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JP2011223468

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Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2011223468
PROBLEM TO BE SOLVED: To easily transmit a signal path (connection lead) from a piezoelectric
element to an ultrasonic transducer having a two-dimensional array and an ultrasonic probe
having the ultrasonic transducer regardless of the area of the ultrasonic radiation surface and the
array shape of the piezoelectric element. To connect the extracted signal path and the electronic
circuit. A wiring substrate provided with a connection lead drawn from a back electrode of a
piezoelectric element has a surface having a first connection portion electrically connected to the
back electrode, a surface intersecting with the surface and having a connection lead, and an
electronic circuit And a second connection portion connected to the electronic circuit through the
connection lead drawn from each of the first connection portions, and a side having a second
connection portion electrically connected to the second connection portion. Put together on the
surface. [Selected figure] Figure 2
Ultrasonic transducer and ultrasonic probe
[0001]
The present invention relates to an ultrasonic probe, and more particularly to a connection
structure between an electrode of a piezoelectric element in an ultrasonic transducer and an
electronic circuit.
[0002]
In recent years, ultrasonic transducers in an ultrasonic probe of an ultrasonic diagnostic
apparatus have come to be used in a two-dimensional array.
01-05-2019
1
In the ultrasonic transducer of this two-dimensional array, since the number of elements of the
piezoelectric element is huge, lead routing for connection between the element and an electronic
circuit (such as a delay circuit) becomes a problem. That is, even though the number of leads
drawn from each of the two-dimensionally arranged elements is enormous (for example, 4096), if
the size (size) of the entire ultrasonic transducer is small, a space for lead routing is secured.
Becomes difficult
[0003]
In order to solve such a problem of connection lead routing, it is effective to perform a process of
reducing the number of signals of the two-dimensional array of piezoelectric elements (signal
amplification and addition). By performing such processing, the number of leads routed from the
piezoelectric element to the subsequent electronic circuit (such as a delay circuit) is reduced.
Such a circuit makes it possible to realize a two-dimensional array of ultrasonic transducers.
[0004]
For example, conventionally, there has been proposed an ultrasonic transducer having a
configuration in which an IC is disposed with respect to a surface (hereinafter referred to as "rear
surface") opposite to the ultrasonic radiation direction of the piezoelectric element (eg, Patent
Document 1). The number of leads from the piezoelectric element is reduced by performing
processing to reduce the number of signals of the piezoelectric element of the two-dimensional
array by this IC.
[0005]
Also, conventionally, ultrasonic probes of various shapes are adopted depending on the clinical
application site. In diagnosis of the cardiovascular system such as the heart, ultrasound diagnosis
is performed from the intercostal space. As an ultrasonic probe used in this case, a configuration
having an ultrasonic transducer with a flat and small diameter ultrasonic emission surface is
generally used.
01-05-2019
2
[0006]
On the other hand, in abdominal digestive system diagnosis such as liver, the distance from the
body surface of the diagnosis target site is relatively long, and the area of the diagnosis target
site is also wide. In addition, it is also necessary to drive out the gas in the body that adversely
affects the ultrasound diagnosis from the ultrasound diagnostic field of view. As an ultrasonic
probe used in this case, a configuration having an ultrasonic transducer in which an ultrasonic
radiation surface is formed in a large-diameter, convex shape or an arc-like curved surface shape
is generally used.
[0007]
In addition, the size of the piezoelectric element is also limited in the case of an ultrasonic probe
that requires an ultrasonic radiation surface to have a large diameter. When the size of the
piezoelectric element in the ultrasonic transducer is increased, the resolution may be reduced.
Therefore, when using a probe with a large diameter, the number of piezoelectric elements
required to increase the size of the ultrasonic radiation surface is enormous.
[0008]
U.S. Patent No. 6,551,248
[0009]
As described above, the probe may have a large-diameter, convex-shaped or arc-shaped curved
surface in the ultrasonic radiation surface.
Further, it is not easy to increase the size of the IC, and even if it is realized, the manufacturing
cost will be high.
[0010]
Therefore, in the case where the ultrasonic radiation surface has a large diameter and a convex
01-05-2019
3
or curved shape, it is difficult to dispose an IC on the back surface of the piezoelectric element as
in Patent Document 1. That is, it is not easy to arrange the IC with high density and space saving
corresponding to the rear surface of the convex or curved piezoelectric element group, and a
shape corresponding to the rear surface of the convex or curved piezoelectric element group It is
not easy to form an IC. In addition, even if such installation and formation of the IC are realized,
the manufacturing cost is increased.
[0011]
Due to these various limitations, conventionally, depending on the number of elements of the
piezoelectric element and the arrangement method of the piezoelectric element, the installation
of the IC may be difficult.
[0012]
The present invention has been made in view of the above problems, and an object thereof is a
two-dimensional array ultrasonic transducer in which the signal path from the piezoelectric
element can be easily generated regardless of the area of the ultrasonic wave emitting surface
and the array shape of the piezoelectric element. An object of the present invention is to provide
an ultrasonic transducer and an ultrasonic probe of a two-dimensional array which can draw out
(connecting leads) and connect the drawn signal path and the electronic circuit.
[0013]
In order to achieve the above object, the invention according to claim 1 includes a piezoelectric
element in which a front electrode is formed on the front surface which is an ultrasonic radiation
surface, and a back electrode is formed on the back surface opposite to the front surface. An
ultrasonic transducer having a plurality of ultrasonic transducers arranged two-dimensionally
and an electronic circuit for processing a signal from the ultrasonic transducer, wherein the
plurality of plate-like wiring boards having a thickness Formed by laminating a plurality of plates
according to the row or column of the ultrasonic transducers while affixing the plate surfaces in
the second row, and corresponding to each of the plurality of ultrasonic transducers on the front
surface directed in the ultrasonic radiation surface direction And a second connection portion
corresponding to each of the first connection portions between the side surface or the back
surface and the electronic circuit, and a front surface is provided on the back surface of the
ultrasonic transducer. Connection A wiring board block in which the electronic circuit is
connected to the side surface or the back surface, or both the side surface and the back surface,
and the first connection portion and the second connection portion via the plate surface of the
wiring substrate And connecting leads for connecting.
01-05-2019
4
In order to achieve the above object, the invention according to claim 11 has a wiring board
block formed by laminating substantially flat wiring boards having a thickness, and a front
electrode formed on a front surface which is a radiation surface of ultrasonic waves, An
ultrasonic transducer group in which an ultrasonic transducer including a piezoelectric element
having a back surface electrode formed on the back surface is two-dimensionally arranged, and
the front surface of the wiring substrate facing the back surface of the ultrasonic transducer The
first connection pad provided corresponding to the arrangement of the ultrasonic transducers
and provided in electrical continuity with the back electrode, and provided on the side surface or
the back surface of the peripheral surface of the wiring substrate corresponding to each of the
first connection pads Connection leads for electrically connecting the first connection pad and
the second connection pad via at least one of the plurality of second connection pads and the
plate surface of the wiring substrate; and the wiring substrate block And an electronic circuit
connected to the surface provided with the second connection pad and electrically connected to
the second connection pad to process a signal from the piezoelectric element. is there.
In order to achieve the above object, the invention according to claim 12 includes a piezoelectric
element in which a front electrode is formed on the front surface which is an ultrasonic radiation
surface, and a back electrode is formed on the back surface opposite to the front surface. An
ultrasonic probe having a plurality of ultrasonic transducers arranged two-dimensionally and an
electronic circuit for processing a signal from the ultrasonic transducer, wherein the plurality of
plate-like wiring boards having a thickness Plate surfaces adjacent to each other, and formed by
laminating a plurality of layers according to the row or column of the ultrasonic transducers, and
each of the plurality of ultrasonic transducers on the front surface directed in the ultrasonic
radiation surface direction A corresponding first connection portion is provided, and a second
connection portion corresponding to each of the first connection portions is provided between
the side surface or the back surface and the electronic circuit, and a front surface of the
ultrasonic transducer is provided Connected to the back, The wiring board block in which the
electronic circuit is connected to the side surface or the back surface, or both the side surface
and the back surface, and the first connection portion and the second connection portion are
connected via the plate surface of the wiring substrate And a connecting lead.
