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JP2009253891

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JP2009253891
A microphone unit and a method of manufacturing the same that can easily arrange a
microphone at a desired position. A diaphragm unit (20) including a diaphragm (22) and a
microphone substrate (10) having a diaphragm unit arrangement portion (11), wherein the
diaphragm unit arrangement portion (11) is configured as a recess in the microphone substrate
(10) 20 is arranged in the diaphragm unit arranging portion 11, and the microphone substrate
10 connects the back surface side when the opening surface 12 side of the diaphragm unit
arranging portion 11 is the front side and one vibration surface of the diaphragm 22. It has a
through hole 14. [Selected figure] Figure 1
Microphone unit and method of manufacturing the same
[0001]
The present invention relates to a microphone unit and a method of manufacturing the same.
[0002]
As the miniaturization of electronic devices progresses, technology for miniaturizing voice input
devices is becoming important.
As such a technology, for example, a technology for forming a capacitor type microphone on a
silicon substrate has been developed. Unexamined-Japanese-Patent No. 2006-157863
04-05-2019
1
[0003]
In such a downsized voice input device, it becomes more difficult to arrange a microphone at a
desired position as the size is reduced. However, in order to manufacture a voice input device
having desired characteristics, the position of the microphone is also an important design factor.
[0004]
The present invention has been made in view of the above circumstances, and an object of the
present invention is to provide a microphone unit which can easily arrange a microphone at a
desired position, and a method of manufacturing the same.
[0005]
(1) A microphone unit according to the present invention includes: a diaphragm unit including a
diaphragm; and a microphone substrate having a diaphragm unit arrangement portion, wherein
the diaphragm unit arrangement portion is configured as a recess in the microphone substrate,
The diaphragm unit is disposed in the diaphragm unit arrangement portion, and the microphone
substrate has a back surface side when the opening surface side of the diaphragm unit
disposition portion is a front surface side and one vibration surface of the diaphragm. And a
through hole connecting the two.
[0006]
The diaphragm unit may be configured as a so-called MEMS (Micro Electro Mechanical Systems).
In addition, as the diaphragm, an inorganic piezoelectric thin film or an organic piezoelectric thin
film may be used to perform acousto-electrical conversion by a piezoelectric effect, or an electret
film may be used.
In addition, the microphone substrate may be made of a material such as an insulating molded
substrate, a fired ceramic, a glass epoxy, or a plastic.
[0007]
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According to the present invention, it is possible to realize a microphone unit capable of easily
arranging a diaphragm unit functioning as a microphone at a desired position.
[0008]
(2) In this microphone unit, the diaphragm unit may be fitted in the diaphragm unit arrangement
portion.
[0009]
(3) In this microphone unit, the opening surface of the through hole on the diaphragm unit
arrangement portion side may be provided at the bottom of the diaphragm unit arrangement
portion.
[0010]
(4) In this microphone unit, the entire one vibration surface of the diaphragm may be disposed
facing the space communicating with the through hole.
[0011]
(5) In this microphone unit, the diaphragm unit arrangement portion may be formed in a frustum
shape spreading toward the opening surface.
[0012]
(6) In this microphone unit, the diaphragm unit arrangement portion may be configured to be
opened in a tapered shape.
[0013]
For example, the entire side surface of the diaphragm unit arrangement portion may be
configured to be opened in a tapered manner, or the vicinity of the opening surface of the
diaphragm unit arrangement portion may be configured to be opened in a tapered manner.
[0014]
(7) The microphone unit may include a microphone cover that closes the opening surface of the
diaphragm unit placement unit.
04-05-2019
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[0015]
(8) In this microphone unit, the diaphragm unit may include a microphone cover portion that
closes the side of the vibration surface opposite to the through hole of the diaphragm.
[0016]
(9) In this microphone unit, the opening surface of the diaphragm unit arrangement portion may
be polygonal.
[0017]
(10) In this microphone unit, the opening surface of the diaphragm unit arrangement portion
may be circular.
