of the speaker frame 13 is connected to the inner
circumference of the speaker opening 10 formed on the front surface of the frame cylindrical
portion 18 of the speaker frame 13. The diaphragm 24 vibrates in response to the vibration of
the bobbin 21 by the multi-layered voice coil 22, and a sound is output based on the vibration of
the diaphragm 24.
[0022]
An annular frame flange 27 is provided on the outer periphery of the speaker opening 10 formed
on the front surface of the frame cylindrical portion 18 and extends outward along the
circumferential direction of the opening from the edge of the outer periphery, and this frame The
flange 27 is formed with a plurality of screw holes 28 (FIG. 1A). When the voice coil speaker 1 is
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fixed to the side of a door of a vehicle, the voice coil speaker 1 is screwed to the door through the
screw holes 28.
[0023]
Two bridges 29 and 30 of an upper bridge 29 and a lower bridge 30 are connected and fixed to
the frame flange 27, and the two bridges 29 and 30 form a disk-like audio signal processing
circuit board 32 (circuit board ) Is supported in front of the diaphragm 24 with its central axis
aligned with the central axis L1 of the voice coil speaker 1. More specifically, as shown in FIG. 1,
each of the two bridges 29 and 30 is a flat member, and in the state of being arranged so as to be
a target with the central axis L1 as a boundary, Each is rigidly fixed to the frame flange 27. The
audio signal processing circuit board 32 is fixed by screwing with a screw 35 (FIG. 2) to each of
the tip portions 34 of the bridges 29 and 30 substantially at the center of the speaker opening
10. An audio signal processing circuit board 32 is supported and fixed to the speaker frame 13
via 29 and 30. As described above, in the present embodiment, by disposing the audio signal
processing circuit board 32 in front of the diaphragm 24, the space formed in front of the
diaphragm 24 is effectively used.
[0024]
Further, at the base end portion 33 of the lower bridge 30, a connector 36 to which an external
device as an output source of an audio signal such as a car audio system is connected is
provided. Then, one end 39 (FIG. 1) of the plurality of lead wires 38 is connected to the
connector 36, and the plurality of lead wires 38 are fixed and closely attached to the back
surface of the lower bridge 30. Along the line extending linearly toward the audio signal
processing circuit board 32, the other end 40 (FIG. 2) is connected to the audio signal processing
circuit board 32 via the circuit connection connector 41 (FIG. 2) . As described above, since the
lead wires 38 are disposed on the back surface of the lower bridge 30, the lead wires 38 are not
exposed, the appearance can be improved, and the contact with the lead wires 38 can be
prevented as much as possible. Furthermore, since the external device is connected, the
connector 36 is provided at the outer edge of the voice coil speaker 1 in consideration of the
easiness of connection of the external device. And in this embodiment, after providing the
connector 36 in the vicinity of the base end part 33 of the lower bridge 30, using the lower
bridge 30 which is an essential member for supporting the audio signal processing circuit board
32, Since the lead wire 38 interposed between the connector 36 and the audio signal processing
circuit board 32 linearly extends, the length of the lead wire 38 can be shortened and at the
same time the bending of the lead wire 38 is prevented. be able to. The bridges 29 and 30 are
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members having the same function as the speaker frame 13 for fixing the audio signal
processing circuit board 32, and are a concept included in the speaker frame 13.
[0025]
Furthermore, in the bridge 29, 30, the tip portion 47 of the sub-damper 45 (damper) is located at
a position corresponding to the circuit fixing portion 43 (FIG. 2) which is a portion connected
with the audio signal processing circuit board 32 by screwing. It is connected. As shown in FIG.
1B and FIG. 2, the sub-damper 45 is a conical member whose diameter increases toward the
front, and the proximal end 46 is connected to the bobbin 21 and the distal end 47 is It is
connected to the bridges 29 and 30 which support the audio signal processing circuit board 32.
