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JP2007043484

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DESCRIPTION JP2007043484
The present invention provides a speaker device and a method of manufacturing the same, which
secures fixing of a capacitor to a frame for a speaker device, reduces lead wire connection
processes, and improves lead wire soldering quality, and a plurality of frame devices. To provide
a frame for a speaker device that facilitates insert molding of a terminal fitting. SOLUTION: A
frame 1 for a speaker device, terminal fittings 16, 17 and 18 mounted on a front flange 5 of the
frame 1 for the speaker device, and a rear capacitor accommodating recess of the frame 1 for a
speaker device And the capacitor 9 is projected to the front face of the frame 1 for the speaker
device so that the capacitor lead wires 11 and 12 penetrate the terminal fittings 16 and 17, and
voices are generated on the front face of the frame 1 for the speaker device A speaker device is
provided in which the coil lead wires 22 and 23 and the capacitor lead wires 11 and 12 are
joined to the terminal fittings 16, 17 and 18, respectively. [Selected figure] Figure 1
Speaker apparatus, method of manufacturing speaker apparatus, and frame for speaker
apparatus
[0001]
The present invention relates to a speaker device, a method of manufacturing the speaker device,
and a frame for the speaker device.
[0002]
In a small speaker apparatus used for audio equipment for automobiles, a structure in which a
capacitor is attached to a resin-molded frame forming an outer shell of the speaker apparatus
01-05-2019
1
and this capacitor lead wire is soldered to a terminal fitting of the frame Are known.
In many cases, in terms of space, such capacitors can not be mounted on the front side of the
frame, but are installed on the back or side of the frame.
[0003]
As an example in which a capacitor is provided on the back of a frame for a speaker device, the
one shown in Patent Document 1 is disclosed. This is done by providing a U-shaped storage
portion on the outer wall of the connector terminal portion at the back of the frame and a convex
partition plate at the bottom, inserting a noise reduction capacitor into the U-shaped storage
portion and fixing it. Dropout of the capacitor due to ambient vibration or the like by connecting
one lead wire of the capacitor to the frame along the groove formed in the bottom of the storage
part and connecting the other lead wire to the terminal of the connector terminal part The
structure is designed to prevent this.
[0004]
As another example, a mounting portion of a network component such as a capacitor is integrally
formed on a metal frame or a resin frame of a speaker device, or is integrally molded with the
frame, and a network component in which the capacitor is fitted to the mounting portion The
structure is disclosed (Patent Document 2).
[0005]
In addition, as a connection structure of the lead wire of a speaker and a terminal metal fitting,
what is shown in patent document 3 is known, and according to this, it is cut in advance to the
predetermined length set at the time of design, and The lead wire connecting the other end to the
vibration system and passing through the gap between the terminal metal fitting's notch and the
protrusion formed on the terminal metal fitting and the terminal metal fitting after forming the
locking part consisting of the solder mass, the vibration system side In this state, the engaging
portion is hooked on the protrusion, and in this state, the lead hole through the through hole is
soldered to the terminal fitting.
JP-A-6-245294 JP-A-2000-152395 JP-A-6-70395
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2
[0006]
As described above, in a small speaker device, it is difficult to provide a capacitor on the front
side of the device in terms of space, and it is necessary to install the capacitor on the back side of
the device frame. It is common to connect to the terminal part provided in the frame by
soldering.
[0007]
Also, the voice coil lead wire drawn from the voice coil is extended to the front side of the device
and soldered to the terminal portion of the frame.
Therefore, the terminal connection of the capacitor lead wire and the terminal connection of the
voice coil lead wire are to be soldered on the back side and the front side of the device,
respectively, and processing in separate steps is forced.
[0008]
The capacitor attached to the speaker described in Patent Document 1 is a noise reduction
capacitor connected between the audio signal terminal and the frame (earth), and the
conventional speaker production process is changed to attach the capacitor. It is intended that
the capacitor can be attached in a separate process without the need to install the capacitor, and
the number of parts for attaching the capacitor is reduced. It does not provide an effective
structure for the reliability in connection of the terminals.