[0014]
According to the ultrasonic transducer and ultrasonic probe according to claim 1, claim 11 and
claim 12, the wiring substrate provided with the connection lead drawn from the back electrode
of the piezoelectric element is conducted to the back electrode (1) A surface having a connection
portion, a plate surface intersecting the surface and having a connection lead, and a surface
having a second connection portion electrically connected to the electronic circuit.
01-05-2019
5
[0015]
Therefore, the connection lead drawn from each of the first connection portions can be
connected to the electronic circuit through the second connection portions arranged on the side
surface and the back surface.
That is, it is not necessary to provide an electronic circuit adjacent to the back electrode.
According to such a configuration, in the two-dimensional array ultrasonic transducer, the
electronic circuit that exchanges signals with the back electrode can be disposed on any surface
of the wiring board block. As a result, regardless of the area of the ultrasonic radiation surface
and the arrangement method of the piezoelectric elements, it is possible to avoid the hindrance
to the installation of the electronic circuit, and it is possible to avoid the two dimensional array of
ultrasonic transducers and the two dimensional arrays of ultrasonic transducers. It is possible to
realize an ultrasonic probe having the same.
[0016]
BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic perspective view which shows the
outline | summary of the ultrasonic transducer concerning 1st Embodiment of this invention. It is
a schematic disassembled perspective view which shows the outline | summary of the ultrasonic
transducer concerning 1st Embodiment of this invention. The ultrasonic transducer concerning
1st Embodiment of this invention WHEREIN: It is a schematic sectional drawing which shows the
outline | summary of the connection state of the ultrasonic transducer | vibrator and the wiring
board via the flexible substrate. It is a schematic perspective view which shows the outline |
summary of the wiring board block of the ultrasonic transducer concerning 1st Embodiment of
this invention. It is a schematic perspective view which shows the outline | summary of the
wiring board of the ultrasonic transducer concerning 1st Embodiment of this invention. It is a
schematic perspective view which shows the outline | summary of the ultrasonic transducer
concerning 2nd Embodiment of this invention. It is a schematic disassembled perspective view
which shows the outline | summary of the ultrasonic transducer concerning 2nd Embodiment of
this invention. The ultrasonic transducer concerning 2nd Embodiment of this invention
WHEREIN: It is a schematic sectional drawing which shows the outline | summary of the
connection state of the ultrasonic transducer | vibrator and the wiring board via the flexible
substrate. It is a schematic perspective view which shows the outline | summary of the wiring
board block of the ultrasonic transducer concerning 2nd Embodiment of this invention. It is a
01-05-2019
6
schematic perspective view which shows the outline | summary of the wiring board of the
ultrasonic transducer concerning 2nd Embodiment of this invention. It is a schematic perspective
view which shows the outline | summary of the ultrasonic transducer concerning 3rd
Embodiment of this invention. It is a schematic disassembled perspective view which shows the
outline | summary of the ultrasonic transducer concerning 3rd Embodiment of this invention. It
is a schematic perspective view which shows the outline | summary of the wiring board block of
the ultrasonic transducer concerning 3rd Embodiment of this invention. It is a schematic
perspective view which shows the outline | summary of the wiring board of the ultrasonic
transducer concerning 3rd Embodiment of this invention. (A) It is a schematic perspective view
which shows the outline | summary of the wiring board of the ultrasonic transducer concerning
the modification of 1st Embodiment of this invention. (B) It is a schematic perspective view which
shows the outline | summary of the wiring board of the ultrasonic transducer concerning the
modification of 2nd Embodiment and 3rd Embodiment of this invention.
[0017]
Hereinafter, an ultrasonic transducer and an ultrasonic probe according to an embodiment of the
present invention will be described with reference to FIGS.
[0018]
First Embodiment (Schematic Configuration of Ultrasonic Transducer) An overview of an
ultrasonic transducer 100 in a first embodiment will be described with reference to FIGS. 1 to 5.
FIG. 1 is a schematic perspective view showing an outline of an ultrasonic transducer 100
according to a first embodiment of the present invention. FIG. 2 is a schematic exploded
perspective view showing an outline of the ultrasonic transducer 100 according to the first
embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing an
overview of a connection state of the ultrasonic transducer 110a and the wiring substrate 130a
through the flexible substrate 120 in the ultrasonic transducer 100 according to the first
embodiment of the present invention. Hereinafter, a schematic configuration of the ultrasonic
transducer 100 according to the present embodiment will be described. The number of
arrangement of the ultrasonic transducers 110 a of the ultrasonic transducer 100 and the
number of the wiring boards 130 a shown in each drawing are conceptually shown, and are
different from actual ones. Further, the shape of the entire array shown in the drawing, for
example, the number of rows and the number of columns in a two-dimensional array is also an
example, and other configurations are also possible.
01-05-2019
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[0019]
As shown in FIG. 1, the ultrasonic transducer 100 according to this embodiment has an
ultrasonic transducer group 110 configured by two-dimensionally arranging ultrasonic
transducers 110 a. In FIG. 2, it is a two-dimensional array in the row direction and the column
direction. With regard to the arrangement of the ultrasonic transducers 110a in the ultrasonic
transducer group 110, for example, the entire ultrasonic radiation surface has a large diameter
and has a convex shape or an arc shape so as to be suitable for abdominal digestive system
diagnosis. It is possible. The ultrasonic transducer 100 having a convex or curved ultrasonic
transducer group 110 as shown in FIG. 1 can cope with the case where the distance of the region
to be diagnosed from the body surface is relatively long. The area of the site also increases.
Furthermore, it becomes possible to expel the gas in the body that adversely affects the
ultrasound diagnosis from the ultrasound diagnostic field of view.
[0020]
As shown in FIGS. 1 and 2, the side opposite to the direction of radiation of the ultrasonic waves
with respect to the ultrasonic transducer group 110 (hereinafter simply referred to as
“backward”), that is, the back surface of the ultrasonic transducer group 110. , And the flexible
substrate 120 are arranged adjacent to each other. Further, as shown in FIG. 2, behind the
flexible substrate 120, a wiring board block (wiring board group) 130 configured by arranging
thick board-like wiring boards 130a is disposed. The wiring board 130a is formed in a thick plate
shape, and the wiring board block 130 having, for example, five planes and one convex (or
curved) surface is formed by combining the plurality of wiring boards 130a. . The surface on the
side of the ultrasonic transducer group 110 and the flexible substrate 120 (hereinafter simply
referred to as “front surface”) is one surface of the wiring board block 130. (The front surface
131) and the back surface opposite to the front surface 131). The thickness of the wiring
substrate 130a can be, for example, the same as the arrangement interval of the ultrasonic
transducers 110a in the column direction.
[0021]
An electronic circuit board 140 is provided on the side surface of the wiring board block 130.
That is, by combining the plurality of wiring boards 130a, a substantially planar side surface
group in which the side faces 133 of the respective wiring boards 130a are connected is formed
01-05-2019
8
in the wiring board block 130. The electronic circuit board 140 is installed for this side group.
An electronic circuit 150 is provided on the surface 141 of the electronic circuit board 140. The
surface 141 is the surface opposite to the surface on the wiring substrate block 130 side.