The sub-damper 45 fixes the bobbin 21 to the speaker frame 13 via the bridges 29 and 30, and
the members of the bobbin 21, the audio signal processing circuit board 32, and the tweeter 50
(described later) are on the same axis. Hold the position of each member appropriately so that it
is placed in
[0026]
A tweeter 50 is provided on the front of the audio signal processing circuit board 32. The tweeter
50 is a speaker for emitting high directional sound with high directivity, and is formed between
the yoke 51 (FIG. 2), a magnet accommodated in the yoke 51, and the yoke 51 and the magnet A
bobbin freely inserted into the magnetic gap, a voice coil wound around the bobbin, a diaphragm
connected to the bobbin, and the like are provided. In the present embodiment, as shown in FIG.
2, the tweeter 50 is firmly fixed to the audio signal processing circuit board 32 by screwing with
a screw 53, and a terminal 54 extending rearward from the tweeter 50. However, they are
inserted directly into the through holes of the audio signal processing circuit board 32 and are
electrically connected by soldering, so that physical and electrical connections can be made
easily and reliably. The tweeter 50 outputs a sound when the drive signal is input from the sound
signal processing circuit board 32 to the voice coil via the terminal 54 and the diaphragm
vibrates.
[0027]
In addition, a box-shaped front shield cover 56 covering the tweeter 50 is provided on the front
surface of the audio signal processing circuit board 32, whereby the tweeter 50 and the front
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surface of the audio signal processing circuit board 32 are mounted. Each circuit is protected. In
the approximate center of the front surface of the front shield cover 56, a notch 57 for
outputting sound properly from the tweeter 50 is formed. Similarly, on the rear surface of the
audio signal processing circuit board 32, a box-shaped rear shield cover 59 covering the rear
surface of the audio signal processing circuit board 32 is provided. Each circuit is protected. In
the present embodiment, the shield covers 56 and 59 are made of a material having high thermal
conductivity, but the reason will be described later.
[0028]
Further, as shown in FIG. 1A, the audio signal processing circuit board 32 has the audio signal
processing circuit in a state where the sixteen output terminals 60 protrude outside the disk-like
audio signal processing circuit board 32. It is provided in the circumferential direction of the
substrate 32. Describing the arrangement of the output terminals 60 in detail, as shown in FIG.
1A, the output terminals are divided into groups of eight each in line symmetry with an
imaginary straight line T1 connecting the upper bridge 29 and the lower bridge 30 as an axis of
symmetry. 60 are provided. And in each group, each of eight output terminals 60 is arranged at
equal intervals (equal angles from the central axis L1). That is, each of the 16 output terminals
60 is disposed on substantially the same circle at equal intervals, avoiding the connection portion
between the bridges 29 and 30 and the audio signal processing circuit board 32. The output
terminal 60 is directly connected to the electrical contact of the audio signal processing circuit
board 32.
[0029]
Both ends of a tinsel wire 61 constituting the voice coil 22 are connected to each of the output
terminals 60. Specifically, a tinsel wire 61 is directly connected to the through hole 62 (FIG. 2)
formed in the output terminal 60 by soldering. Since the tinsel wire 61 is connected to the
through hole 62 of the output terminal 60 connected to the electrical contact of the audio signal
processing circuit board 32 as described above, when the tinsel wire 61 is connected to the audio
signal processing circuit board 32 Very easy to work with. Furthermore, there is no need to
provide a terminal board having a dedicated terminal for connecting the tinsel wire 61 to the
audio signal processing circuit board 32 separately from the audio signal processing circuit
board 32, thereby reducing production cost and improving work efficiency. Can be In the present
embodiment, a drive signal for driving the bobbin 21 is output from the audio signal processing
circuit board 32 to each voice coil 22, and the bobbin 21 is vibrated by each voice coil 22
according to this drive signal. Thus, the diaphragm 24 vibrates and a sound is output.