[0018]
(11) In this microphone unit, the entire diaphragm unit may be disposed inside the diaphragm
unit arrangement portion.
[0019]
(12) In this microphone unit, the microphone unit includes a signal processing unit that
processes an output signal from the diaphragm unit, the microphone substrate has a signal
processing unit disposition unit configured as a recess, and the signal processing unit is The
signal processing unit placement unit may be disposed.
[0020]
(13) In this microphone unit, the microphone substrate may have the opening surface of the
diaphragm unit arrangement portion and the opening surface of the signal processing unit
arrangement portion on the same surface side.
[0021]
(14) In this microphone unit, the microphone substrate may include an electrode unit electrically
connected to the signal processing unit on the same side as the opening surface of the diaphragm
unit arrangement unit.
[0022]
(15) In this microphone unit, the microphone substrate may include an electrode portion
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electrically connected to the signal processing portion on the back surface side when the opening
surface side of the diaphragm unit disposition portion is the front surface side. .
[0023]
(16) The microphone unit may include a plurality of the diaphragm units, and the diaphragm unit
arrangement portions respectively corresponding to the plurality of diaphragm units.
[0024]
(17) A method of manufacturing a microphone unit according to the present invention includes: a
diaphragm unit including a diaphragm; and a microphone unit including a diaphragm unit
arranging portion. A procedure of forming a concave portion in a microphone substrate, a
procedure of arranging the diaphragm unit in the diaphragm unit arrangement portion, and a
back surface when the opening surface side of the diaphragm unit arrangement portion is a front
surface side in the microphone substrate And a step of providing a through hole connecting the
side and one of the vibrating surfaces of the vibrating plate.
[0025]
Hereinafter, embodiments to which the present invention is applied will be described with
reference to the drawings.
However, the present invention is not limited to the following embodiments.
Further, the present invention includes any combination of the following contents.
[0026]
FIGS. 1A and 1B are diagrams showing an example of the configuration of the microphone unit
according to the present embodiment.
FIG. 1A is a plan view of the microphone unit 1 according to the present embodiment, and FIG.
1B is a view schematically showing a cross-sectional view of the microphone unit 1 according to
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the present embodiment.
[0027]
The microphone unit 1 according to the present embodiment includes a microphone substrate
10.
The microphone substrate 10 has a diaphragm unit arrangement portion 11 configured as a
recess.
[0028]
Although the shape of the opening surface 12 of the recessed part used as the diaphragm unit
arrangement | positioning part 11 is not specifically limited, For example, it is good also as a
rectangle, a polygon, or a circle.
In the present embodiment, the shape of the opening surface 12 is square.
[0029]
Further, in the present embodiment, the concave portion to be the moving plate unit
arrangement portion 11 is formed in a square pole shape having the parallel surface 13 parallel
to the opening surface 12 at the bottom.
[0030]
The microphone substrate 10 may be formed of a material such as an insulating molded
substrate, sintered ceramic, glass epoxy, plastic or the like.
In addition, the microphone substrate 10 having the concave portion to be the diaphragm unit
placement portion 11 is manufactured, for example, by pressing a mold having a convex portion
against the insulating molded substrate, or manufactured by firing ceramics using a desired
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mold. Alternatively, it can be manufactured by bonding a plurality of substrates having through
holes and a substrate having no through holes.
[0031]
The microphone unit 1 according to the present embodiment includes a diaphragm unit 20.
The diaphragm unit 20 is disposed in a recess serving as the diaphragm unit placement portion
11 of the microphone substrate 10.
[0032]
The diaphragm unit 20 includes the diaphragm 22 in a part thereof.
In addition, the diaphragm unit 20 may have a holding unit 24 that holds the diaphragm 22.
[0033]
The diaphragm 22 is a member that vibrates in the normal direction when a sound wave is
incident.
