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JP2011135233

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JP2011135233
The present invention provides a speaker device that can improve quality and reliability, and can
cope with thinning, and a wiring structure thereof. A wiring structure of a speaker device 1
having a flat diaphragm 10, a drive coil 16 mounted on the diaphragm 10, and a magnetic circuit
14 including a drive coil 16 for driving the diaphragm 10. The lead wire 17 for input to the drive
coil 16 is disposed in the space formed between the diaphragm 1 and the magnetic circuit 14,
and the drive coil holder 15 holds the drive coil 16. The tip of the input lead 17 and the tip of the
drive coil 16 are electrically connected. [Selected figure] Figure 1
Speaker apparatus and wiring structure thereof
[0001]
The present invention relates to a speaker device and a wiring structure thereof.
[0002]
2. Description of the Related Art Conventionally, there is a speaker device which emits a sound
from the front of a diaphragm by disposing a voice coil at the center of a flat diaphragm held by
a housing and transmitting a signal to the voice coil.
As such a type of speaker device, one disclosed in Patent Document 1 is known.
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1
[0003]
Further, in recent years, thinning of a speaker device has progressed, and an organic
electroluminescence panel (hereinafter referred to as an OEL panel) is described. And inorganic
electroluminescent panels (hereinafter referred to as IEL panels). And the like, and panel type
speaker devices using a thin panel such as a) as a diaphragm are also in widespread use. What is
disclosed by patent document 2 as a speaker apparatus which employ | adopted the OEL panel as
a diaphragm is known.
[0004]
Here, in the speaker devices disclosed in Patent Documents 1 and 2, the conventional wiring
structure is adopted, and the wiring structure of the speaker device has a configuration as shown
in FIG. 24 and FIG. 25. There is. That is, a flange 203 made of an insulating material is mounted
on the outer periphery on one end side of the bobbin 202 having the voice coil 201, and the
input terminal lugs 204 and 205 on the anode side and the cathode side are mounted on the
flange 203. Then, the lead wire 206 on the anode side of the voice coil 201 and the lead wire
207 on the anode side are respectively connected to one end and the other end of the input
terminal lug 204 on the anode side. Further, the lead wire 208 on the cathode side of the voice
coil 201 and the lead wire 209 on the cathode side are respectively connected to one end and
the other end of the input terminal lug 205 on the cathode side.
[0005]
JP 2008-205809 A (Detailed Description of the Invention) JP 2009-100223 A (Detailed
Description of the Invention)
[0006]
However, in the wiring structure of the speaker device disclosed in Patent Documents 1 and 2,
one end of the lead wire 207, 209 is connected to the input terminal lug 204, 205. It is necessary
to give a moderate slack at one end.
Therefore, when the diaphragm vibrates with a large amplitude, the input lead wires 207 and
209 come in contact with the back surface 211 of the diaphragm 210 and an abnormal sound is
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generated. In addition, if the speaker device is used for a long time, the lead wires 207 and 209
may be fatigued.
[0007]
Further, in the wiring structure of the conventional speaker device, the connection between the
lead wires 206 and 208 of the voice coil 201 and the lead wires 207 and 209 is performed
through the input terminal lugs 204 and 205, the metal fittings for wiring, and the like. There is.
For this reason, the space for arrange | positioning the terminal lugs 204 and 205 for input, a
metal fitting for wiring, etc. will be required, and it will become difficult to achieve thickness
reduction of a speaker apparatus. In addition, it is possible to connect the lead wires 206 and
208 and the lead wires 207 and 209 by soldering instead of metal fittings etc. In this case, the
thickness dimension of the lead wires 207 and 209 and the solder This makes it difficult to make
the speaker device 200 thinner.
[0008]
Furthermore, in the wiring structure of the conventional speaker device, as the thinning of the
speaker device 200 progresses, the space for arranging wiring materials such as the lead wires
206 and 208 and the lead wires 207 and 209 also becomes narrow. As a result, it becomes
difficult to perform the wiring work, and furthermore, the wiring connection itself can not be
made. On the other hand, the wiring material is required to have strength for holding a fixed
posture and followability capable of coping with the amplitude of the diaphragm. However, it is
difficult to thicken the wiring in order to give strength because of the relationship with the space,
and if the length of the wiring is made longer in order to give the following ability, the strength is
lacking and a fixed posture can be maintained. It disappears.
[0009]
The present invention has been made in view of such problems, and an object of the present
invention is to provide a speaker device capable of improving the quality and reliability and
adaptable to thinning, and its wiring structure. It is something to try.
[0010]
In order to solve the above problems, one aspect of the present invention is a speaker having a
flat diaphragm, a drive coil mounted on the diaphragm, and a magnetic circuit that includes the
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drive coil and drives the diaphragm. In the wiring structure of the device, the lead wire for input
to the drive coil is disposed in the space formed between the diaphragm and the magnetic circuit,
and on the outer periphery of the drive coil holding portion for holding the drive coil, The tip of
the input lead wire and the tip of the drive coil are electrically connected.