[0009]
In addition, since the mounting structure of the network component shown in Patent Document 2
is also a structure in which the capacitor is inserted into the cylindrical gripping piece whose side
is opened, the capacitor mounting operation is easy, but the elasticity of the gripping piece Since
the capacitor is held only by force, there is a risk that the capacitor may come off due to
vibration or the like.
[0010]
The problem to be solved by the present invention is that when securing the ease of attachment
of the capacitor is ensured, there is a problem that the fixation of the capacitor is certain and
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there is a fear of falling off, and the capacitor is provided on the back side of the frame. In
addition, since the connection work of the capacitor lead wire to the terminal portion and the
connection work of the voice coil lead wire are performed on both the back side and the front
side of the device, the number of processes increases and the manufacturing cost increases. In
the case where a plurality of terminal fittings are fixed to the frame by insert molding, it is
difficult to set each single terminal fitting in the mold, which causes a problem in that the postprocessing workability is poor and the processing cost increases. And are each mentioned as an
example.
[0011]
The speaker device according to claim 1 has a frame, a terminal fitting attached to a front flange
of the frame, and a capacitor housed in a rear capacitor housing recess of the frame, and a voice
is transmitted to the front of the frame. A coil lead wire and a capacitor lead wire of the capacitor
are joined to the terminal fitting.
[0012]
In the method of manufacturing the speaker device according to the second aspect, the terminal
fitting is fixed so as to be exposed at the front flange of the frame, and the capacitor lead wire of
the capacitor accommodated at the back of the frame penetrates the terminal fitting. The
capacitor lead wire and the voice coil lead wire are connected at the front surface of the frame
via the terminal fitting while projecting to the front surface of the frame.
[0013]
The frame for the speaker device according to claim 4 is connected to the front surface to form a
flange, a capacitor accommodation recess is formed in the back, a terminal fitting is fixed to the
front surface of the flange, and the terminal fitting is penetrated An insertion hole of the
capacitor lead wire is formed in the flange portion.
[0014]
Hereinafter, embodiments of a speaker device and a frame for the speaker device according to
the present invention will be described in detail with reference to the drawings.
[0015]
(First Embodiment) FIG. 1 is a plan view seen from the front of a speaker device according to a
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first embodiment of the present invention, and FIG. 2 is a plan view showing the back of the
speaker device of FIG.
The frame 1 for the speaker device, which is the outer shell of the speaker device, is formed of a
resin molded product, and is cup-shaped to accommodate the speaker function portion including
the diaphragm 2 and voice coil (not shown) at the center of the front surface. It is formed and
connected to the front of the frame to form a collar 5 on the outer periphery thereof.
[0016]
Referring to the back of the frame in FIG. 2, a pair of capacitors are formed on the back of front
collar 5 and have capacitor housing recess 6 and pass from the back to front of collar 5 close to
capacitor housing recess 6. Insertion holes 7 and 8 of the lead wire are formed.
The capacitor housing recess 6 is formed as a rectangular capacitor housing recess having a
width that is in pressure contact with the outer peripheral portion of the cylindrical capacitor 9
and a width that is in contact with both end surfaces of the capacitor 9 (the capacitor length
direction). At one end portion, a capacitor fixing elastic claw member 10 is formed which presses
the accommodated capacitor 9 against the wall surface 6a on the front end side (lead wire
drawing side).
[0017]
FIG. 3 is a partially enlarged perspective view showing a guide portion of a capacitor lead wire
and a T-shaped position restricting portion in the speaker device shown in FIG.
FIG. 4 is a partially enlarged perspective view showing insertion holes of the capacitor lead wire
and the capacitor lead wire of the frame in the speaker device shown in FIG.