Then, in the microphone unit 1, the electric signal is extracted based on the vibration of the
diaphragm 22 to acquire the electric signal indicating the sound incident on the diaphragm 22.
That is, the diaphragm 22 is a diaphragm of a microphone.
[0034]
Hereinafter, the configuration of the condenser microphone 200 will be described as an example
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of the microphone applicable to the present embodiment.
FIG. 2 is a cross-sectional view schematically showing the configuration of the condenser
microphone 200. As shown in FIG.
[0035]
The condenser microphone 200 has a diaphragm 202.
The diaphragm 202 corresponds to the diaphragm 22 of the microphone unit 1 according to the
present embodiment.
The diaphragm 202 is a film (thin film) that vibrates in response to an acoustic wave, has
conductivity, and forms one end of an electrode.
The condenser microphone 200 also has an electrode 204.
The electrode 204 is disposed to face and be close to the diaphragm 202.
Thereby, the diaphragm 202 and the electrode 204 form a capacitance.
When a sound wave is incident on the condenser microphone 200, the diaphragm 202 vibrates,
the distance between the diaphragm 202 and the electrode 204 changes, and the capacitance
between the diaphragm 202 and the electrode 204 changes.
An electric signal based on the vibration of the diaphragm 202 can be obtained by extracting the
change in capacitance as, for example, a change in voltage.
That is, the sound wave incident on the condenser microphone 200 can be converted into an
electric signal and output. In the condenser microphone 200, the electrode 204 may have a
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structure that is not affected by the sound wave. For example, the electrode 204 may have a
mesh structure.
[0036]
However, the microphone (diaphragm 22) applicable to the present invention is not limited to the
condenser type microphone, and any microphone already known can be applied. For example,
the diaphragm 22 may be a diaphragm of various microphones such as an electrodynamic type
(dynamic type), an electromagnetic type (magnetic type), and a piezoelectric type (crystal type).
[0037]
Alternatively, the diaphragm 22 may be a semiconductor film (for example, a silicon film). That is,
the diaphragm 22 may be a diaphragm of a silicon microphone (Si microphone). By using a
silicon microphone, miniaturization and high performance of the microphone unit 1 can be
realized.
[0038]
The shape of the diaphragm 22 is not particularly limited. In the present embodiment, the
vibrating surface of the diaphragm 22 is square, but may be, for example, circular or polygonal.
[0039]
The microphone substrate 10 has a through hole 14 connecting the rear surface side when the
opening surface 12 side of the diaphragm unit arrangement portion 11 is the front surface side
and one of the vibration surfaces of the diaphragm 22. Thereby, the sound pressure from the
back surface side of the microphone substrate 10 can be input. Further, since the sound pressure
from the surface side of the microphone substrate 10 can also be input, it becomes possible to
operate as a differential microphone with the configuration having one diaphragm 22.
[0040]
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The diaphragm unit placement portion 11 may have a parallel surface 13 parallel to the opening
surface 12 at the bottom, and the opening surface of the through hole 14 on the diaphragm unit
20 side may be provided in the parallel surface 13. Thereby, the diaphragm unit 20 can be fixed
using the parallel surface 13.
[0041]
Furthermore, by arranging the entire one vibration surface of the diaphragm 22 to face the
internal space 14, the diaphragm 22 is in contact with the microphone substrate 10 and can not
disturb the vibration, and the entire diaphragm 22 is vibrated by the microphone It can function
effectively as a board.
[0042]
The shapes of the two opening faces of the through hole 14 are not particularly limited.
In the present embodiment, the shapes of the two opening faces of the through hole 14 are both
square, but may be, for example, circular or polygonal.
[0043]
The two opening surfaces of the through hole 14 may have different sizes and shapes. For
example, as shown in a microphone unit 1 'whose plan view is shown in FIG. 3A and a cross
sectional view in FIG. The opening surface on the diaphragm 22 side may be made larger than
the opening surface on the back surface side when the opening surface side of the diaphragm
unit placement portion 11 is the front surface side so as to be disposed.