[0011]
Further, it is preferable to relay the input lead wire to the diaphragm or the magnetic circuit.
[0012]
Moreover, it is preferable to fix the input lead wire on the back surface which is a surface facing
the magnetic circuit in the diaphragm.
[0013]
Preferably, the input lead wire is a tinsel wire.
[0014]
The input lead wire is preferably subjected to forming so that the input lead wire extends in a
direction perpendicular to the vibration direction of the diaphragm.
[0015]
In addition, it is preferable that a flange be mounted on the outer peripheral end of the drive coil
holding portion for holding the drive coil, and the input lead wire be disposed along the flange.
[0016]
In addition, the flange has a generally ring shape, and it is preferable that a groove be provided
on the flat surface of the flange from the inner periphery to the outer periphery, and the input
lead be arranged along the groove.
[0017]
Further, it is preferable to attach a copper foil at a desired position on the outer peripheral
surface of the drive coil holding portion, and to connect the tip of the input lead wire disposed in
the groove to the copper foil.
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4
[0018]
In addition, it is preferable to mount a thin film conductor on the back surface of the diaphragm
and connect the input lead wire to the drive coil through the conductor.
[0019]
In addition, it is preferable to attach a conductor to the back surface of the diaphragm in a thin
film form by plating or vapor deposition, and connect the input lead wire to the drive coil
through the conductor.
[0020]
Further, the magnetic circuit is held in a housing, and it is preferable that wiring members to be
connected to the input lead wires or the input lead wires be arranged around the surface of the
housing.
[0021]
Preferably, a groove is provided at a desired position of the housing, and a wiring member
connected to the input lead wire or the input lead wire is preferably disposed in the groove.
[0022]
In addition, the housing has an outer frame portion having a frame shape, a magnetic circuit
mounting portion on which the magnetic circuit is mounted, and a bar portion connecting the
magnetic circuit mounting portion and the outer frame portion, and the magnetic circuit
mounting A part, whole or part of the frame, the outer frame and the bar is integrally formed,
and is connected to the input lead wire or the input lead at a desired position of the magnetic
circuit mounting part, the outer frame and the bar It is preferable to lay out the material.
[0023]
Further, according to one aspect of the present invention, the speaker device has the wiring
structure of the above-described speaker device.
[0024]
In addition, it is preferable to dispose a sound absorbing material or a cushioning material at a
position facing the top plate constituting the magnetic circuit in space.
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[0025]
According to the present invention, it is possible to provide a speaker device and wiring structure
thereof that can improve quality and reliability and can cope with thinning.
[0026]
It is the disassembled perspective view which looked at a part of speaker apparatus concerning
the 1st Embodiment of this invention from diagonally back side.
It is the figure which looked at a part of speaker device concerning a 1st embodiment of the
present invention from the back side.
It is a figure of the state which carried out the side view of a part of speaker device concerning a
1st embodiment of the present invention.
FIG. 2 is a side cross-sectional view of a part of the speaker device according to the first
embodiment of the present invention.
It is a figure of the state which carried out the side view of a part of speaker device concerning a
2nd embodiment of the present invention.
It is the disassembled perspective view which looked at a part of speaker device concerning a 3rd
embodiment of the present invention from the slanting front side.
It is a figure of the state which carried out the side view of a part of speaker device concerning a
3rd embodiment of the present invention.
It is a figure of the state which carried out the side view of a part of speaker device concerning a
4th embodiment of the present invention.
It is the perspective view which looked at a part of speaker device concerning a 5th embodiment
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6
of the present invention from a slanting back side.
It is an enlarged view of the part enclosed with the dashed-dotted line A in FIG.
It is the figure which looked at a part of speaker device concerning a 6th embodiment of the
present invention from the back side.
It is a figure of the state which carried out the side view of a part of speaker device concerning a
6th embodiment of the present invention.
It is the disassembled perspective view which looked at the speaker apparatus which concerns on
the 7th Embodiment of this invention from diagonally back side.
It is the perspective view which looked at the speaker apparatus which concerns on the 7th
Embodiment of this invention from the slanting front side.
FIG. 15 is a side sectional view of the speaker device in FIG. 14 taken along the line B-B.
It is an enlarged view of the part enclosed with the dashed-dotted line C in FIG.
It is an enlarged view of the part enclosed with the dashed-dotted line D in FIG.
It is an enlarged view of the part enclosed with the dashed-dotted line E in FIG. It is a figure
which shows the graph of the reproduction | regeneration frequency characteristic of the
speaker apparatus based on the 7th Embodiment of this invention. It is the disassembled
perspective view which looked at the speaker apparatus which concerns on the 8th Embodiment
of this invention from diagonally back. FIG. 21 is an enlarged view of a portion surrounded by an
alternate long and short dash line F in FIG. FIG. 21 is an enlarged view of a portion surrounded
by an alternate long and short dash line G in FIG. It is a figure which shows the graph of the
reproduction | regeneration frequency characteristic of the speaker apparatus based on the 8th
Embodiment of this invention. It is the disassembled perspective view which looked at a part of
conventional speaker apparatus from diagonally back side. It is a sectional side view of a part of
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conventional speaker apparatus.