Referring to these drawings, the capacitor 9 is press-fit into the capacitor housing recess 6 so
that the capacitor 9 is pressed with a fingertip, whereby the outer peripheral portion is
restrained by the width direction capacitor housing recess wall surface 6b and the elasticity of
the claw member 10 It is pressed against the front end side wall surface 6 a of the capacitor
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housing recess 6 by the pressing force and is fixed in position in the capacitor housing recess 6
in a non-moving state.
[0018]
In the first embodiment, the pair of lead wires 11 and 12 of the capacitor 9 are bent in an L
shape in advance.
A groove portion 13 (FIG. 3) for guiding the base side straight portion of the L-shaped lead wires
11 and 12 is formed adjacent to the front end side wall surface 6a of the capacitor housing
concave portion 6 in the frame back portion. A T-shaped position restricting portion 14 is formed
in the central portion of the as shown in FIGS.
The position control of the lead wires 11 and 12 in the height direction, that is, the front surface
to the back surface of the frame 1 is performed by the T-shaped position restricting portion 14
and the separation wall 15.
[0019]
With the capacitor 9 housed in the capacitor housing recess 6, the tip end portions of the pair of
L-shaped lead wires 11 and 12 are slightly projected from the back side of the collar portion 5 so
as to slightly project toward the front side of the collar portion 5. It is inserted into the insertion
holes 7 and 8 of the capacitor lead wire.
[0020]
Further, as clearly shown in FIG. 2, the separation wall 15 is formed between the insertion holes
7 and 8 of the pair of capacitor lead wires on the back side of the collar 5, and the T-shaped
position restricting portion 14 and the separation wall 15 As a result, a short circuit due to an
accidental contact between the L-shaped lead wires 11 and 12 is prevented.
[0021]
As shown in FIG. 1, plate-like terminal fittings 16 and 17 are fixed to the front surface of the
flange 5 of the frame 1 so as to surround the insertion holes 7 and 8 of the respective capacitor
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lead wires.
The terminal fitting 16 corresponding to the insertion hole 7 of one capacitor lead wire and the
terminal fitting 17 corresponding to the insertion hole 8 of the other capacitor lead wire are
separated from each other, and the insertion hole 7 of one capacitor lead wire The terminal metal
fitting 16 surrounding the frame 5 has an external connection end 16 a projecting outward of
the flange 5.
[0022]
A third terminal fitting 18 is fixed to the front surface of the collar 5 separately from the two
terminal fittings 16 and 17 that cover the insertion holes 7 and 8 of the capacitor lead wire.
An external connection end 18 a protruding to the outside of the flange portion 5 is formed in
the third terminal fitting 18.
[0023]
The terminal fittings 16 and 17 covering the insertion holes 7 and 8 of the capacitor lead wire
are aligned with the insertion holes 7 and 8 of the capacitor lead wire, and holes 20 and 21 for
inserting the capacitor lead wires 11 and 12 are opened. .
The ends of the capacitor lead wires 11 and 12 slightly protrude from the holes 20 and 21 of the
terminal fittings 16 and 17 to the front side of the flange 5 through the insertion holes 7 and 8
of the capacitor lead wires of the flange 5.
[0024]
In the above-described configuration, capacitor 9 is press-fit into capacitor housing recess 6 on
the back of the frame, and the tips of the pair of L-shaped lead wires 11 and 12 of capacitor 9
are inserted through through holes 7 and 8 of capacitor lead wire of flange 5. A pair of voice coil
leads 22 and 23 drawn out from the voice coil (not shown) to the front surface of the frame 1
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through the holes 20 and 21 of the terminal fittings 16 and 17 and externally connected to the
front surface of the frame 1 The upper surface of the terminal metal fitting 17 and the upper
surface of the third terminal metal fitting 18 in which the capacitor lead wire does not protrude
are extended respectively. At this time, it is preferable that the voice coil lead wires 22 and 23 be
twisted and temporarily fixed to the outer end portions of the corresponding terminal fittings 17
and 18, respectively.
