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JPS56176588

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DESCRIPTION JPS56176588
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view and a back view of a speaker main
body showing a conventional example, FIG. 2 is a longitudinal sectional side view of the speaker
main body showing one embodiment of the present invention, FIG. Is a rear view of the speaker
main body, FIG. 4 is an enlarged sectional view showing an essential part of the present
invention, and FIGS. 5 and 6 are a rear view and a longitudinal side view of the speaker main
body showing another embodiment of the present invention. FIG. 7 ииииии Speaker body, 8-----Speaker frame, 11 иии Speaker holding bracket, 18 иии Conductive plate.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a speaker
mounting apparatus capable of removing lead wiring processing and performing work on a part.
As shown in FIGS. 1 (a) and (1), for example, a conventional mounting apparatus of this type is
provided with a speaker 3 via a screw 3 in a dowel 2 protrudingly provided on the back surface
of the cover 1 of a television receiver. The main body number is fixed, and the lead wire 6 is
soldered to the back surface of the speaker main body 4 via the insulating plate 5 or is
configured using a fixing bracket (not shown). However, with this conventional device, it is very
difficult to pull out the lead wire etc., and due to the requirements of this food safety standard, it
is extremely difficult for the mounting work of 1- and 7 / no. . By the way, in audio and electric
appliances, etc., wiring processing is adopted in which electronic components such as capacitors
and resistance rings are inserted on a substrate and soldered and fixed, and wiring processing is
streamlined and workability is improved. However, if such a wiring process can be applied to the
attachment of the speaker, it is desirable to rationalize the sensible force installation work. The
present invention has been made in view of the above-described point, and has a conductive
speaker holding bracket supported by a conductive plate, fixes the speaker holding bracket to the
speaker frame, and mounts the speaker main body by K SUMMARY OF THE INVENTION It is an
object of the present invention to provide a speaker pad attachment which can easily attach a
speaker and can improve the workability of this type of attachment operation. Hereinafter, an
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embodiment of the present invention will be described with reference to the drawings. In FIGS. 2
to 4, reference numeral 7 is a speaker main body, and an elongated insulating plate 9 made of
bakelite is lower at the lower end of the speaker frame 8; It is caulked and fixed. In this case, the
shape of the eyelet 10 is a polygon having a quadrangular shape or the like to prevent the
insulating plate 9 from rotating. Thus, the speaker main body 7 is attached by the conductive
speaker holder 111C disposed at both ends of the insulating plate 90. That is, a through hole for
inserting the tinsel wire 13 is formed at the lower end portion of the speaker frame 8 via the
eyelet 14 protruding from the speaker cone 12 and a square shape for receiving the square
eyelet 14 at both ends of the insulating plate 90 The insertion holes 15 are formed, and the tinsel
wire u7 inserted in the eyelet 14 and the eyelet 14 is fixed by soldering 16. In this case, it is
desirable that the notches 14 be formed integrally with the front end portion of the holding
metal fitting 11 <, and by forming the flange fi11 on the holding metal fitting 11, the rigidity of
the holding metal fitting U is enhanced. It is desirable to use as a positioning stopper for
In addition, the river is a conductive plate of a steel ring disposed on the lower surface of the
substrate 17, the ? is soldered to the end of the holding member 11 inserted into the through
hole of the substrate 17 fixed to the conductive plate, 3-21 is It is a yoke that accommodates a
magnetic circuit disposed on the back surface of the speaker body 7. In the speaker mounting
device according to the present invention configured as described above, when mounting the
speaker, the insulating plate 9 is attached by caulking the two-way fitting 10 to the lower end
portion of the speaker frame 8 and the eyelet provided at the tip of the speaker holding bracket
11 14 is inserted into the through hole of the insulating plate 9 through the through hole V of
the insulating plate 9, and the tinsel wire 13 is inserted into the eyelet 14. Then, the tip of the
eye 14 is caulked, the tinsel wire 13 and so on. The speaker main body 7 is attached to the tip of
the speaker holding bracket 11 by soldering 16 with the speaker 14. Thereafter, the lower end of
the speaker holding bracket 11 is inserted into the through hole formed in the substrate 17 and
the conductive plate 18, and the lower end of the speaker holding bracket 11 is soldered to the
conductive plate 18 and fixed. Therefore, in this series of mounting operations, no lead wire
processing is required, and electrical continuity between the speaker body 7 and the conductive
plate 18 is realized through the speaker mounting bracket 11, thus simplifying these operations.
And it can be done quickly. 4- FIG. 5 and FIG. 6 show another embodiment of the present
invention, in which speaker holding hardware 21 ', 21' having a conductive function having a leg
length shorter than that of the speaker main body 7, and a supporting member Since the speaker
holding bracket 4 as a support for supporting the speaker main body 7 and strengthening the
strength of the support structure is characterized by being K, the other parts are substantially the
same as the embodiment described above, The corresponding components are denoted by the
same reference numerals, and the description thereof is omitted. As described above, according
to the present invention, the speaker main body is attached to the conductive speaker holding
bracket supported by the conductive plate, and the wiring of the lead wire as in the prior art is
eliminated. In addition to being able to cope with the problem, it is possible to rationally perform
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this type of mounting work, and to improve the workability. In addition, since the mounting of
the speaker main body is substantially performed by the speaker holding bracket, the speaker
main body does not require any special processing, and the fixing metal for this is not necessary,
so the number of parts and the manufacturing process are reduced. Phase 5-It is possible to
provide inexpensive speaker mounting equipment. Furthermore, since the speaker main body is
occupied on the substrate, the mounting space can be effectively utilized.
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