[0027]
First Embodiment Hereinafter, a speaker device 1 according to a first embodiment of the present
invention and a wiring structure thereof will be described with reference to the drawings. In the
following description (common to the respective embodiments), the direction of arrow X1 shown
in FIGS. 1 to 9, FIGS. 11 to 15, 17, 18 and 20 is indicated, and the direction of arrow X2 is
indicated reversely. The arrow Y1 direction is defined as left, the arrow Y2 direction as right, the
arrow Z1 direction as upper, and the arrow Z2 direction as lower.
[0028]
FIG. 1 is an exploded perspective view of a part of the speaker device 1 according to the first
embodiment of the present invention as viewed obliquely from the back side. FIG. 2 is a view of a
part of the speaker device 1 according to the first embodiment of the present invention as viewed
from the back side. FIG. 3 is a side view of a part of the speaker device 1 according to the first
embodiment of the present invention. FIG. 4 is a side sectional view of part of the speaker device
1 according to the first embodiment of the present invention. FIG.
[0029]
The speaker device 1 according to the first embodiment of the present invention supports a thin
panel 10 as an example of a diaphragm by a housing (only the magnet flange 21 is shown), and
between the panel 10 and the housing It is comprised by arrange | positioning the drive body 12
for vibrating the panel 10 in the space 11 (refer FIG. 3) formed. Further, the wiring structure of
the speaker device 1 according to the first embodiment of the present invention is applied to a
drive portion of the speaker device 1 having a thin form.
[0030]
As shown in FIGS. 1 and 4, the driver 12 includes a voice coil body 13 and a magnetic circuit 14.
The voice coil body 13 includes a voice coil bobbin 15 which is an example of a drive coil holding
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portion having a cylindrical shape, and a voice which is an example of a drive coil wound around
an outer peripheral surface of the voice coil bobbin 15 and adhesively fixed. And a coil 16. In the
present embodiment, the voice coil body 13 is attached to the back surface 10 a of the panel 10
by bonding, and the lead is directed radially outward from the approximate center of the front
and back direction (X1-X2 direction) of the outer peripheral surface of the voice coil bobbin 15
The wires 17 and 17 are drawn out, and the lead wires 17 and 17 are disposed at substantially
the center of the space 11 in the front and back direction. The panel 10 vibrates in the front and
back direction along with the movement of the voice coil body 13 in the front and back direction.
[0031]
As shown in FIG. 1, the voice coil 16 is wound around the voice coil bobbin 15 in a region on the
back side (X2 side) of a substantially central portion in the front and back direction. Copper foils
18 and 18 are applied to two positions on the outer peripheral surface of the voice coil bobbin
15. The copper foils 18 and 18 are applied to a substantially central portion of the voice coil
bobbin 15 in the front and back direction (X1-X2 direction). Further, one of the copper foils 18
and 18 is connected to a lead wire 16a corresponding to the winding start portion of the voice
coil 16, and the other is connected to the lead wire 16a corresponding to the winding end
portion of the voice coil 16. . Further, the lead wires 17, 17 are provided separately from the
voice coil 16, and one end thereof is connected to the copper foil 18. That is, the winding start
and end portions of the voice coil 16 and the lead wires 17 and 17 are connected via the copper
foils 18 and 18. As shown in FIG. 3 etc., the two lead wires 17, 17 extend in parallel from the
copper foils 18, 18 along the vertical direction. Further, the lead wires 17 and 17 are
respectively disposed (totally in pairs) at positions symmetrical with respect to a central axis
along the vertical direction of the voice coil body 13.
[0032]
In the present embodiment, a conductive round wire covered with an insulating film such as
enamel is employed as the voice coil 16. On the other hand, as the lead wire 17, a wire rod,
which is generally referred to as a tinsel wire, and in which a plurality of wire members obtained
by winding a copper foil around twisted yarns are knitted in a braid shape or a twisted wire
shape is used. Since the tinsel wire is subjected to forming processing and can maintain a fixed
posture, it is excellent in the anti-amplitude performance, and is generally used widely as an
input wire of a speaker.
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9
[0033]
In the present embodiment, a tinsel wire is used as the lead wire 17. However, since the thin
speaker device 1 has a smaller amplitude of the diaphragm 10 than a typical loudspeaker, a wire
is selected according to the purpose of use. It is possible. For example, after drawing the lead
wire which becomes the winding start portion and the winding end portion of the voice coil 16
on the outer peripheral surface of the voice coil bobbin 15, it is pulled out from the vicinity of the
center portion in the front and back direction of the voice coil bobbin 15, It may be arranged
near the central part. Alternatively, for example, a copper wire covered with an insulating film
such as a vinyl chloride resin may be employed as the lead wire 17, and the tip of the copper
wire may be connected to the copper foil 18.