[0044]
Furthermore, the microphone unit 1 according to the present embodiment may include a signal
processing unit 40 that processes an output signal from the diaphragm unit 20. In addition, the
microphone substrate 10 may include the signal processing unit placement unit 30 configured as
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a recess, and the signal processing unit 40 may be disposed in the signal processing unit 30.
[0045]
An electrode terminal 205 (not shown) is provided on the parallel surface 13 of the diaphragm
unit arrangement portion 11, and is electrically coupled to an electrode terminal 206 (not
shown) of the diaphragm unit 20 by solder or the like. In addition, an electrode terminal 207 (not
shown) is provided on the bottom surface 33 of the signal processing arrangement unit 30, and
is electrically coupled to an electrode terminal 208 (not shown) of the signal processing unit 40
by solder or the like.
[0046]
The electrode terminals 205 of the diaphragm unit arrangement portion 11 and the electrode
terminals 207 of the signal processing arrangement portion 30 are connected by a wiring
pattern provided in the substrate of the microphone substrate 10 or on the surface thereof. The
electrode terminal 207 and the electrode portion 50 or the electrode portion 50 a are connected
by a wiring pattern provided in the substrate or on the surface of the microphone substrate 10.
[0047]
With such a configuration, compared to the case where the signal processing unit 40 is directly
disposed on the surface of the microphone substrate 10, it is possible to realize a microphone
unit which can be thinned.
[0048]
According to the microphone unit 1 according to the present embodiment, the diaphragm unit
20 functioning as a microphone can be placed at a desired position by arranging the diaphragm
unit arrangement portion 11 configured as a recess in the microphone substrate 10. A
microphone unit that can be easily arranged becomes feasible.
[0049]
In addition, since the portion other than the concave portion to be the diaphragm unit
arrangement portion 11 of the microphone substrate 10 can be formed thick, the rigidity of the
microphone unit 1 is increased.
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11
Therefore, a microphone unit that is easier to handle can be realized.
[0050]
Furthermore, in the present embodiment, the shape of the recess of diaphragm unit arrangement
portion 11 as viewed from opening surface 12 is substantially the same shape and size as the
configuration of diaphragm unit 20 as viewed from opening surface 12. The diaphragm unit 20
is fitted in the diaphragm unit arrangement portion 11 to facilitate and ensure positioning during
manufacturing.
[0051]
In addition, since the parts of the diaphragm unit 20 and the signal processing unit 40 are very
small parts having sides of about 1 to 2 mm, handling at the time of mounting is difficult.
In particular, when the electrode terminals 205 of the diaphragm unit arrangement portion 11
and the electrode terminals 206 of the diaphragm unit 20 are soldered together using a reflow
process, problems such as rotation or misalignment of components tend to occur.
[0052]
However, according to the above configuration, since the diaphragm unit 20 and the signal
processing unit 40 are positioned in the recess of the microphone substrate 10, the electrode
terminal 205 of the diaphragm unit arrangement unit 11 and the electrode terminal 206 of the
diaphragm unit 20. Also in the reflow process, it is possible to prevent problems such as rotation
or misalignment of parts and to improve the process yield.
[0053]
Furthermore, the diaphragm unit may be marked so that the mounting direction can be
recognized, or a notch may be provided in part.
As a result, it is possible to prevent defective mounting by using image recognition or the like.
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12
[0054]
In addition, in the present embodiment, the whole of the diaphragm unit 20 is disposed inside
the recess serving as the diaphragm unit arrangement portion 11.
With such a configuration, it is possible to realize a microphone unit that is resistant to an impact
from a direction parallel to the opening surface 12 and easier to handle.
[0055]
When the diaphragm unit 20 is directly disposed on the surface of the microphone substrate 10,
a cover for covering the microphone substrate 10 and the diaphragm unit 20 may be used to
prevent the diaphragm unit 20 from being damaged during handling. There are many.