[0025]
Next, from the front side of the frame 1, solder the capacitor lead wires 11 and 12 and the
corresponding terminal fittings 16 and 17 at the hole positions of the fittings, and correspond to
the voice coil leads 22 and 23 Similarly, the terminal fittings 17 and 18 are soldered from the
front side of the frame 1 respectively. One voice coil lead wire 22 is connected to one capacitor
lead wire 12 via a terminal fitting 17, and the other capacitor lead wire 11 is electrically
connected to the external connection end 16a of the terminal fitting 16 via the other terminal
fitting 16. Further, the other voice coil lead wire 23 is electrically conducted to the external
connection end 18 a via the third terminal fitting 18.
[0026]
In the above-described structure, since the capacitor 9 and the pair of capacitor lead wires 11
and 12 are securely fixed to the frame 1 simply by press-fitting the capacitor 9 into the capacitor
accommodating recess 6 on the back side of the frame 1, the terminal fitting Defective soldering
between the capacitor leads 16 and 17 and the capacitor lead wires 11 and 12 is prevented. The
capacitor 9 is installed on the back side of the frame 1 for space reasons, but both the capacitor
lead wires 11 and 12 and the voice coil lead wires 22 and 23 are the corresponding terminal
fittings 16 and 17 from the front side of the frame 1. , 18 can be soldered, and capacitor lead
wires 11, 12 and voice coil lead wires 22, 23 can be processed in the same process, and along
with the improvement of soldering quality, cost reduction is brought about by the reduction of
soldering process steps. Be
[0027]
Second Embodiment FIG. 5 is a schematic main part perspective view showing a second
embodiment of the speaker device according to the present invention. The end portions of the
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pair of terminal fittings 16 and 17 protrude outward from the side portion of the flange 5 of the
frame 1 and lead fitting grooves of the L-shaped lead wires 11 and 12 of the capacitor 9 are
formed on the fitting projections. 25, 26 are formed. The capacitor 9 is press-fit into the
capacitor housing recess on the back side of the frame 1 as in the first embodiment, and the
capacitor lead wires 11 and 12 extend to the outside of the flange 5 of the frame 1 and the Lshaped end thereof is It is directly inserted into the lead wire insertion groove portions 25 and
26 of the terminal fittings 16 and 17 and subjected to a soldering process. The voice coil lead
wire 22 drawn to the front of the frame is also soldered to the terminal fitting 17 in the same
manner.
[0028]
Also in the second embodiment, the capacitor lead wires 11 and 12 and the voice coil lead wire
22 are soldered in the same process from the front side of the frame 1, and the capacitor lead
wires 11 and 12 are inserted through the frame 1 The operation is further facilitated because it
is not necessary to form a hole, and it is only necessary to insert the capacitor lead wires 11 and
12 directly into the grooves 25 and 26 of the terminal fittings 16 and 17. Of course, the lead
wire insertion grooves 25 and 26 may be in the form of through holes as in the first
embodiment.
[0029]
Third Embodiment FIG. 6 is a schematic main part perspective view showing a third embodiment
of the speaker device according to the present invention. In the third embodiment, the capacitor
lead wires 11 and 12 are not L-shaped, but extend straight from the end of the capacitor 9 and
are perpendicular to the collar 5 on the rear side of the frame 1. A cylindrical capacitor housing
recess 27 is formed in the. The plate-like terminal fittings 16 and 17 are fixed to the front
surface of the flange 5 and the insertion holes 28 and 29 of the capacitor lead wire are formed
from the flange 5 to the terminal fittings 16 and 17 in the first embodiment. It is similar. In a
state where capacitor 9 is press-fit into cylindrical capacitor housing recess 27 from the back
side of flange 5, capacitor lead wires 11 and 12 pass through insertion holes 28 and 29 of
capacitor lead wires slightly to the front side of terminal fittings 16 and 17. Stand out. Therefore,
as in the first and second embodiments, the capacitor lead wires 11 and 12 and the terminal
fittings 16 and 17 and the voice coil lead wire 22 and the terminal fitting 17 are simultaneously
soldered on the front side of the frame 1 This eliminates the need for L-shaped processing of the
lead wires 11 and 12 and enables cost reduction by reducing the number of processes.