[0034]
As shown in FIG. 4, the magnetic circuit 14 is disposed on the back side of the voice coil body 13
so that the voice coil 16 fits in the magnetic gap 25 of itself. The magnetic circuit 14 is fixed to a
magnet flange 21 which is a part of the housing via a magnetic circuit fixing ring 20. Specifically,
the magnetic circuit 14 positioned in the magnet flange 21 is screwed to the magnetic circuit
fixing ring 20 disposed on the back side of the magnetic circuit 14 to position the magnetic
circuit 14 in the front and back direction. Is being done. In addition, on the side of the magnet
flange 21, for example, a plate material (not shown) that configures a housing is disposed.
[0035]
As shown in FIG. 4, the magnetic circuit 14 is composed of a yoke 22, a magnet 26 and a top
plate 24. The yoke 22 is a base member of the magnetic circuit 14 and has a substantially
bottomed cylindrical shape. Specifically, the yoke 22 has a center guide portion 22a having a
substantially cylindrical shape, and a mounting portion extending outward all around the
circumferential direction at an end portion on the back side of the center guide portion 22a. And
22b. A doughnut-shaped magnet 26 is placed on the placement unit 22b. The magnet 26 is
mounted on the mounting portion 22 b so as to be located on the outer peripheral side of the
center guide portion 22 a. Further, on the front side of the magnet 26, a doughnut-shaped top
plate 24 made of a magnetic material is disposed. The top plate 24 is disposed at a position
facing the magnet 26 so as to sandwich the magnet 26 with the mounting portion 22 b in the
front and back direction. A magnetic gap 25 having a predetermined distance is formed between
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10
the outer peripheral portion of the center guide portion 22 a and the inner peripheral portion of
the top plate 24, and the voice coil 16 is disposed in the magnetic gap 25.
[0036]
In the wiring structure of the speaker device 1 as described above, the lead wires 17 are
arranged in a form extending outward from the copper foil 18 in the lateral direction. That is, the
lead wire 17 extends in the vertical direction which is a direction orthogonal to the vibration
direction of the panel 10 at a substantially central portion in the front and back direction in the
space 11. As such, by arranging the lead wires 17 in the vertical direction, it is possible to cope
with the thinning of the speaker device 1. In addition, when resonance occurs in the vibration of
the panel 10, a tensile force caused by the resonance acts on the lead wire 17. However, by
arranging the lead wire 17 in the vertical direction, the tensile force can be reduced. It is possible
to reduce. As a result, disconnection of the lead wire 17 can be prevented.
[0037]
Further, since the speaker device 1 is often used in a state in which the panel 10 is upright, the
lead wire 17 can easily maintain the wiring posture at a substantially central portion in the front
and back direction in the space 11. For this reason, it is possible to prevent the lead wire 17 from
being inclined to the magnetic circuit 14 side by its own weight, as in the case of using the panel
10 by laying it horizontally. Therefore, the lead wire 17 does not maintain an inclined posture
with respect to the YZ plane. As a result, the lead 17 can be prevented from coming into contact
with other members such as the magnetic circuit 14 and the panel 10 to generate noise.
[0038]
Further, in the speaker device 1 as described above, the voice coil body 13 is directly attached to
the back surface 10 a of the panel 10, and a support member such as a suspension is not
disposed in the space 11. Therefore, the lead wire 17 can be easily disposed in the space 11
while having practicality. Therefore, it is possible to easily cope with thinning of the speaker
device 1.
[0039]
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11
Further, in the above-described speaker device 1, a tinsel wire is used for the lead wire 17. For
this reason, the lead wire 17 can easily maintain its posture along the vertical direction, and is
excellent in anti-amplitude performance. Therefore, disconnection of the lead wire 17 can be
prevented, and as a result, the quality and reliability of the speaker device 1 can be improved.
[0040]
Second Embodiment Hereinafter, a speaker device 30 according to a second embodiment of the
present invention and a wiring structure thereof will be described with reference to the drawings.
In the present embodiment, only the wiring structure is different from the first embodiment, and
therefore, only different portions will be mainly described. In the speaker device 1 according to
the second embodiment and the wiring structure thereof, the same reference numerals are
assigned to parts common to the first embodiment, and the description will be omitted or
simplified.
[0041]
FIG. 5 is a side view of a part of a speaker device 30 according to a second embodiment of the
present invention.
[0042]
The speaker device 30 has a panel 10, a drive body 12 mounted on the back surface 10a of the
panel 10, and a magnet flange 21 constituting a housing.
Also, copper foils 18 and 18 are applied to the outer peripheral surface of the voice coil bobbin
15. Further, lead wires 31, 31 are provided separately from the voice coil 16, and one end
thereof is connected to the copper foil 18.