As in the microphone unit 1 according to the present embodiment, by disposing the entire
diaphragm unit 20 inside the recess serving as the diaphragm unit arranging portion 11, the
diaphragm in particular due to an impact from a direction parallel to the opening surface 12 The
possibility of breakage of the unit 20 is reduced. Therefore, the configuration without using the
cover becomes possible, and the thickness can be reduced, and no acoustic impedance is
generated in the space formed by the cover, so that a microphone unit having high quality
characteristics can be realized.
[0056]
In addition, in the present embodiment, the microphone substrate 10 has the opening surface 12
of the recess to be the diaphragm unit placement portion 11 and the opening surface 32 of the
recess to be the signal processing portion placement portion 30 on the same side. doing. As a
result, the diaphragm unit 20 and the signal processing unit 40 can be arranged from the same
side of the microphone substrate 10, which facilitates the manufacturing process.
[0057]
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13
According to various needs, the microphone substrate 10 has the opening surface 12 of the
recess to be the diaphragm unit arrangement portion 11 and the opening surface 32 of the
recess to be the signal processing portion arrangement portion 30 on different surfaces. May be
[0058]
[Modification 1] In the microphone unit 1 shown in FIG. 1 and the microphone unit 1 ′ shown
in FIG. 3, sound pressure can be input from both the front and back sides of the microphone
substrate 10, and a differential microphone is configured with one diaphragm 22. It is possible to
operate as a nondirectional microphone although it is possible to operate as
[0059]
For example, as in the microphone unit 2a whose cross-sectional view is shown in FIG. 4A, the
microphone cover unit 80 may be configured to close the opening surface 12 of the diaphragm
unit placement unit 11.
Also, for example, as in the microphone unit 2b whose cross-sectional view is shown in FIG. 4B,
the diaphragm unit 20 includes a microphone cover portion 81 that closes the vibration surface
side opposite to the through hole 14 of the diaphragm 22. It is also good.
[0060]
With such a configuration, only the sound pressure through the through hole 14 is input to the
diaphragm 22, so the microphone units 2a and 2b operate as nondirectional microphones.
[0061]
[Modification 2] In the microphone unit 1 shown in FIG. 1, the microphone unit 1 'shown in FIG.
3, the microphone unit 2a shown in FIG. 4A and the microphone unit 2b shown in FIG. Although
the shape of the recessed part used as the part 11 is comprised by the columnar shape which the
opening surface 12 and the parallel surface 13 become the same shape, it is also possible to
comprise by another shape.
In particular, the shape of the concave portion to be the diaphragm unit arrangement portion 11
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should be such that it has the opening surface 11 wider than the parallel surface 13 and all the
parallel surface 13 can be seen when viewed from directly above the opening surface 12 Thus,
the insertion of the diaphragm unit 20 is facilitated, and a microphone unit capable of easily
arranging the diaphragm unit 20 at a desired position can be realized.
[0062]
For example, as in the microphone unit 1a of which a plan view is shown in FIG. 5A and a cross
sectional view in FIG. 5B, the shape of the concave portion to be the diaphragm unit placement
portion 11a is expanded toward the opening surface 12a. It may be configured in a frustum
shape, that is, in a frustum shape whose cross section is narrowed from the opening surface 12 a
toward the parallel surface 13.
Further, for example, as shown in a microphone unit 1b whose plan view is shown in FIG. 6A and
a cross-sectional view in FIG. 6B, the diaphragm unit arrangement portion 11b is configured to
open near the opening surface 12b in a tapered shape. You may
[0063]
The same applies to the shape of the recess that is to be the signal processing unit placement
unit 30. In the microphone unit 1 shown in FIG. 1, the microphone unit 1 ′ shown in FIG. 3, and
the microphone unit 2a shown in FIG. 4A and the microphone unit 2b shown in FIG. Is formed in
a columnar shape in which the opening surface 32 and the bottom surface 33 have the same
shape, but the shape of the recess serving as the signal processing portion disposition portion 30
has an opening surface 32 wider than the bottom surface 33 By making the bottom surface 33
visible when viewed from directly above 32, the insertion of the signal processing unit 40 is
facilitated.