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[0030]
Here, the audio signal processing circuit board 32 will be described in detail. The audio signal
processing circuit board 32 is a digital circuit board on which a circuit for performing digital
processing on the input digital audio signal to generate and output a drive signal for the voice
coil 22 of each layer is mounted. A circuit mounted on the audio signal processing circuit board
32 includes a ΔΣ modulation circuit, a predetermined filter circuit, a digital amplifier and the
like, and since these are formed by digital circuits, they are much more complicated than those
formed by analog circuits. It can be small. In particular, the digital amplifier is much smaller than
the analog amplifier, and the amplifier circuit 64 for signal amplification that constitutes this
digital amplifier has a margin on the rear surface of the audio signal processing circuit board 32,
as shown in FIG. It can be arranged. The amplifier circuit 64 has six digital amplifiers in order to
amplify the drive signal of the voice coil 22 of each layer (six layers in the present configuration).
Here, as described above, each of the front shield cover 56 and the rear shield cover 59 is
formed of a member having a high thermal conductivity. Due to this configuration, the heat
generation of each circuit including the amplifier circuit 64 is conducted to the shield covers 56
and 59, and cooling of each circuit is promoted, and the bobbin 21 by driving the voice coil
speaker 1 and the diaphragm 24 The air is blown to the shield covers 56, 59 in accordance with
the vibration of the above, thereby promoting the cooling of the shield covers 56, 59.
[0031]
Note that the voice coil speaker 1 according to the present embodiment includes the audio signal
processing circuit board 32 mounting all circuits including the amplifier circuit 64 for signal
amplification to the input digital audio signal. There is no need to interpose a power amplifier or
the like in the previous stage, and the voice coil speaker 1 alone constitutes a speaker amplifier
system. As a result, it is possible to realize the space saving particularly required for the onvehicle speaker.
[0032]
Here, the audio signal processing circuit board 32 according to the present embodiment is
configured to receive multi-channel audio signals from an external device connected to the
connector 36, and the audio signal processing circuit board 32 is an input Each voice coil 22
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outputs voice corresponding to the multi-channel audio signal by performing predetermined
sampling processing and signal processing such as predetermined filtering processing on the
multi-channel audio signal. The drive signal to be output is generated, and the drive signal
generated through each of the tinsel wires 61 connected to the output terminal 60 is output to
each of the voice coils 22. In the present embodiment, the voice coil 22 of the bobbin 21 is
multilayered in accordance with the number of channels of the audio signal input to the audio
signal processing circuit board 32.
[0033]
Thus, the voice coil speaker 1 according to the present embodiment has a configuration in which
the multilayer voice coil 22 is formed on the bobbin 21 and the tinsel wire 61 from the voice coil
22 is connected to the audio signal processing circuit board 32. Therefore, it is required that
each of the multiple tinsel cords 61 does not interfere with each other. In order to satisfy this
requirement, the voice coil speaker 1 according to the present embodiment has the following
configuration.
[0034]
That is, as shown in FIG. 2, the diameter of a virtual circle formed by connecting the diameter of
the tip end portion 47 of the sub damper 45 (= the maximum diameter of the sub damper 45)
and the through hole 62 of the output terminal 60 Are substantially identical, and each of the
tinsel wires 61 linearly extends from each of the through holes 62 of the output terminal 60
along the surface of the sub-damper 45 toward the bobbin 21. At that time, as shown in FIG. 1
(B) and FIG. 2, the tinsel wire 61 is knitted at a plurality of locations with respect to the subdamper 45, fixed to the sub-damper 45 and in a close contact state. It is configured to extend to
In this manner, the tinsel wire 61 extends linearly from the output terminal 60 toward the
bobbin 21, and the tinsel wire 61 is woven into the sub damper 45, and the tinsel wire with
respect to the sub damper 45. Since the structure 61 is fixed and in close contact, the tinsel wire
61 can be further positioned while the length of the tinsel wire 61 between the output terminal
60 and the bobbin 21 is shortened. For this reason, the movement range of the tinsel wire 61
when the bobbin 21 vibrates can be narrowed, and the interference between the tinsel wires 61
can be prevented. Furthermore, when the voice coil speaker 1 is attached to the side of a door of
a vehicle, various vibrations such as vibration caused by opening and closing of the door,
vibration caused by driving of the engine, vibration caused by traveling of the vehicle, etc. occur.