[0043]
In the present embodiment, as shown in FIG. 5, the lead wires 31, 31 arranged in such a manner
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12
as to be drawn out from the copper foil 18 have a jumping portion 32 bent toward the front side
in the middle portion thereof. That is, the lead wire 31 is disposed substantially at the center in
the front and back direction of the space 11 to the point where the jumping portion 32 is formed
by being pulled out from the copper foil 18, and goes to the front side at the position where the
jumping portion 32 is formed As a result, the back surface 10a of the panel 10 comes into
contact with it. Further, as in the case of the first embodiment, the two lead wires 31, 31 extend
in parallel from the copper foils 18, 18 along the vertical direction. Furthermore, the lead wires
31 and 31 are arranged in a pair at symmetrical positions with respect to a central axis along the
vertical direction of the voice coil body 13.
[0044]
In the jumping portion 32, a portion in contact with the back surface 10a of the panel 10 is
adhered to the back surface 10a. The position where the jumping portion 32 is provided can be
appropriately set so that the lead wire 31 can maintain a predetermined posture in consideration
of the length of the lead wire 31. Since the lead wire 31 is formed of a tinsel wire subjected to
forming processing, the lead wire 31 maintains a predetermined posture as compared with a
copper wire covered with an insulating film such as a vinyl chloride resin. It is easy to do. Also,
the outside of the jumping portion 32 is coated with an insulating material to prevent shorting
with the panel 10. When the panel 10 is formed of a non-conductive material, the jumping
portion 32 may not be covered with an insulating material.
[0045]
In the speaker device 30 as described above, the lead wire 31 is fixed to the back surface 10 a of
the panel 10 by the jumping portion 32. Therefore, the lead wire 31 can be maintained in a more
stable state, and the reliability and quality of the speaker device 30 can be improved.
[0046]
Further, in the speaker device 30 as described above, the lead wire 31 is fixed by bonding the
jumping portion 32 to the back surface 10 a of the panel 10. Therefore, the lead wires 31 can be
arranged in a stable state with respect to the panel 10, and the generation of abnormal contact
noise between the lead wires 31 and the panel 10 can be prevented.
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[0047]
Third Embodiment Hereinafter, a speaker device 40 according to a third embodiment of the
present invention and a wiring structure thereof will be described with reference to the drawings.
In the present embodiment, only the wiring structure is different from the first and second
embodiments, and therefore, only different portions will be mainly described. In the speaker
device 40 according to the third embodiment and the wiring structure thereof, the same
reference numerals are given to parts in common with the first and second embodiments, and the
description will be omitted or simplified.
[0048]
FIG. 6 is an exploded perspective view of a part of a speaker device 40 according to a third
embodiment of the present invention as viewed from an oblique front side. FIG. 7 is a side view
of a part of a speaker device 40 according to a third embodiment of the present invention.
[0049]
As shown in FIG. 6, the speaker device 40 has a panel 10, a drive body 12 mounted on the back
surface 10 a of the panel 10, and a magnet flange 21 forming a housing. Also, copper foils 18
and 18 are applied to the outer peripheral surface of the voice coil bobbin 15. Further, lead wires
41 and 41 are provided separately from the voice coil 16 and one end thereof is connected to the
copper foil 18.
[0050]
In the present embodiment, as shown in FIGS. 6 and 7, the lead wires 41, 41 arranged in a form
to be drawn out from the copper foil 18 have a jumping portion 42 bent toward the back side in
the middle portion thereof. Have. That is, the lead wire 41 is located at a substantially central
portion in the front and back direction of the space 11 up to the location where the jumping
portion 42 is formed from the copper foil 18 and on the front side at the position where the
jumping portion 42 is formed. It will be bent toward the surface 21 a of the magnet flange 21.
Further, as in the case of the first embodiment, the two lead wires 41, 41 extend in parallel from
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the copper foils 18, 18 along the vertical direction. Furthermore, the lead wires 41 and 41 are
arranged in a pair at positions symmetrical with respect to the central axis along the vertical
direction of the voice coil body 13.
[0051]
In the jumping portion 42, a portion in contact with the surface 21a of the magnet flange 21 is
bonded to the surface 21a. The position where the jumping portion 42 is provided can be
appropriately set so that the lead wire 41 can maintain a predetermined posture in consideration
of the length of the lead wire 41. Since the lead wire 41 is formed of a tinsel wire subjected to
forming processing, the lead wire 41 maintains a predetermined posture as compared with a
copper wire covered with an insulating film such as a vinyl chloride resin. It is easy to do.
Further, the outside of the jumping portion 42 is coated with an insulating material to prevent
shorting with the magnet flange 21. When the magnet flange 21 is formed of a non-conductive
material, the jumping portion 42 may not be covered with an insulating material.
[0052]
In the speaker device 40 as described above, the lead wire 41 has the jumping portion 42
bonded to the surface 21 a of the magnet flange 21. Therefore, the lead wire 41 can be
maintained in a more stable state, and the reliability and the quality of the speaker device 40 can
be improved.