[0064]
For example, as in the microphone unit 1a shown in FIG. 5, the shape of the concave portion to
be the signal processing portion disposition portion 30a is a truncated cone shape extending
toward the opening surface 32a, that is, a cross section from the opening surface 32a to the
bottom surface 33 You may comprise in the shape of a frustum where becomes narrow. Also, for
04-05-2019
15
example, as in the microphone unit 1b shown in FIG. 6, the diaphragm unit placement portion
30b may be configured to open in the vicinity of the opening surface 32b in a tapered manner.
[0065]
Although FIGS. 5 and 6 show modifications based on the microphone unit 1, similar
modifications can be made to the microphone units 1 ', 2a and 2b.
[0066]
[Modification 3] In addition to the configurations of the microphone units 1, 1 ', 1a, 1b, 2a and
2b, the microphone substrate 10 has the opening surface 12 of the concave portion to be the
diaphragm unit placement portion 11 as the surface side. The back side may include an electrode
unit 50 electrically connected to the signal processing unit 40.
[0067]
7A is a plan view of the microphone unit 1 including the electrode unit 50, FIG. 7B is a crosssectional view of the microphone unit 1 including the electrode unit 50, and FIG. 7C is an
electrode unit 50. 10 is a cross-sectional view of the case where the microphone unit 1 including
the above is connected to the wiring board 60.
[0068]
The wiring substrate 60 includes a wiring to another electric circuit (not shown), and is
electrically connected to the electrode unit 50.
Further, the wiring substrate 60 may be provided with a through hole 62 for guiding the sound
wave to the diaphragm 22 at a position overlapping the through hole 14.
[0069]
In the bonding of the wiring board 60 and the microphone board 10, the area surrounding the
through hole 62 in all directions on one surface of the wiring board 60 and the area surrounding
the through hole 14 in all directions on the back side of the microphone board 10 face each
other. It may be joined.
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For example, the wiring substrate 60 and the microphone substrate 10 are joined by surrounding
the periphery of the through hole 62 without interruption on one surface of the wiring substrate
60 and surrounding the periphery of the through hole 14 without interruption on the back
surface side of the microphone substrate 10 The seal portion 70 may be included.
Thus, sound (acoustic leak) entering the through hole 14 from the gap between the microphone
substrate 10 and the wiring substrate 60 can be prevented.
[0070]
The seal portion 70 may be formed of, for example, solder. For example, it may be formed of a
conductive adhesive such as a silver paste, or an adhesive which is not particularly conductive.
For example, you may form with the material which can ensure airtightness, such as an adhesive
seal.
[0071]
With such a configuration, the microphone unit 1 can be disposed on the back side of the wiring
substrate 60.
[0072]
In addition to the configuration of the microphone units 1, 1 ′, 1a, 1b, 2a and 2b, the
microphone substrate 10 is formed on the same side as the opening surface of the recess to be
the diaphragm unit arrangement portion 11 with the signal processing unit 40. You may include
the electrode part 50a electrically connected.
[0073]
8A is a plan view of the microphone unit 1 including the electrode unit 50a, FIG. 8B is a crosssectional view of the microphone unit 1 including the electrode unit 50a, and FIG. 8C is an
electrode unit 50a. 10 shows a cross-sectional view of the case where the microphone unit 1
including the above is connected to the wiring board 60a.
[0074]
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17
The wiring substrate 60a includes a wiring to another electric circuit (not shown), and is
electrically connected to the electrode unit 50a.
[0075]
The wiring substrate 60a may be bonded to a region surrounding the opening surface 12 in all
directions.
For example, the sealing portion 70a may be included which surrounds the opening surface 12
without interruption and bonds the microphone substrate 10 and the wiring substrate 60a.