However, even when such a vibration occurs, the interference of the tinsel wire 61 can be
prevented. From this point of view also, the voice coil speaker 1 is suitable for a vehicle-mounted
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speaker.
[0035]
Further, the output terminals 60 are arranged on the substantially same circle at equal intervals
in a state of avoiding the connection portion between the board and the bridges 29 and 30 in the
audio signal processing circuit board 32, and the approximately same circle The tinsel wire 61
extends from each of the output terminals 60 arranged in the direction toward the bobbin 21. As
a result, in the sub-damper 45, the tinsel cords 61 are in a state of being woven radially and at
substantially equal angular intervals around the central axis L1. In this manner, by intermeshing
the tinsel cords 61 radially and at equal angular intervals, the physical distance interposed
between the tinsel cords 61 can be most efficiently secured. Is more effectively prevented.
[0036]
As described above, the voice coil speaker 1 according to the present embodiment includes the
bobbin 21 in which the voice coil 22 of multiple layers is formed in the speaker body 11, and the
diaphragm 24 connected to the bobbin 21. Then, an audio signal processing circuit board 32 for
processing audio signals is disposed in front of the diaphragm 24, and a plurality of output
terminals 60 for outputting to the multi-layered voice coil 22 are arranged in the circumferential
direction of the audio signal processing circuit board 32. There is. According to this, in the voice
coil speaker 1 according to the present embodiment, the audio signal processing circuit board
32, which is an essential component capable of processing multi-channel audio signals, is
effectively utilized in the space in front of the diaphragm 24. , Can be arranged.
[0037]
Further, in the present embodiment, the plurality of output terminals 60 are arranged at equal
intervals in the circumferential direction of the audio signal processing circuit board 32. More
specifically, the plurality of output terminals 60 are arranged on the audio signal processing
circuit board 32 at regular intervals on substantially the same circle. According to this, it
becomes possible to arrange each of the output terminals 60 in an efficient spaced state, and
accordingly, the physical distance of each of the tinsel cords 61 connected to the output
terminals 60 can be efficiently It becomes possible to secure it and interference of the tinsel cord
61 can be prevented suitably.
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[0038]
Further, in the present embodiment, the sub-damper 45 is provided between the bobbin 21 and
the bridges 29 and 30 (frame) supporting the audio signal processing circuit board 32, and the
plurality of output terminals 60 of the audio signal processing circuit board 32 The tinsel wire
61 is extended along the sub-damper 45 to the multi-layered voice coil 22 formed on the bobbin
21. According to this, the tinsel wire 61 can be linearly extended from the output terminal 60
toward the bobbin 21 along the sub-damper 45, and the length of the tinsel wire 61 between the
output terminal 60 and the bobbin 21 is shortened. And the interference of the tinsel cord 61
can be prevented.
[0039]
Further, in the present embodiment, the tinsel wire 61 extends from the output terminal 60
toward the bobbin 21 in a state of being woven into the sub damper 45. As a result, the tinsel
wire 61 is linearly extended toward the bobbin 21 in a state of being fixed and in close contact
with the sub-damper 45, so that the length of the tinsel wire 61 can be shortened and
interference of the tinsel wire 61 It can prevent. Furthermore, the movement range of the tinsel
wire 61 when the bobbin 21 vibrates can be narrowed, and the interference between the tinsel
wires 61 can be prevented. Furthermore, when the voice coil speaker 1 is attached to the side of
a door of a vehicle, various vibrations such as vibration caused by opening and closing of the
door, vibration caused by driving of the engine, vibration caused by traveling of the vehicle, etc.
occur. However, even when such a vibration occurs, the interference of the tinsel wire 61 can be
prevented. From this point of view also, the voice coil speaker 1 is suitable for a vehicle-mounted
speaker.