[0022]
Each of the electrodes of the ultrasonic transducer 110a of the ultrasonic transducer group 110
is a third connection on the flexible substrate 120 disposed on the rear surface (hereinafter,
simply referred to as "rear surface") of the ultrasonic transducer 110a. It is connected to the pad
121 and is conducted. The third connection pad 121 shown in FIG. 2 is drawn to the back
surface of the flexible substrate 120 by the through electrode 122 (see FIG. 3) provided on the
flexible substrate 120, and the fourth connection pad 123 (FIG. 3) is conducted.
[0023]
As shown in FIGS. 3 and 4, the fourth connection pad 123 on the back surface of the flexible
substrate 120 is connected to the first connection pad 131a formed on the front surface 131 of
each wiring substrate 130a in the wiring substrate block 130 and is conductive. Be done. In
addition, a connection lead 132a passing through the second plate surface 132 and the side
surface 133 is connected to the first connection pad 131a. The connection lead 132a is drawn
from the first connection pad 131a to the second connection pad 133a through the second plate
surface 132 of each wiring board 130a. Therefore, the first connection pad 131a and the second
connection pad 133a are electrically connected by the connection lead 132a. The connection
leads 132a can be, for example, a wiring pattern printed on the wiring board block 130.
[0024]
The first connection pad 131a in the present embodiment corresponds to an example of the "first
connection portion" in the present invention. The second connection pad 133a in the present
embodiment corresponds to an example of the "second connection portion" in the present
invention. In addition, the third connection pad 121 in the present embodiment corresponds to
an example of the “third connection portion” in the present invention. The fourth connection
pad 123 in the present embodiment corresponds to an example of the “fourth connection
portion” in the present invention.
01-05-2019
9
[0025]
(Configuration of Ultrasonic Transducer) Next, the ultrasonic transducer 110 a in the ultrasonic
transducer 100 of the present embodiment will be described with reference to FIG. 3. The basic
configuration of the ultrasonic transducer 110a will be described by omitting illustration. The
ultrasonic transducer 110 a is configured to include a backing material, a back electrode, a
piezoelectric element, a front electrode, and an acoustic matching layer in the order of the
ultrasonic radiation direction. That is, the radiation direction side of the piezoelectric element
(hereinafter, referred to simply as “forward”). A front electrode is provided on the front
surface, and an acoustic matching layer is provided in front of the front electrode. A back
electrode is provided on the back of the piezoelectric element, and a backing material is provided
on the back of the back electrode. Further, an electrode lead is drawn from the electrode of the
piezoelectric element to the back surface of the ultrasonic transducer 110a. The end of the
electrode lead is connected to a terminal 110 c (connection pad) formed on the back surface (see
FIG. 3).
[0026]
Further, as shown in FIG. 1, in the case where the ultrasonic wave radiation surface by the
ultrasonic transducer 100 is curved, the ultrasonic transducer 110a is arranged to be inclined at
a predetermined angle with respect to the adjacent ultrasonic transducer 110a. . It is also
possible to arrange the ultrasonic transducers 110a in parallel by a plurality (for example, two
elements), make a group of the transducers into one block, and make an inclination at a
predetermined angle with an adjacent block.
[0027]
A voltage is applied to the front electrode and the back electrode through the rear electronic
circuit (not shown), the electronic circuit 150 in the ultrasonic transducer 100, the connection
lead 132a, etc. based on the signal transmitted from the ultrasonic diagnostic apparatus main
body. . Each of the piezoelectric elements in the ultrasonic transducer 110a converts the applied
electric signal into an ultrasonic pulse. The converted ultrasonic pulse is transmitted to the
subject through the acoustic matching layer and the acoustic lens. Thereafter, when the
ultrasonic transducer 110a receives the reflected wave from the subject, the received reflected
wave is converted into a signal. The converted signals from the respective back electrodes pass
01-05-2019
10
through the flexible substrate 120, the first connection pads 131a of the wiring board block 130,
the connection leads 132a, the second connection pads 133a, and the electronic circuit board
140, and are transmitted to the corresponding electronic circuits 150. Each will be sent. The
detected signals are subjected to addition processing by each of the electronic circuits 150,
reduced in the number of signal paths, and transmitted to the ultrasonic diagnostic apparatus
main body. Details will be described later.
[0028]
<Piezoelectric element> As a piezoelectric element in the ultrasonic transducer 110a, PZT (lead
zirconate titanate / Pb (Zr, Ti) O3), barium titanate (BaTiO3), PZNT (Pb (Zn1 / 3Nb2 / 3)) It is
possible to use O3-PbTiO3 single crystal, PMNT (Pb (Mg1 / 3Nb2 / 3) O3-PbTiO3) single crystal,
or the like.
[0029]
<Backing Material> The backing material absorbs an ultrasonic pulse emitted to the side opposite
to the irradiation direction of the ultrasonic wave at the time of transmitting an ultrasonic pulse,
and suppresses an extra vibration of each piezoelectric element.
As the backing material, an epoxy resin containing PZT powder, tungsten powder, etc., a rubber
filled with polyvinyl chloride or ferrite powder or a resin such as epoxy is impregnated from the
viewpoint of acoustic attenuation, acoustic impedance, etc. Arbitrary materials, such as what was,
can be used.
[0030]
<Acoustic Matching Layer> The acoustic matching layer in the ultrasonic transducer 110a
matches the acoustic impedance of each of the piezoelectric elements with the subject. As this
acoustic matching, one made of a resin material such as epoxy resin can be used. The acoustic
matching layer may be a single layer or may be two or more layers.
[0031]
(Structure Between Ultrasonic Transducer-Flexible Substrate-Wiring Substrate) Next, a
connection structure between the ultrasonic transducer 110a and the flexible substrate 120 in
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11
the ultrasonic transducer 100 according to the present embodiment, and the flexible substrate
120 and the wiring substrate 130a. The connection structure will be described with reference to
FIGS. 1 to 3.
[0032]
As shown in FIG. 2, the flexible substrate 120 is disposed rearwardly adjacent to the ultrasonic
transducer group 110.
Further, a terminal 110 c provided on the back surface of the ultrasonic transducer 110 a and a
third connection pad 121 provided on the front surface of the flexible substrate 120 intervene in
the adjacent portion between the ultrasonic transducer 110 a and the flexible substrate 120.
There is. Further, as shown in FIG. 3, the terminals 110 c and the third connection pads 121 are
connected by a conductive bonding portion 115. The terminal 110 c and the third connection
pad 121 are connected by the bonding portion 115 and conducted. Further, the third connection
pad 121 and the electrode of the piezoelectric element are electrically connected via the terminal
110c.
[0033]
Further, as shown in FIG. 3, the third connection pads 121 on the front surface of the flexible
substrate 120 are electrically connected to the fourth connection pads 123 on the back surface
through the through electrodes (electrode holes) 122. For example, the through electrode 122 is
configured as a through hole or a via hole provided through the flexible substrate 120, and is
connected to the third connection pad 121 on the front surface side of the flexible substrate 120.
Furthermore, the through electrode 122 penetrates the inside of the flexible substrate 120 and is
connected to the fourth connection pad 123 on the back surface at the end opposite to the third
connection pad 121 side. In this manner, conduction is made between the front surface and the
back surface of the flexible substrate 120.
[0034]
Further, as shown in FIG. 2, the wiring board block 130 is disposed adjacent to the rear of the
flexible substrate 120. Further, in the wiring board block 130, a front face group in which the
01-05-2019
12
front face 131 of the wiring board 130a is formed as a series is formed. As shown in FIG. 3, a
first connection pad 131a and a fourth connection pad 123 intervene in a portion adjacent to the
front surface group of the wiring board block 130 and the back surface of the flexible substrate
120. That is, on the front surface 131 of each of the wiring substrates 130a, the first connection
pads 131a are juxtaposed according to the arrangement and position of the fourth connection
pads 123 provided on the back surface of the flexible substrate 120. As shown in FIG. 3, the first
connection pad 131 a and the fourth connection pad 123 are connected by an adhesive 125. The
first connection pad 131a and the fourth connection pad 123 are electrically connected by the
bonding portion 125, and further, the first connection pad 131a and the piezoelectric via the
fourth connection pad 123, the third connection pad 121, and the terminal 110c. Electrical
connection is made with the electrodes of the element.