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9
[0030]
Fourth Embodiment FIG. 7 is a plan view showing an embodiment of a manufacturing process of
a frame for a speaker device according to the present invention. In the frame for the speaker
device, a resin frame body portion and a terminal fitting are integrally formed by insert molding.
First, as shown in FIG. 7A, a molding die in which a rectangular capacitor housing recess 30 is
formed in a part of the flange 5 of the frame 1 is used. As shown in FIG. 7B, this capacitor is used.
An integral terminal fitting 31 is disposed on the front of the flange portion of the frame 1 so as
to straddle the housing recess 30. In this embodiment, the terminal fitting 31 has a form of a
composite terminal having a shape in which one end side is divided into two branches from the
central portion, and the position of the bifurcated branch portion comes to the position of the
capacitor accommodating recess 30 of the frame 1. In this state, the integral terminal fitting 31
and the frame 1 are insert-molded. FIG. 7 (B) shows the state after this insert molding.
[0031]
Thereafter, as shown in FIG. 7C, the terminal fitting 31 is cut to the left and right at the position
of the capacitor housing recess 30 of the frame 1, whereby a pair of branched terminal fittings
16 on one side of the front face of the flange portion of the frame 1 A single terminal fitting 18 is
fixed to one side of the other terminal 17, and a frame 1 for a speaker device having three
terminal fittings 16, 17, 18 separated from each other is obtained.
[0032]
As described in the first to third embodiments, lead wires of capacitors are respectively inserted
into two terminal fittings 16 and 17 on one side and fixed by soldering, and two terminal fittings
16 , 17 (one having the external connection end) is soldered to the voice coil lead wire, and the
other voice coil lead wire is soldered to the one terminal metal fitting 18 on the opposite side
which is divided.
Both can be soldered in the same process from the front side of the frame 1, and the reduction of
the process results in cost reduction.
[0033]
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10
Conventionally, terminals are attached to a frame for this type of speaker device by separately
molding terminal fittings and attaching them to a resin frame by insert molding one by one or by
manual processing by post processing There is. In such a method, especially when the number of
terminals increases, the processing cost increases, and when the terminal metal fitting is made
small, it becomes difficult to set a plurality of single-piece metal fittings in the insert molding die
Although the workability of post-processing is deteriorated, in the present invention, since the
terminal fitting is integrated and set in the mold together with the resin frame, stable setting is
possible.
[0034]
In the embodiment of FIG. 7, a rectangular capacitor housing recess 30 is formed in the flange
portion 5 of the frame 1, and the capacitor housing recess 30 is configured to cross the integral
plate terminal 31. The capacitor housing recess 30 of the frame 1 may be U-shaped, V-shaped, or
a through-hole shape, and the plate-like terminal fitting 31 may cross over this. Further, without
forming the capacitor accommodating recess 30 for crossing the metal fitting in the frame 1,
only the metal fitting partially protrudes outward from the frame 1, and after insert molding, this
part is cut to form a plurality of terminal fittings. You may do so.
[0035]
Furthermore, in the fourth embodiment, the metal fitting cut portion is exposed to the frame, but
the cut portion of the terminal metal fitting may be covered with a thin resin that does not affect
the cutting. Moreover, it is also possible to use the integral-type terminal metal fitting which
considered the ease of press molding of metal fittings, and the ease of cutting | disconnection of
post-processing according to the shape of the terminal metal fitting required.
