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JPS60256039

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JPS60256039
[0001]
Industrial Application Field The present invention is a flaw detector for nondestructive inspection
and an ultrasonic diagnostic bag. The structure of the conventional example and its problems In
FIG. 1 showing the basic structure of the conventional ultrasonic probe, (1) is a piezoelectric
vibrator, (2) is an ultrasonic absorber, and (3) is a cut. Machining groove, (4) is an acoustic
matching layer. In this case, the top surface of the piezoelectric vibrator (1) is not parallel to the
top surface of the acoustic matching layer (4), and the orientation arrangement position of the
piezoelectric vibrator (1) is disturbed. Next, with reference to FIGS. 2 and 3, a method of
manufacturing a conventional ultrasonic probe will be described. As shown in FIG. 2, after
bonding the piezoelectric vibration plate (5) on the ultrasonic wave absorber (2), the piezoelectric
vibration plate (5) is bonded to the ultrasonic wave absorber (2) with a scriber, a wire saw or the
like. A cutting process (formation of a groove (3)) is performed as shown in FIG. The ultrasonic
absorber (2) damps the piezoelectric vibrator (1) divided by cutting of the piezoelectric
diaphragm (5), and at the same time, transmits downward ultrasonic waves generated by the
piezoelectric vibrator (1). It absorbs and reflects that the reflected wave from the lower surface of
the ultrasonic wave absorber (2) is incident on the piezoelectric vibrator (1), and generally it is
extremely deformed by external force such as anti-vibration rubber and cork. It is composed of
easy ones. In addition, since the ultrasonic absorber (2) is also cut at the same time when cutting
the piezoelectric diaphragm (5), ultrasonic absorption is performed when cutting and bonding
the acoustic matching layer (4) by pressure bonding. When the arrangement of the piezoelectric
vibrators (1) is disturbed as the body (2) is deformed and the arrangement of the piezoelectric
vibrators (1) is easily disturbed. The ultrasonic beams generated from the piezoelectric vibrator
(1) are not uniform in arrangement pitch and direction and can not be generated uniformly, and
the object is placed on the upper surface of the acoustic matching layer (4) to It is impossible to
obtain accurate information when an ultrasonic wave is made incident on the inside of a subject
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1
and a reflected ultrasonic wave from the subject is received. SUMMARY OF THE INVENTION It is
an object of the present invention to solve the above-mentioned problems and to provide a
method of manufacturing an ultrasonic probe without disturbance in the arrangement of
piezoelectric transducers. SUMMARY OF THE INVENTION In order to achieve the above object,
the present invention adheres a piezoelectric vibrating plate and a highly rigid dummy plate with
a heat-melting wax, and then cuts grooves in the piezoelectric vibrating plate to form a dummy
plate. A plurality of piezoelectric vibrators spaced by the grooves are arranged, and the
piezoelectric vibrator integrated with the dummy plate is pressure-bonded to the ultrasonic wave
absorber by an adhesive, and then the heat melting wax is softened. Then, the dummy plate is
removed from the piezoelectric vibrator, and then the grooves between the piezoelectric
vibrators are filled with resin, and then the heat fusible wax is removed, and the acoustic
matching layer is adhered and fixed on the piezoelectric vibrator Provided is a method of
manufacturing a probe.
DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will
be described below with reference to FIGS. In these figures, the same members as those shown in
FIGS. 1 to 3 are given the same reference numerals. First, in the first stage, as shown in FIG. 4,
the heat fusible wax (7) in which the piezoelectric diaphragm (5) and the highly rigid dummy
plate (6) are interposed therebetween is heated. After being dissolved, they are adhered by
cooling and curing. Next, as shown in FIG. 5, the groove (3) is cut on the piezoelectric diaphragm
(5) integrated with the dummy plate (6) with a scriber, a wire saw or the like, and then separated
by the groove (3). The bonded (divided) piezoelectric vibrator (1) is adhesively fixed on the
ultrasonic absorber (2) using an adhesive as shown in FIG. This adhesive fixing is. In order to
prevent positional displacement of the piezoelectric vibrator (1) due to the pressure applied at
that time, the heat melting wax (7) must be in a temperature range where it does not soften.
Next, the heat melting wax (7) is softened by heating and the dummy plate (6) is removed from
the piezoelectric vibrator (1), and then, as shown in FIG. 7, on the surface of the piezoelectric
vibrator (1). In the state where the heat fusible wax (7) is attached, the resin (8) is permeated and
filled in the cut groove (3). The resin (8) is cured in a temperature range in which the heat
melting flux (7) does not melt to fix and strengthen the piezoelectric vibrator (1), and then
adhere to the piezoelectric vibrator (1) and cut grooves (3) The heat fusible wax (7) partially
invading the surface is cleaned and removed with a solvent or the like. Finally, the acoustic
matching layer (4) is pressure bonded onto the piezoelectric vibrator (1) as shown in FIG. In FIG.
8, (9) is an adhesive which has entered the portion from which the heat melting flux (7) has been
removed. According to the above manufacturing method, when the piezoelectric vibrator (1) is
cut and fixed, it is fixed to the dummy plate (6) having high rigidity, so that the arrangement
disorder does not occur, and the piezoelectric in the state of the required arrangement accuracy
The vibrator (1) can be adhered and fixed onto the ultrasonic wave absorber (2), and when the
acoustic matching layer (4) is pressure bonded to the surface of the piezoelectric vibrator (1), the
ultrasonic wave absorber (2) can The arrangement disorder of the piezoelectric vibrator (1) is
01-05-2019
2
caused by the absence of the cut groove and the fixing and strengthening of at least the lower
part of the piezoelectric vibrator (1) by the resin (8) filled in the cut groove (3) This can be
prevented from occurring, and an ultrasonic probe with excellent alignment accuracy can be
obtained. As described in detail in the invention, according to the method of manufacturing an
ultrasonic probe of the present invention, the piezoelectric bonding is performed at the time of
pressure bonding of the dummy plate bonded to the piezoelectric vibration plate at the time of
cutting of the groove and the acoustic matching layer. The combination with the resin for fixing
and strengthening the vibrator has an excellent effect of being able to manufacture an ultrasonic
probe in which extremely minute piezoelectric vibrators are arranged with high accuracy.
[0002]
Brief description of the drawings
[0003]
□□ 4 yo,) □ Wave detection-PI o □ 4 Figures 1 and 2 are sectional views showing the
manufacturing process of the probe, and Figures 4 to 8 are the present invention FIG. 16 is a
cross-sectional view showing a method of manufacturing an ultrasonic probe according to an
embodiment of the present invention.
(1) · · Piezoelectric vibrator, (2) · · Ultrasonic absorber, (3) · · · (8) · · · Resin, (9) · · · Adhesive agent
Yoshihiro Morimoto Fig. 3
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