[0035]
As described above, the ultrasonic transducer 110 a and the wiring substrate block 130 are
connected via the flexible substrate 120 having flexibility. Therefore, the flexible substrate 120 is
bent in accordance with the shape / relief of the back surface of the ultrasonic transducer group
110 and the shape / relief of the front surface of the wiring board block 130. According to such
a configuration, the connection between the terminal 110c and the third connection pad 121 and
the connection between the fourth connection pad 123 and the first connection pad 131a
become easy, and as a result, the terminal 110c and the first connection pad 131a Connection is
also easy. However, depending on the shape of the rear surface of the ultrasonic transducer
group 110 and the front surface 131 of the wiring board block 130, the connection between the
first connection pad 131a and the terminal 110c may not be difficult. In that case, it is also
possible to connect the ultrasonic transducer group 110 and the wiring board block 130 directly
without providing the flexible substrate 120.
[0036]
(Structure of Wiring Board and Wiring Board Block) Next, the wiring board 130a and the wiring
board block 130 in the ultrasonic transducer 100 of the present embodiment will be described
with reference to FIGS. 1, 4 and 5. FIG. FIG. 4 is a schematic perspective view showing an outline
of the wiring board block 130 of the ultrasonic transducer 100 according to the first
embodiment of the present invention. FIG. 5 is a schematic perspective view showing an outline
of a wiring board 130 a of the ultrasonic transducer 100 according to the first embodiment of
the present invention. The arrangement number of the first connection pads 131a and the
number of the wiring boards 130a in the wiring board block 130 of the ultrasonic transducer
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100 shown in each drawing are conceptually shown, and are different from the actual ones. The
number of rows and the number of columns of the first connection pads 131a according to the
terminals 110c are also an example, and other configurations are also possible.
[0037]
The wiring board block 130 in the ultrasonic transducer 100 is an electronic circuit board for
processing signals transmitted to and received from the ultrasonic transducer group 110, and an
electronic circuit board for connecting the electronic circuit 150 and the wiring board block 130.
And 140. That is, the wiring board block 130 is for routing the wiring between the ultrasonic
transducer 110 a of the ultrasonic transducer group 110 and the electronic circuit 150. As
shown in FIG. 4, the wiring board block 130 of the ultrasonic transducer 100 forms a collection
of wiring boards 130a by arranging a plurality of wiring boards 130a adjacent to each other and
combining them. Further, as shown in FIG. 5, in each of the wiring boards 130a, the surfaces
(front surfaces 131) on which the first connection pads 131a are provided are arranged in the
same direction (for example, the column direction), and the surfaces are inclined or It is curved.
With this arrangement, the sloped or curved surfaces are combined to form a series of curved or
convex surfaces. The wiring substrate 130a is inclined and curved in accordance with the
arrangement of the ultrasonic transducers 110a as described later.
[0038]
<Wiring Substrate> As shown in FIG. 5, each of the wiring substrates 130 a in the wiring
substrate block 130 has the widest first plate surface 134 and the second plate surface 132
opposite to the first plate surface 134. The wiring board 130 a also has a side surface 133
substantially orthogonal to the first plate surface 134 and the second plate surface 132, and a
side surface (not shown) opposite to the side surface 133. In addition, the wiring substrate 130a
is a back surface (not shown) orthogonal to the first plate surface 134 and the side surface 133,
and a surface opposite to the back surface, which is a curved surface or a surface inclined with
respect to the back surface. And 131. That is, the wiring board 130a is formed in a thick plate
shape including the first plate surface 134, the second plate surface 132, the side surface 133,
the front surface 131, and the back surface.
[0039]
As the wiring substrate 130a, a material such as aluminum, hard resin, ceramic or the like which
can ensure the shape accuracy is used.
01-05-2019
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[0040]
In each of the wiring boards 130a in the wiring board block 130, the length in the direction from
the back surface to the front surface 131 is longer than the length between the opposing side
surfaces.
In the following, for convenience of description, the length in the direction from the back surface
to the front surface 131 in the wiring substrate 130a is described as "height", and the length
between opposing side surfaces is described as "width".
[0041]
Further, as shown in FIG. 4, the heights of the respective wiring boards 130a are not uniform,
and the wiring board 130a located at the center of the arrangement of the wiring boards 130a in
the wiring board block 130 is formed the highest. Further, as shown in FIG. 4, the height of the
wiring substrate 130 a gradually decreases as going from the wiring substrate 130 a located at
the center to both ends of the arrangement. By arranging and combining such wiring boards
130a, the front surface 131 of each wiring board 130a is continuous and forms a continuous
curved surface or convex surface. As shown in FIG. 4, the first plate surface 134 of each wiring
substrate 130a and the second plate surface 132 of the adjacent wiring substrate 130a are
formed to have substantially the same height, and the adjacent front surfaces 131 By arranging
so that the respective edge portions of each other are continuous, the curved surface of the
wiring board block 130 with a smaller level difference is formed.
[0042]
Further, the front surface of the wiring board block 130 composed of a collection of the front
surfaces 131 of the wiring board 130 a is formed in accordance with the shape of the back side
of the ultrasonic transducer group 110. When the back surface of the ultrasonic transducer
group 110 is not curved, that is, when steps are provided in a step-like manner to arrange the
respective ultrasound transducers 110a, the front surface of the wiring board block 130 is
matched to the shape of the back surface. Is also formed in steps. At this time, the heights of the
second plate surface 132 and the first plate surface 134 of the adjacent wiring boards 130a are
01-05-2019
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formed to be different.
[0043]
<First Connection Pad> Further, as shown in FIGS. 4 and 5, on the front surface of the wiring
board 130a, first connection pads 131a are provided at a predetermined arrangement interval.
The arrangement interval of the first connection pads 131a is, for example, the same as the
arrangement interval of the ultrasonic transducers 110a. However, in the case where the
arrangement spacing of the fourth connection pads 123 is wider than the arrangement spacing
of the third connection pads 121 by the flexible substrate 120, the arrangement spacing of the
first connection pads 131 a is the same spacing as the fourth connection pads 123. And the
distance is wider than the distance between the ultrasonic transducers 110a.
[0044]
Although the illustrated first connection pads 131a are arranged in one row and at the center of
the front surface 131, the present invention is not limited to this configuration. For example,
depending on the thickness of the wiring substrate 130a, it is also possible to arrange a plurality
of rows of first connection pads 131a on the front surface 131. Moreover, it is also possible to
arrange the first connection pads 131a in a biased manner not at the center of the front surface
131 but at the edge of the front surface 131.
[0045]
<Connection Lead> Further, as shown in FIGS. 1, 4 and 5, the connection lead 132a is drawn out
from the first connection pad 131a on the front surface 131 of the wiring substrate 130a. For
example, as shown in FIG. 5, the connection leads 132 a pass from the front surface 131 of the
wiring substrate 130 a to the second plate surface 132 and are drawn out to the second
connection pads 133 a of the side surface 133. Further, the arrangement interval of the
connection leads 132a on the second plate surface 132 is, for example, the arrangement interval
of the first connection pads 131a up to the middle of the second plate surface 132 as shown in
FIG. 5, and then the arrangement of the second connection pads 133a. The space is extended
according to the space.