[0036]
As described above, the speaker device according to the first embodiment includes the frame 1
for the speaker device, the terminal fittings 16, 17 and 18 mounted on the front flange 5 of the
frame 1, and the frame 1. And a capacitor 9 which is housed in the back surface of the capacitor
housing recess 6 and which is projected to the front surface of the frame 1 so that the capacitor
lead wires 11 and 12 penetrate the terminal fittings 16 and 17; The voice coil lead wires 22 and
23 and the capacitor lead wires 11 and 12 are joined to the terminal fittings 16, 17 and 18 on
the front face of the connector.
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11
[0037]
With this configuration, the capacitor 9 can be securely fixed simply by press-fitting the
capacitor 9 for characteristic adjustment into the capacitor housing recess 6 on the back surface
of the frame, and the capacitor lead wires 11 and 12 project to the front surface of the frame 1
Since the voice coil leads 22 and 23 can be soldered to the terminal fittings 16, 17 and 18 fixed
to the front of the frame from the front side of the frame simultaneously with the soldering of the
capacitor leads 11 and 12, the workability can be improved. A speaker device is provided that is
superior in the quality of the soldering process.
[0038]
Further, in the method of manufacturing the speaker device according to the first to third
embodiments, the terminal fittings 16, 17, 18 are fixed so as to be exposed to the front flange 5
of the frame 1. The lead wires 11, 12 of the capacitor 9 are projected to the front of the frame 1
through the terminal fittings 16, 17, and the capacitor lead wires 11, 12 and the voice coil leads
22, 23 are framed through the terminal fittings 16, 17, 18. It is set as the structure connected in
the front of 1.
[0039]
With this configuration, mounting of the capacitor 9 is extremely easy, and terminal connection
between the capacitor lead wires 11 and 12 and the voice coil lead wires 22 and 23 can be
performed from the front side of the speaker device in the same process, reducing the number of
manufacturing processes. And by the improvement of the workability, the reduction of the
manufacturing cost is achieved.
[0040]
In the frame for the speaker device according to the embodiment of the present invention, the
flange portion 5 is formed to be connected to the front surface of the frame, the capacitor
accommodating recess 6 is formed in the back, and the terminal fitting 16 is formed on the front
surface of the flange portion 5 Reference numerals 17 and 18 are fixed, and the terminal fittings
16 and 17 are penetrated to form insertion holes 7 and 8 of the capacitor lead wires 11 and 12
in the flange 5.
[0041]
With this configuration, the lead wires 11 and 12 of the capacitor 9 press-fit into the capacitor
housing concave portion 6 on the back surface of the frame protrude to the front surface of the
01-05-2019
12
frame 1, so the terminal fittings 16, 17 and 18 fixed on the front surface of the frame From this,
the soldering process of the capacitor lead wires 11 and 12 can be performed simultaneously
with the soldering of the voice coil lead wires 22 and 23, thereby improving the workability and
providing the frame 1 for the speaker device excellent in the quality of the soldering process .
[0042]
It is the top view seen from the apparatus front of 1st Embodiment of the speaker apparatus
which concerns on this invention.
It is the top view seen from the back side of the speaker apparatus shown in FIG.
It is a partially expanded perspective view which shows the guide part and T-shaped position
control part of a capacitor | condenser lead in the speaker apparatus shown in FIG.
It is a partial enlarged perspective view which shows the penetration hole of the capacitor |
condenser lead wire in the speaker apparatus shown in FIG. 1, and the capacitor | condenser lead
wire of a flame | frame.
It is a schematic perspective view which shows 2nd Embodiment of the speaker apparatus based
on this invention.
It is a schematic perspective view which shows 3rd Embodiment of the speaker apparatus based
on this invention.
It is a figure which shows the manufacturing process of the flame | frame for speaker
apparatuses which concerns on this invention.
Explanation of sign
[0043]
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13
Reference Signs List 1 frame 5 flange portion 6 capacitor housing recess 7, 8 insertion hole for
capacitor lead wire 9 capacitor 10 claw member 11, 12 capacitor lead wire 13 groove portion 14
T-shaped position restricting portion 16, 17, 18 terminal fitting 22, 23 voice coil Lead
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