[0053]
Further, in the speaker device 40 as described above, the lead wire 41 is fixed by bonding the
jumping portion 42 to the surface 21 a of the magnet flange 21. For this reason, the lead wire 41
can be disposed in the space 11 in a stable state, and generation of an abnormal contact sound
between the lead wire 41 and the panel 10 can be prevented.
[0054]
Fourth Embodiment Hereinafter, a speaker device 50 according to a fourth embodiment of the
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15
present invention and a wiring structure thereof will be described with reference to the drawings.
In the present embodiment, only the wiring structure is different from the first to third
embodiments, and therefore, only the different portions will be mainly described. In the speaker
device 50 according to the fourth embodiment and the wiring structure thereof, the same
reference numerals are given to parts in common with the first to third embodiments, and the
description will be omitted or simplified.
[0055]
FIG. 8 is a side view of a part of a speaker device 50 according to a fourth embodiment of the
present invention.
[0056]
As shown in FIG. 8, in the speaker device 50, the panel 10, the drive body 12 mounted on the
back surface 10 a of the panel 10, the magnet flange 21 forming the casing, and the voice
disposed on the outer periphery of the voice coil bobbin 15 And a coil flange 51.
Also, copper foils 18 and 18 are applied to the outer peripheral surface of the voice coil bobbin
15. Furthermore, one ends of the lead wires 31 and 31 are connected to the copper foil 18.
[0057]
In the present embodiment, as shown in FIG. 8, it is an example of a flange having a ring shape
that covers the entire outer side of the voice coil bobbin 15 in the vicinity of the end on the front
side of the voice coil bobbin 15. A voice coil flange 51 is provided. The lead wires 31 31 are
disposed to cover the back surface 51 a of the voice coil flange 51. Further, the front surface of
the voice coil flange 51 is fixed to the back surface 10 a of the panel 10 by bonding or the like.
Furthermore, the lead wire 31 is bonded to the back surface 10 a of the panel 10 at the jumping
portion 32. Further, a portion of the lead wire 31 which covers the back surface 51 a of the voice
coil flange 51 is bonded to the back surface 51 a. That is, the lead wire 31 and the panel 10 are
integrated via the voice coil flange 51. The shape of the voice coil flange 51 is not limited to the
ring shape, and may be another shape.
[0058]
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In the speaker device 50 as described above, the voice coil 16 can be fixed with high strength to
the panel 10 by fixing the voice coil flange 51 to the back surface 50 a of the panel 50, and when
driving the panel 10. , It can reduce that the panel 10 is locally vibrated. Further, the
arrangement of the voice coil flange 51 can reinforce the strength of the panel 10, and can
reduce the occurrence of resonance at the contact portion between the voice coil flange 51 and
the panel 10.
[0059]
Further, in the speaker device 50 as described above, since the lead wire 31 is disposed on the
back surface 51a of the voice coil flange 51 so that the lead wire 31 is bonded on the back
surface 51a, the lead wire 31 is stabilized. It becomes possible to hold in the closed state, and it is
possible to prevent the lead wire 31 from being broken. Further, since the lead wire 31 is
disposed on the back surface 51a in a posture along the lateral direction, the arrangement mode
of a part of the lead wire 31 is determined, which is effective in thinning the speaker device 50.
[0060]
Further, in the above-described speaker device 50, the lead wire 31 and the panel 10 are
integrated via the voice coil flange 51. Therefore, the speaker device 50 can be thinned by
effectively utilizing the space 11.
[0061]
Fifth Embodiment Hereinafter, a speaker device 60 according to a fifth embodiment of the
present invention and a wiring structure thereof will be described with reference to the drawings.
In the present embodiment, only the wiring structure is different from the first to fourth
embodiments, and therefore, only different portions will be mainly described. In the speaker
device 60 according to the fifth embodiment and the wiring structure thereof, the same reference
numerals are given to parts in common with the first to fourth embodiments, and the description
will be omitted or simplified.
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[0062]
FIG. 9 is a perspective view of a part of a speaker device 60 according to a fifth embodiment of
the present invention as viewed obliquely from the back side. FIG. 10 is an enlarged view of a
portion surrounded by an alternate long and short dash line A in FIG.
[0063]
As shown in FIG. 9, the speaker device 60 has a panel 10, a driver for driving the panel 10, and a
voice coil flange 61 which is an example of a flange disposed on the outer periphery of the voice
coil bobbin 15. In addition, copper foils 18 and 18 are applied to desired two positions on the
outer peripheral surface of the voice coil bobbin 15. Furthermore, one ends of the lead wires 62,
62 are connected to the copper foil 18 by means such as soldering.