01-05-2019
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[0046]
<Second Connection Pad> Further, as shown in FIGS. 4 and 5, second connection pads 133a are
provided on the side surface 133 of the wiring board 130a at a predetermined arrangement
interval. The arrangement interval of the second connection pads 133a can be wider than the
interval of the first connection pads 131a as shown in FIG. 5 as an example. This is because it is
possible to form the side surface 133 longer than the front surface 131 in each of the wiring
substrates 130a. Further, the arrangement intervals of the second connection pads 133a do not
have to be equal intervals. For example, in the arrangement of the connection pads of the
electronic circuit board 140, the arrangement intervals may be extended for each of a plurality It
is possible to match. It is also possible to bias the arrangement of the second connection pads
133 a not to the center of the side surface 133 but to the edge of the side surface 133. In
addition, on the side surface 133, it is also possible to arrange the second connection pads 133a
in a plurality of rows in the same manner as the first connection pads 131a.
[0047]
As described above, in the ultrasonic transducer 100 according to the present embodiment, the
first connection pad 131a is provided on the front surface 131 of the substantially thick wiring
board 130a, and from the first connection pad 131a to the second plate surface 132 The
connection lead 132a is pulled out. The connection lead 132 a is also connected to the second
connection pad 133 a of the side surface 133. Further, the wiring substrate 130a is arranged
such that the side surfaces 133 are continuous, and the respective side surfaces 133 are
gathered and continuous to form a substantially flat surface in the wiring substrate block 130.
The electronic circuit board 140 and the electronic circuit 150 are disposed on the side surface.
When the ultrasonic transducer group 110 is curved or convex, the front surface of the wiring
board block 130 corresponds to the shape of the rear surface of the ultrasonic transducer group
110 and is disposed on the front surface. The one connection pad 131a is electrically connected
to each of the ultrasonic transducers 110a.
[0048]
With such a configuration, regardless of the shape of the back surface of the ultrasonic
transducer group 110, the connection between the wiring substrate block 130 and the electronic
circuit 150 is the second connection pad disposed on the substantially planar side surface of the
wiring substrate block 130. It is done between 133a. Further, the connection leads 132a drawn
01-05-2019
17
from the respective wiring boards 130a are connected to the second connection pads 133a on
the side surface of the wiring board block 130 in this embodiment.
[0049]
Therefore, by arranging the electronic circuit 150 on the substantially planar side surface of the
wiring board block 130, the electronic circuit 150 is electrically connected to each of the
ultrasonic transducers 110a of each array in the ultrasonic transducer group 110 on the side
surface. As a result, it is possible to realize an ultrasonic transducer of a two-dimensional array
because it does not require an electronic circuit specific to the ultrasonic transducer
corresponding to the array shape of the ultrasonic transducers 110a or a large electronic circuit.
[0050]
(Configuration of Electronic Circuit Board and Electronic Circuit) Next, the electronic circuit
board 140 and the electronic circuit 150 in the ultrasonic transducer 100 of the present
embodiment will be described with reference to FIGS. 1 and 4. The electronic circuit 150 in the
ultrasonic transducer 100 is connected to the side surface of the wiring board block 130 via the
electronic circuit board 140. Similar to the flexible substrate 120, the electronic circuit substrate
140 is provided with connection pads on both the surface (back surface) opposite to the side
surface and the surface 141 on the opposite side. The connection pads (not shown) on the back
surface of the electronic circuit board 140 are provided in accordance with the arrangement of
the second connection pads 133a. The connection pad is connected to the second connection pad
133a, and electrically connected to the terminal 110c of the ultrasonic transducer 110a via the
second connection pad 133a, the connection lead 132a, the first connection pad 131a, and the
like.
[0051]
Further, the connection pads on the back surface of the electronic circuit board 140 are drawn
out to the surface 141 of the electronic circuit board 140 by through electrodes (not shown)
penetrating the electronic circuit board 140, as in the flexible board 120. Further, the through
electrode drawn to the surface 141 is connected to the electronic circuit 150 (FIGS. 1 and 2)
disposed on the surface 141. Thus, the electronic circuit 150 is electrically connected to the
terminal 110c of the ultrasonic transducer 110a through the electronic circuit board 140, the
01-05-2019
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second connection pad 133a, the connection lead 132a, and the first connection pad 131a.
[0052]
(Outline of Connection with Ultrasound Diagnostic Apparatus Body, Etc.) Next, an overview of the
connection between the ultrasound transducer 100 and the ultrasound diagnostic apparatus
body in the embodiment will be described. In the following description, illustration is omitted.
[0053]
The ultrasonic probe (not shown) in the present embodiment includes the ultrasonic transducer
100, a cable connecting the ultrasonic diagnostic apparatus main body and the ultrasonic probe,
a relay portion (not shown), and the like. Further, the ultrasonic transducer 100 and the
ultrasonic diagnostic apparatus main body are connected via the electronic circuit 150, a relay
portion of the ultrasonic probe, a cable, and the like. The relay unit includes, for example, an
electronic circuit that transmits a signal to and from the electronic circuit 150, a connection
portion with a cable, and the like. This cable is a transmission path of signals to and from the
ultrasonic probe. Moreover, it is conducted with the electronic circuit 150 through the
connection portion of the relay unit. Further, the cable and the ultrasonic diagnostic apparatus
main body are connected via a connector.
[0054]
Next, an outline of the flow of signals transmitted and received between the above-described
ultrasonic probe and the ultrasonic diagnostic apparatus main body and an outline of the
operation of the ultrasonic probe will be described.
[0055]
The transmission unit of the ultrasonic diagnostic apparatus main body has a voltage circuit and
a pulser circuit that repeatedly generates rate pulses of a predetermined rate frequency.
The transmitting unit transmits the rate pulse to the ultrasonic probe via a cable, a connector or
the like. The rate pulse is for generating an ultrasonic wave emitted by each of the ultrasonic
01-05-2019
19
transducers 110 a of the ultrasonic transducer 100.
[0056]
The relay unit of the ultrasonic probe and the electronic circuit 150 receive a signal including a
rate pulse transmitted from the ultrasonic diagnostic apparatus main body. The relay unit and
the electronic circuit 150 are connected to the ultrasonic transducer group 110 via the electronic
circuit board 140 and the wiring board block 130. The signal received from the ultrasonic
diagnostic apparatus main body via the relay unit and the electronic circuit 150 is sent to the
terminal 110 c via the wiring board 130 a and the flexible board 120. Further, when a voltage
based on the rate pulse is applied from the terminal 110c to the front electrode and the back
electrode of each of the ultrasonic transducers 110a, the piezoelectric element is driven and the
applied voltage is converted into an ultrasonic pulse. . The converted ultrasonic pulse is
transmitted to the subject through the acoustic matching layer and the acoustic lens (not shown).
In this manner, the relay unit of the ultrasonic probe and the electronic circuit 150 transmit the
ultrasonic beam to the ultrasonic transducer 100.
[0057]
Thereafter, when the ultrasonic transducer 100 receives a reflected wave from the subject, the
piezoelectric element is excited by the received reflected wave, and the reflected wave is
converted into a signal. The signal from each of the converted ultrasonic transducers 110 a is
transmitted to each corresponding electronic circuit 150. The detected signals are subjected to
addition processing by each of the electronic circuits 150 to reduce the number of signal paths,
and then transmitted to the ultrasonic diagnostic apparatus main body through the relay unit.
[0058]
The receiving unit of the ultrasonic diagnostic apparatus main body receives a signal based on
the reflected wave from the object processed by the electronic circuit 150 or the relay unit in the
ultrasonic probe. Further, the receiving unit amplifies the signal and performs digital conversion
processing, and then stores the processed signal in one end memory. Furthermore, in the signal,
the delay time for focusing the reflected ultrasound wave from a predetermined depth to the
signal and the delay time for deflection for sequentially changing the reception directivity of the
reflected ultrasound wave give. Further, phasing and addition (the received signal obtained from
01-05-2019
20
a predetermined direction is subjected to an adding process after being phase-matched) are
performed on such beamformed output.