As a result, sound (acoustic leak) entering the opening surface 12 from the gap between the
microphone substrate 10 and the wiring substrate 60 a can be prevented.
[0076]
With such a configuration, the microphone unit 1 can be disposed on the front side of the wiring
board 60 as in the case of other electric circuits not shown.
[0077]
7 and 8 show a modification based on the microphone unit 1, the same modification is possible
for the microphone units 1 ', 1a, 1b, 2a and 2b.
[0078]
MODIFICATION 4 Although the example demonstrated using FIG. 1 thru | or 8 demonstrated by
the example containing the one diaphragm unit 20, it respond | corresponds to several
diaphragm units and those diaphragm units, respectively. You may comprise including a
diaphragm unit arrangement | positioning part and a through-hole.
Further, the signal processing unit 40 may perform signal processing including processing of
generating a differential signal using output signals from any two of the plurality of diaphragm
units.
04-05-2019
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[0079]
FIG. 9A is a plan view of the microphone unit 3 including the two diaphragm units 20 and 25,
and FIG. 9B is a cross-sectional view of the microphone unit 3.
[0080]
The microphone substrate 10 is configured to include the diaphragm unit arrangement portion
11 and the through hole 14 corresponding to the diaphragm unit 20, and the diaphragm unit
arrangement portion 16 and the through hole 18 corresponding to the diaphragm unit 25.
[0081]
For example, in a differential microphone that generates and uses a differential signal indicating
the difference between output signals from two microphones, the positional relationship between
the two microphones is an important design factor that affects the characteristics of the voice
input device, According to the configuration of the present modification, it is possible to realize a
microphone unit in which diaphragm units 20 and 25 functioning as microphones can be easily
disposed at desired positions.
[0082]
In the microphone unit 3 shown in FIG. 9, a modification is shown based on the microphone unit
1, but the same modification can be made to the microphone units 1 ', 1a, 1b, 2a and 2b.
Further, the configuration including the electrode unit described in the third modification may be
combined as appropriate.
[0083]
The present invention includes configurations substantially the same as the configurations
described in the embodiments (for example, configurations having the same function, method
and result, or configurations having the same purpose and effect).
04-05-2019
19
Further, the present invention includes a configuration in which a nonessential part of the
configuration described in the embodiment is replaced.
The present invention also includes configurations that can achieve the same effects as the
configurations described in the embodiments or that can achieve the same purpose.
Further, the present invention includes a configuration in which a known technology is added to
the configuration described in the embodiment.
[0084]
5 shows a configuration example of a microphone unit according to an embodiment of the
present invention.
The example of composition of a condenser type microphone.
5 shows a configuration example of a microphone unit according to an embodiment of the
present invention. 5 shows a configuration example of a microphone unit according to an
embodiment of the present invention. 5 shows a configuration example of a microphone unit
according to an embodiment of the present invention. 5 shows a configuration example of a
microphone unit according to an embodiment of the present invention. 5 shows a configuration
example of a microphone unit according to an embodiment of the present invention. 5 shows a
configuration example of a microphone unit according to an embodiment of the present
invention. 5 shows a configuration example of a microphone unit according to an embodiment of
the present invention.
Explanation of sign
[0085]
1, 1 ', 1a, 1b, 2a, 2b, 3 microphone units, 10 microphone boards, 11, 11a, 11b, 16 diaphragm
unit arrangement parts, 12, 12a, 12b opening surfaces, 13 parallel surfaces, 14, 14' , 18 through
hole, 20, 25 diaphragm unit, 22, 26 diaphragm, 24, 28 holding unit, 30, 30a, 30b signal
processing unit arrangement unit, 32, 32a, 32b opening surface, 33 bottom surface, 40 signal
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processing unit 50, 50a electrode portion, 60, 60a wiring substrate, 62 through hole, 70, 70a
seal portion, 80, 81 microphone cover portion, 200 capacitor type microphone, 202 diaphragm,
204 electrode
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