[0064]
As shown in FIG. 9, a voice coil flange 61 having a ring shape is provided in the vicinity of the
front end of the voice coil bobbin 15 so as to cover the entire outer side of the voice coil bobbin
15. . In the present embodiment, in the voice coil flange 61, grooves 63, 63 for arranging the
lead wires 62, 62 are formed. The grooves 63, 63 are formed from the inner peripheral portion
to the outer peripheral portion of the voice coil flange 61. Further, the grooves 63, 63 are formed
on the back surface 61a of the voice coil flange 61 in such a form that the distance between the
two grooves 63, 63 becomes wider as going outward in the circumferential direction. Further, on
the inner peripheral edge of the voice coil flange 61, a tapered tapered surface 64 is formed to
be inclined so as to increase in diameter toward the rear side. Therefore, when the voice coil
bobbin 15 is mounted on the voice coil flange 61, a substantially V-shaped groove is formed by
the outer peripheral surface of the voice coil bobbin 15 and the tapered surface 64. Further, as
described above, the lead wire 62 and the copper foil 18 are connected using solder or the like,
and the connection portion is an adhesive used when bonding the voice coil bobbin 15 and the
voice coil flange 61 to each other. Covered. Under the present circumstances, the connection part
of the lead wire 62 is comprised so that it may be accommodated in the substantially V-shaped
groove | channel formed of the outer peripheral surface of the voice coil bobbin 15, and the
taper surface 64. As shown in FIG. The shape of the voice coil flange 61 is not limited to the ring
shape, and may be another shape.
11-05-2019
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[0065]
As shown in FIG. 10, the lead wires 62, 62 are drawn outward in a state of being fitted into the
grooves 63, 63. That is, the lead wires 62, 62 are disposed in the space 11 in a state of being
fitted into the grooves 63, 63. Further, the portions of the lead wires 62 and 62 protruding
outward beyond the voice coil flange 61 maintain a posture in which each other is bent in a
substantially arc shape outward in the left-right direction.
[0066]
In the speaker device 60 as described above, the groove 63 is provided on the back surface 61 a
of the voice coil flange 61, and the lead wire 62 is inserted and arranged in the groove 63.
Therefore, only the dimension in which the lead wire 62 is fitted in the groove 63 is
advantageous in the space in the front and back direction, and it becomes easy to achieve
thinning. Further, the structure in which the lead wire 62 is inserted and disposed in the groove
63 makes it possible to easily locate the connection portion between the lead wire 62 and the
copper foil 18, and the number of wiring steps can be significantly reduced. Become.
[0067]
Further, in the wiring structure of the speaker device 60 as described above, the connection
portion obtained by soldering the copper foil 18 and the lead wire 62 is covered with an
adhesive for bonding the voice coil bobbin 15 and the voice coil flange 61. For this reason, when
it has a structure which seals the said connection part with an adhesive agent, and uses what has
heat resistance as an adhesive agent, reliability improves.
[0068]
Further, in the above-described speaker device 60, when the voice coil bobbin 15 is mounted on
the voice coil flange 61, a substantially V-shaped groove is formed by the outer peripheral
surface of the voice coil bobbin 15 and the tapered surface 64. For this reason, the connection
part with the copper foil 18 of the lead wire 62 will be settled in the said groove | channel.
Therefore, the connecting portion is completely sealed by the adhesive for bonding the voice coil
bobbin 15 and the voice coil flange 61 in addition to the solder. For this reason, the strength of
11-05-2019
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the connection portion is improved, and the reliability of the speaker device 60 is improved.
[0069]
Sixth Embodiment Hereinafter, a speaker device 70 according to a sixth embodiment of the
present invention and a wiring structure thereof will be described with reference to the drawings.
In the present embodiment, only the wiring structure is different from the first to fifth
embodiments, and therefore, only different portions will be mainly described. In the speaker
device 70 and the wiring structure thereof according to the sixth embodiment, the same
reference numerals are given to parts in common with the first to fifth embodiments, and the
description will be omitted or simplified.
[0070]
FIG. 11 is a view of a part of a speaker device 70 according to a sixth embodiment of the present
invention as viewed from the back side. FIG. 12 is a side view of a part of a speaker device 70
according to a sixth embodiment of the present invention.
[0071]
As shown in FIGS. 11 and 12, the speaker device 70 has a panel 10, a driver 12, a magnet flange
21, and a voice coil flange 61. In addition, copper foils 18 and 18 are applied to desired two
positions on the outer peripheral surface of the voice coil bobbin 15. One ends of the lead wires
62, 62 are connected to the copper foil 18 by means such as soldering. Further, as in the case of
the fifth embodiment, the groove 63 is formed in the voice coil flange 61, and the lead wires 62,
62 are drawn outward in a state of being fitted into the grooves 63, 63. There is.
[0072]
In the present embodiment, the lead wires 62, 62 drawn from the copper foils 18, 18 are drawn
outside the magnet flange 21 by the input lead wire 72 connected via the relay terminal 71.
Specifically, the lead wire 62 is held by the magnet flange 21 by being connected to the relay
terminal 71, and is drawn out by the input lead wire 72 connected to the relay terminal 71.