[0059]
Furthermore, the ultrasonic diagnostic apparatus performs B-mode signal processing to generate
displayable ultrasonic image data, or performs Doppler signal processing, and based on the data
of blood flow information, average velocity image, dispersed image, power Generate an image, or
a combination of these.
[0060]
(Operation and Effect) The operation and effect of the ultrasonic transducer 100 according to the
first embodiment described above and the ultrasonic probe including the ultrasonic transducer
100 will be described.
[0061]
As described above, in the ultrasonic transducer 100 according to the first embodiment, the
wiring board block 130 in which a plurality of thick wiring boards 130 a are arranged is
provided on the back side of the ultrasonic transducer group 110.
The wiring board block 130 has a shape in which the front surface 131 corresponds to the shape
of the rear surface of the ultrasonic transducer group 110.
Furthermore, the front surface 131 is provided with a first connection pad 131a electrically
connected to the terminal 110c of the ultrasonic transducer 110a. Further, connection leads
132a are drawn from the first connection pads 131a to the second connection pads 133a
provided on the side surfaces of the wiring board block 130. The side surface of the wiring board
block 130 is substantially planar in which the planar wiring board 130 a is connected in a series,
and the second connection pads 133 a arranged on the side face further include the electronic
circuit board 140. Thus, the electronic circuit 150 is conducted.
[0062]
01-05-2019
21
Therefore, even if the ultrasonic transducer group 110 is curved or convex, the electronic circuit
150 that transmits and receives signals to and from the ultrasonic transducer 110a can be
disposed on the substantially planar side surface. Furthermore, since the connection leads 132a
drawn from the ultrasonic transducers 110a are gathered on the side surface of the wiring board
block 130, the connection between the electronic circuit 150 and the subsequent electronic
circuit (relay unit etc.) becomes easy and connection is made Wiring of the leads 132a is also
facilitated. As a result, regardless of the number and arrangement of the ultrasonic transducers
110 a of the ultrasonic transducer group 110 in the ultrasonic transducer 100, it is possible to
realize the ultrasonic transducer 100 in a two-dimensional arrangement.
[0063]
Furthermore, since it is not necessary to mount the electronic circuit 150 directly on the
ultrasonic transducer group 110 in order to reduce the number of signal paths from the
ultrasonic transducer 110a, a dedicated IC (ASIC) is developed for each specification of the
ultrasonic transducer There is no need to do it. In addition, it is possible to reduce the size (area,
etc.) of one electronic circuit and to process all the elements of the ultrasonic transducer 100
using a plurality of ICs. Therefore, development costs, manufacturing costs, product costs and the
like are reduced.
[0064]
The ultrasonic transducer 110a and the wiring board block 130 are connected via a flexible
substrate 120 having flexibility. Therefore, the flexible substrate 120 is bent in accordance with
the shape / relief of the back surface of the ultrasonic transducer group 110 and the shape /
relief of the front surface of the wiring board block 130. As a result, the connection between the
terminal 110c of the ultrasonic transducer group 110 and the first connection pad 131a is
facilitated.
[0065]
Second Embodiment Next, an ultrasonic transducer 200 and an ultrasonic probe provided with
the ultrasonic transducer 200 according to a second embodiment of the present invention will be
described with reference to FIGS. FIG. 6 is a schematic perspective view showing an outline of an
ultrasonic transducer 200 according to a second embodiment of the present invention. FIG. 7 is a
01-05-2019
22
schematic exploded perspective view showing an outline of an ultrasonic transducer 200
according to a second embodiment of the present invention. FIG. 8 is a schematic cross-sectional
view showing an outline of a connection state of the ultrasonic transducer 210a and the wiring
substrate 230a through the flexible substrate 220 in the ultrasonic transducer 200 according to
the second embodiment of the present invention. FIG. 9 is a schematic perspective view showing
an outline of a wiring board block 230 of an ultrasonic transducer 200 according to a second
embodiment of the present invention. FIG. 10 is a schematic perspective view showing an outline
of a wiring board 230a of an ultrasonic transducer 200 according to a second embodiment of the
present invention. In the second embodiment, parts different from the first embodiment will be
mainly described, and the description of the other overlapping parts may be omitted.
[0066]
(Outline of Overall Configuration) As shown in FIGS. 6 and 7, in the ultrasonic transducer 200
according to the second embodiment as well, an ultrasonic transducer group formed by
arranging ultrasonic transducers 210 a in a two-dimensional manner. It has 210. In addition, the
entire shape of the ultrasonic transducer group 210 can be configured to be convex or arcshaped.
[0067]
Further, as shown in FIGS. 6 and 7, the flexible substrate 220 is disposed adjacent to the rear
side of the ultrasonic transducer group 210, and the thick wiring board 230a is arranged behind
the flexible substrate 220. The wiring board block 230 configured as described above is
disposed.
[0068]
An electronic circuit board 240 is provided on the side surface of the wiring board block 230.
Further, the wiring substrate block 230 of the second embodiment is also combined with the
wiring substrate 230a in the same manner as in the first embodiment, thereby forming a
substantially planar side surface group in which the side surfaces 233 of the wiring substrates
230a are connected. It is done. The electronic circuit board 240 is installed for this side group.
An electronic circuit 250 is provided on the surface 241 of the electronic circuit board 240.
01-05-2019
23
[0069]
As shown in FIGS. 7 and 8, each of the ultrasonic transducers 210a of the ultrasonic transducer
group 210 is electrically connected to the third connection pad 221 of the flexible substrate 220
disposed on the rear side via the terminal 210c. . The third connection pad 221 shown in FIG. 7
is drawn to the back surface of the flexible substrate 220 by the through electrode 222 (see FIG.
8) provided on the flexible substrate 220, and the fourth connection pad 223 (FIG. 8) is
conducted.
[0070]
As shown in FIG. 8, the fourth connection pads 223 disposed on the back surface of the flexible
substrate 220 are connected to the first connection pads 231 a formed on the front surface 231
of each wiring substrate 230 a in the wiring substrate block 230 and are conductive. Be done.
Further, a connection lead 232a which is passed through the second plate surface 232 and the
side surface 233 is connected to the first connection pad 231a. The connection lead 232a is
provided from the first connection pad 231a to the second connection pad 233a through the
second plate surface 232 of each wiring substrate 230a. Therefore, the first connection pad 231a
and the second connection pad 233a are electrically connected by the connection lead 232a.
[0071]
The correspondence between each part in the second embodiment and the present invention is
the same as the correspondence in the first embodiment.
[0072]
Wiring Board Block and Wiring Board Next, the wiring board block 230 and the wiring board
230a in the ultrasonic transducer 200 according to the second embodiment will be described
with reference to FIG. 6, FIG. 9 and FIG.
The arrangement number of the first connection pads 231a and the number of the wiring boards
230a in the wiring board block 230 of the ultrasonic transducer 200 shown in each drawing are
conceptually shown, and are different from the actual ones. Further, the number of rows and the
01-05-2019
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number of columns of the first connection pads 231a according to the terminal 210c are also an
example, and other configurations are also possible.
[0073]
The wiring board block 230 in the ultrasonic transducer 200 according to the second
embodiment is for conducting wiring between the electronic circuit 250 and each of the
ultrasonic transducers 210a. As shown in FIG. 9, in the ultrasonic transducer 200, a plurality of
wiring boards 230a are arranged side by side and combined adjacently to form an aggregate to
form a wiring board block 230. Further, as shown in FIGS. 9 and 10, in the wiring substrate block
230, the front surface 231 of the wiring substrate 230a having a curved or convex shape formed
in accordance with the shape of the back surface of the ultrasonic transducer group 210 is in the
same direction. It is combined to be arranged toward the direction.