[0040]
Further, in the present embodiment, the tinsel cords 61 are radially woven with respect to the
sub-damper 45. According to this, the physical distance of the tinsel wire 61 can be positioned at
the most efficiently secured position, and the interference of the tinsel wire 61 can be more
effectively prevented.
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[0041]
Further, in the present embodiment, the audio signal processing circuit board 32 is covered with
the shield covers 56 and 59. As a result, the audio signal processing circuit board 32 is protected
by the shield covers 56 and 59. Furthermore, as described above, the shield covers 56 and 59
are members with high thermal conductivity, and as described above, the circuits mounted on the
audio signal processing circuit board 32 can be cooled by the shield covers 56 and 59. It
becomes.
[0042]
Further, in the present embodiment, the audio signal processing circuit board 32 is mounted with
an amplifier circuit 64 for audio signal amplification. Here, although the amplifier circuit 64 is an
essential member for the voice coil speaker 1 according to the present embodiment, space can be
saved by mounting the amplifier circuit 64 on the audio signal processing circuit board 32 which
is also an essential member. Is realized. Furthermore, in the present embodiment, each circuit
mounted on the audio signal processing circuit board 32 can be cooled, and by mounting the
amplifier circuit 64 on the audio signal processing circuit board 32, Cooling is possible.
[0043]
Further, in the present embodiment, multi-channel audio signals are input to the audio signal
processing circuit board 32, and the audio signal processing circuit board 32 executes signal
processing corresponding to multi-channel audio signals to prevent interference. A drive signal is
output to the voice coil 22 through the tinsel wire 61 to vibrate the bobbin 21. Thus, it is
possible to appropriately output the sound related to the multi-channel sound signal.
[0044]
Further, in the present embodiment, band-like bridges 29 and 30 (frames) are bridged over the
front portion of the speaker main body 11, and the audio signal processing circuit board 32 is
supported by the bridges 29 and 30. According to this, it is possible to reliably and firmly
support the audio signal processing circuit board 32 in front of the diaphragm 24 in a state
where the opening portion of the speaker opening 10 is secured as much as possible.
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[0045]
Further, in the present embodiment, the tweeter 50 is disposed in front of the audio signal
processing circuit board 32, and by outputting a drive signal from the audio signal processing
circuit board 32 to the tweeter 50, the audio using the tweeter 50 can be obtained. Output is
possible.
[0046]
The embodiment described above merely shows one aspect of the present invention, and any
modification and application can be made within the scope of the present invention.
For example, although 16 output terminals 60 are provided on the audio signal processing circuit
board 32 and the tinsel wire 61 is connected to each of the output terminals 60 in the
embodiment described above, the number of the output terminals 60, the tinsel wire, The
number of is not limited to this. That is, due to the multi-layered voice coil 22 being formed on
the bobbin 21, the present invention can be widely applied to the voice coil speaker 1 in which a
plurality of tinsel wires 61 exist. Further, although the audio signal processing circuit board 32
according to the present embodiment is disk-shaped, it may be annular, for example.
[0047]
DESCRIPTION OF SYMBOLS 1 voice coil speaker 11 speaker main body 13 speaker frame
(frame) 21 bobbin 22 voice coil 24 diaphragm 29 upper bridge (frame) 30 lower bridge (frame)
32 audio signal processing circuit board (circuit board) 45 sub damper (damper) ) 50 tweeter 56
front shield cover (shield cover) 59 rear shield cover (shield cover) 60 output terminal 61 tinsel
wire 62 through hole 64 amplifier circuit
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