[0074]
Further, as shown in FIG. 10, each of the wiring substrates 230a in the second embodiment has
the widest first plate surface (not shown) and the opposite second plate surface 232, similarly to
the wiring substrate 130a in the first embodiment. And has a side surface 233 substantially
perpendicular to the first plate surface and the second plate surface 232 and an opposite side
surface (not shown). The wiring substrate 230a also has a back surface (not shown) orthogonal
to the second plate surface 232 and the side surface 233, and a front surface 231 opposite to the
back surface. That is, the wiring substrate 230a is formed in a thick plate shape including the
first plate surface, the second plate surface 232, the side surface 233, the front surface 231, and
the back surface.
[0075]
However, the heights of the wiring boards 230a in the second embodiment are substantially
uniform. That is, as shown in FIG. 7, the front surface 231 of the wiring substrate 230a in the
second embodiment corresponds to the array shape of the ultrasonic transducers 210a in the
portion of the back surface of the ultrasonic transducer group 210 facing the front surface 231.
It is formed in shape. For example, as shown in FIG. 7, if the arrangement of the ultrasonic
transducer group 210 is arc-shaped, the shape of the front surface 231 of the wiring substrate
230 a is adjusted to the shape of the opposing surface (rear surface) of the ultrasonic transducer
01-05-2019
25
group 210. It is formed in an arc shape. However, in the two-dimensional array of the ultrasonic
transducers 210a, if the array shape is curved or convex in both the row direction and the
column direction, the wiring board 230a at the center of the array of the wiring board block 230
is the most In some cases, the wiring board 230a may be formed to be higher and to gradually
decrease in height toward the end of the array.
[0076]
Further, as shown in FIGS. 9 and 10, the relationship between the width and height of each of the
wiring boards 230a in the wiring board block 230 is different from the example of the wiring
board 130a in the first embodiment, and Not exclusively. For example, the height of the wiring
substrate 230a shown in FIG. 10 is longer than its width.
[0077]
The configuration of the second plate surface 232, the connection lead 232a, the side surface
233, the second connection pad 233a, the electronic circuit board 240, and the electronic circuit
250 and their connection are the same as in the first embodiment, and thus the description is
omitted. Do.
[0078]
(Operation and Effect) The operation and effect of the ultrasonic probe including the ultrasonic
transducer 200 according to the second embodiment described above will be described.
[0079]
Also in the ultrasonic transducer 200 according to the second embodiment described above, the
electronic circuit 250 can be disposed substantially in the plane when the ultrasonic transducer
group 210 has a curved surface or a convex surface.
Furthermore, since the connection leads 232a are gathered on the side surface of the wiring
board block 230, the connection between the electronic circuit 250 and the subsequent
electronic circuit (relay unit etc.) is facilitated, and the wiring of the connection leads 232a is also
facilitated.
01-05-2019
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As a result, regardless of the number and arrangement of the ultrasonic transducers 210 a of the
ultrasonic transducer group 210 in the ultrasonic transducer 200, an ultrasonic probe 200
including the ultrasonic transducer 200 and the ultrasonic transducer 200 in a two-dimensional
array is obtained. It becomes possible to realize.
[0080]
Further, since it is not necessary to mount the electronic circuit 250 directly on the ultrasonic
transducer group 210, there is no need to develop a dedicated IC (ASIC) for each specification of
the ultrasonic transducer. Further, the size of one electronic circuit 250 can be reduced.
Therefore, development costs, manufacturing costs, product costs and the like are reduced.
[0081]
Further, since the ultrasonic transducer 210a and the wiring substrate block 230 are connected
via the flexible substrate 220 having flexibility, the connection between the terminal 210c of the
ultrasonic transducer group 210 and the first connection pad 231a Becomes easy.
[0082]
Third Embodiment Next, an ultrasonic transducer 300 and an ultrasonic probe provided with the
ultrasonic transducer 300 according to a third embodiment of the present invention will be
described with reference to FIGS. 11 to 14.
FIG. 11 is a schematic perspective view showing an outline of an ultrasonic transducer 300
according to a third embodiment of the present invention. FIG. 12 is a schematic exploded
perspective view showing an outline of an ultrasonic transducer 300 according to a third
embodiment of the present invention. FIG. 13 is a schematic perspective view showing an outline
of a wiring board block 330 of an ultrasonic transducer 300 according to a third embodiment of
the present invention. FIG. 14 is a schematic perspective view showing an outline of a wiring
board 330 a of an ultrasonic transducer 300 according to a third embodiment of the present
invention. In the third embodiment, parts different from the first embodiment and the second
embodiment will be mainly described, and the description of the other overlapping parts may be
omitted.
01-05-2019
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[0083]
(Outline of Overall Configuration) As shown in FIGS. 11 and 12, in the ultrasonic transducer 300
according to the third embodiment as well, an ultrasonic transducer group in which ultrasonic
transducers 310 a are two-dimensionally arrayed. It has 310. Further, the entire shape of the
ultrasonic transducer group 310 can be configured to be convex or arc-shaped.
[0084]
Further, as shown in FIGS. 11 and 12, as in the first and second embodiments, the ultrasonic
transducers 310 a of the ultrasonic transducer group 310 and the wiring substrate block 330 are
connected via the flexible substrate 320. It is done. Further, as shown in FIGS. 13 and 14, the
wiring board block 330 is configured by arranging thick board-like wiring boards 330a.
[0085]
However, as shown in FIGS. 11 and 12, unlike the first embodiment and the second embodiment,
an electronic circuit board 340 is provided for the back surface group 335 in the wiring board
block 330 of the third embodiment. Ru. That is, in the wiring board block 330 in the third
embodiment, a substantially planar back face group 335 configured by connecting the back faces
of the respective wiring boards 330a is formed by combining the wiring boards 330a. In
addition, an electronic circuit board 340 is provided for the back surface group 335. On the back
surface 342 of the electronic circuit board 340, fifth connection pads 342a are formed
corresponding to the second connection pads (not shown) arranged in the back surface group
335 of the wiring board block 330. Further, an electronic circuit (not shown) is provided on the
surface (not shown) of the electronic circuit board 340.
[0086]
The connection configuration between each of the ultrasonic transducers 310a of the ultrasonic
transducer group 310, the flexible substrate 320, and the front surface 331 of the wiring
substrate block 330 is the same as in the first and second embodiments. I will omit the
explanation. Further, the correspondence between each part in the third embodiment and the
01-05-2019
28
present invention is the same as the correspondence in the first embodiment and the second
embodiment.
[0087]
Wiring Board Block and Wiring Board Next, with reference to FIGS. 11, 13 and 14, the wiring
board block 330 and the wiring board 330a in the ultrasonic transducer 300 of the third
embodiment will be described. The arrangement number of the first connection pads 331a and
the number of the wiring boards 330a in the wiring board block 330 of the ultrasonic transducer
300 shown in each drawing are conceptually shown, and are different from the actual ones. The
number of rows and the number of columns of the first connection pads 331a according to the
terminals (not shown) on the back of the ultrasonic transducer 310a are also an example, and
other configurations are possible.
[0088]
In the wiring board block 330 according to the third embodiment, as shown in FIG. 13, the
wiring board block 330 of the ultrasonic transducer 300 forms an assembly by arranging a
plurality of wiring boards 330 a side by side and combining them. To form a wiring board block
330. Further, as shown in FIGS. 13 and 14, in the wiring board block 330, the front surface 331
of the wiring board 330a having a curved or convex shape formed in accordance with the shape
of the back surface of the ultrasonic transducer group 310 is in the same direction. It is
combined to be arranged toward the direction.
[0089]
Further, as shown in FIG. 13, each of the wiring substrates 330 a in the third embodiment has
the widest first plate surface (not shown) and the opposite second plate surface 332 in the same
manner as the wiring substrate 330 a in the first embodiment. And has a side surface 333
substantially orthogonal to the first plate surface and the like and the second plate surface 332
and a side surface (not shown) opposite thereto. Further, the wiring substrate 330 a has a back
surface orthogonal to the second plate surface 332 and the side surface 333 and a front surface
331 opposite to the back surface. That is, the wiring board 330a is formed in a thick plate shape
including the first plate surface, the second plate surface 332, the side surface 333, the front
surface 331, and the back surface.
01-05-2019
29
[0090]
Further, as shown in FIG. 14, the height of the wiring substrate 330 a in the third embodiment is
almost the same as in the second embodiment. Further, similarly to the second embodiment, the
front surface 331 of the wiring substrate 330a in the third embodiment is also formed in a shape
corresponding to the shape of the portion where the front surface 331 is opposed to the
ultrasonic transducer group 310. There is. Further, as in the second embodiment, in the twodimensional arrangement of the ultrasonic transducers 310a, the wiring substrate at the center
of the arrangement of the wiring substrate block 330 if it is curved or convex in both the row
direction and the column direction. In some cases, the height 330 a is formed the highest, and
the height of the wiring substrate 330 a gradually decreases toward the end of the array. The
relationship between the width and height of each of the wiring substrates 330 a in the wiring
substrate block 330 is the same as that of the wiring substrate 230 a in the second embodiment.
[0091]
Here, in the wiring board block 330 according to the third embodiment, the second plate surface
332, the connection lead 332a, the side surface 333, the second connection pad (not shown), the
electronic circuit board 340, and the electronic circuit configuration and their connection
relation Is different from the first embodiment and the second embodiment. These configurations
are described below.
[0092]
As shown in FIGS. 12 to 14, in the wiring board 330 a in the wiring board block 330, the second
connection pad is not formed on the side surface 333. The second connection pads are arranged
in the back face group 335 in the wiring board block 330. That is, on the back surface of the
wiring substrate 330a, second connection pads (not shown) are formed at substantially the same
arrangement intervals as the first connection pads 331a. Therefore, the connection lead 332a on
the second plate surface 332 is drawn out from the first connection pad 331a of the front
surface 331 in a substantially straight line, and goes to the back surface of the wiring substrate
330a. Further, the second connection pads arranged on the back surface of the wiring substrate
330a are connected to the connection leads 332a.
01-05-2019
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[0093]
Further, as shown in FIG. 12, the second connection pads arranged in the back surface group
335 of the wiring board block 330 and the fifth connection pads 342a arranged in the back
surface 342 of the electronic circuit board 340 are connected to each other. Conducted with the
electronic circuitry on the surface of the The connection configuration between the second
connection pad and the electronic circuit via the electronic circuit board 340 is the same as that
of the first embodiment and the second embodiment, and thus the description thereof will be
omitted.
[0094]
The wiring substrate 330a of the wiring substrate block 330 in the third embodiment is not
limited to the configuration as shown in FIGS. 13 and 14, and may be, for example, a
configuration like the wiring substrate 130a in the first embodiment.
[0095]
(Operation and Effect) The operation and effect of the ultrasonic probe including the ultrasonic
transducer 300 according to the third embodiment described above will be described.
[0096]
Also in the ultrasonic transducer 300 according to the third embodiment described above, when
the ultrasonic transducer group 310 has a curved surface or a convex surface, the electronic
circuit can be disposed substantially in a plane.
Furthermore, since the connection leads 332a are gathered in the back surface group 335 of the
wiring board block 330, the connection between the electronic circuit and the subsequent
electronic circuit (relay unit etc.) is facilitated, and the wiring of the connection leads 332a is also
facilitated.
As a result, regardless of the number and arrangement of the ultrasonic transducers 310a of the
ultrasonic transducer group 310 in the ultrasonic transducer 300, it is possible to realize the
ultrasonic transducers 300 in a two-dimensional arrangement.
01-05-2019
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[0097]
Furthermore, since it is not necessary to mount the electronic circuit directly on the ultrasonic
transducer group 310, there is no need to develop a dedicated IC (ASIC) for each specification of
the ultrasonic transducer. It is also possible to reduce the size of one electronic circuit. Therefore,
development costs, manufacturing costs, product costs and the like are reduced.
[0098]
Further, since the ultrasonic transducer 310a and the wiring substrate block 330 are connected
via the flexible substrate 320 having flexibility, the connection between the terminal of the
ultrasonic transducer group 310 and the first connection pad 331a is It becomes easy.
[0099]
MODIFIED EXAMPLE Next, the modified example of the ultrasonic transducer of 1st
Embodiment-3rd Embodiment mentioned above is demonstrated with reference to FIG. 15 (A)
and FIG. 15 (B).
FIG. 15A is a schematic perspective view showing an outline of a wiring board of an ultrasonic
transducer according to a modification of the first embodiment of the present invention. FIG. 15B
is a schematic perspective view showing an outline of a wiring board of an ultrasonic transducer
according to a modification of the second embodiment and the third embodiment of the present
invention.
[0100]
As shown in FIG. 5, FIG. 10, and FIG. 13, in the above-described ultrasonic transducer, the second
connection pad is formed only on one surface (side surface 133, side surface 233, rear surface
group 335, etc.). The ultrasonic transducer of is not limited to this configuration. For example, as
shown in FIG. 15 (A) or FIG. 15 (B), it is also possible to arrange the second connection pads on
two surfaces of the side surface and the opposite side surface. Alternatively, it is also possible to
arrange the second connection pads on the two sides of the side and the back. It is also possible
01-05-2019
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to pull out the second connection pads on the three sides of the wiring board block. In this case,
the connection lead 132a drawn out from the first connection pad is formed in accordance with
the arrangement of the second connection pad.
[0101]
Also in this modification, as in the ultrasonic transducers of the first to third embodiments
described above, regardless of the number and arrangement of ultrasonic transducers of the
ultrasonic transducers in the ultrasonic transducer group in the ultrasonic transducers, twodimensional It is possible to realize an ultrasound probe comprising an array of ultrasound
transducers and an ultrasound transducer. Further, in this modification, since the connection
leads are drawn out on a plurality of surfaces, the connection leads can be easily routed, and it is
possible to provide an allowance in the arrangement interval of the second connection pads.
[0102]
Further, the connection lead is not limited to the configuration in which the connection lead is
pulled out from the second plate surface to the second connection pad, and for example, the
connection lead may be pulled out via both the second plate surface and the first plate surface. In
this case, an insulating sheet or the like is provided between the wiring boards.
[0103]
Further, in the ultrasonic transducers according to the first to third embodiments described
above, from the viewpoint of adjustment of alignment with the ultrasonic transducers, one row or
one row in a two-dimensional array of ultrasonic transducers is provided. Against One wiring
board is allocated. However, if it is not difficult to adjust the alignment, it is also possible to
assign one wiring board to a plurality of arrays of ultrasonic transducers, such as assigning one
wiring board to two rows of ultrasonic transducers, for example. It is possible.
[0104]
100, 200, 300 Ultrasonic Transducers 110, 210, 310 Ultrasonic Transducers 110a, 210a, 310a
Ultrasonic Transducers Group 110c, 210c Terminals 120, 220, 320 Flexible Substrates 121,
221, 321 Third Connection Pads 122, 222 Through electrodes 123, 223 fourth connection pad
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130, 230, 330 wiring board block 130a, 230a, 330a wiring board 131, 231, 331 front surface
131a, 231a, 331a first connection pad 132, 232, 332 second plate surface 132a, 232a, 332a
connection lead 133, 233, 333 side surface 133a, 233a second connection pad 134 first plate
surface 140, 240, 340 electronic circuit board 141, 241 surface 150, 250 electronic circuit 335
back surface group 34 Backside 342a fifth connecting pads
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