11-05-2019
20
[0073]
The relay terminal 71 includes a relay terminal board 73, a relay terminal lug 74, a washer 75,
and a relay terminal set screw 76. As shown in FIG. 11, the relay terminal substrate 73 is a platelike member having a substantially rectangular shape, and is formed of a heat resistant resin or
the like. Further, the relay terminal board 73 is disposed such that the left and right direction is
the longitudinal direction. The relay terminal lugs 74 and 74 are metal plates having a
substantially rectangular shape, and two in total are disposed side by side so that the vertical
direction is the longitudinal direction. The relay terminal lugs 74, 74 have an inclined portion
74a bent so as to be inclined toward the front side as viewed from the lateral side, and a flat
portion 74b having a flat surface (see FIG. 12). . The tip end of the lead wire 62 is connected by
soldering to the inclined portion 74a, and a faston terminal 77 subjected to caulking processing
is provided to the flat portion 74b.
[0074]
The relay terminal lugs 74, 74 are fixed to the surface 21 a of the magnet flange 21 using the
screws 76 in a state of being fixed to the relay terminal substrate 73. At this time, a washer 75 is
interposed between the relay terminal substrate 73 and the surface 21 a of the magnet flange
21. That is, the screw 76 is inserted into a hole (not shown) provided in a substantially central
portion in the left-right direction of the relay terminal board 73 and the washer 75, and the
screw 76 is screwed into a screw hole (not shown) provided in the magnet flange 21. Thus, the
relay terminal lugs 74, 74 are fixed to the magnet flange 21.
[0075]
The portions of the lead wires 62, 62 protruding outward beyond the voice coil flange 61
maintain a posture in which each other is bent in an arc shape outward in the left-right direction.
For this reason, in a state where the tip end of the lead wire 62 is connected to the inclined
portion 74a, the lead wire 62 is guided to the inclined portion 74a while being bent like a
circular arc from the outer periphery of the voice coil flange 61 Become. As the lead wire 62, for
example, a tinsel wire having a diameter of approximately 1 mm and subjected to forming
processing is used. Further, the tip of the input lead wire 72 is connected to the faston terminal
77 of the flat portion 74 b. As the input lead wire, a generally used parallel wire in which a metal
11-05-2019
21
wire is coated with a vinyl chloride resin is used. The input lead wire 72 is branched into two
lines in the vicinity of a portion connected to the relay terminal lugs 74, 74.
[0076]
In the speaker device 70 as described above, the lead wire 62 is fixed to the surface 21 a of the
magnet flange 21 via the relay terminal 71. That is, the lead wire 62 is relayed by the relay
terminal 71 and drawn out by the input lead wire 72. Therefore, the lead wire 62 can be
disposed in the space 11 in a stable state, and generation of an abnormal contact sound between
the lead wire 62 and the panel 10 can be prevented.
[0077]
Seventh Embodiment Hereinafter, a speaker device 80 according to a seventh embodiment of the
present invention and a wiring structure thereof will be described with reference to the drawings.
[0078]
FIG. 13 is an exploded perspective view of a speaker device 80 according to a seventh
embodiment of the present invention as viewed obliquely from the back side.
FIG. 14 is a perspective view of a speaker device 80 according to a seventh embodiment of the
present invention as viewed obliquely from the front side. FIG. 15 is a side cross section of the
speaker device 80 in FIG. 14 cut along the line B-B. FIG. 16 is an enlarged view of a portion
surrounded by an alternate long and short dash line C in FIG. FIG. 17 is an enlarged view of a
portion surrounded by an alternate long and short dash line D in FIG. FIG. 18 is an enlarged view
of a portion surrounded by an alternate long and short dash line E in FIG.
[0079]
As shown in FIGS. 13 to 15, the speaker device 80 mainly includes a panel 81 which is an
example of a diaphragm, a housing 109 for supporting the panel 81, and a driving body 84 for
vibrating the panel 81. It is configured. The housing 109 has a front frame 82 that protects the
11-05-2019
22
periphery of the panel 81, and a back frame 83 that supports the panel 81 and the front frame
82 from the back side. In the present embodiment, an OEL panel is employed as the panel 81.
Therefore, the speaker device 80 according to the present embodiment is thinner than the
speaker devices 1, 30, 40, 50, 60, and 70 according to the above-described first to sixth
embodiments. It is considered as a speaker apparatus which it has. As an example of dimensions
of the speaker device 80, for example, the dimensions of each side may be 158 mm and the
thickness dimension may be 8.4 mm. As a material of the panel 81, a panel other than the OEL
panel may be adopted.
[0080]
As shown in FIGS. 15 and 17, the panel 81 is a white light-emitting panel, each side of which has
a length dimension of 137.5 mm, and a panel substrate 85 and a glass seal disposed on the back
side of the panel substrate 85. It has the board 86 and the heat sink 87 which consists of an
aluminum board arrange | positioned on the back side of this glass sealing board 86. As shown in
FIG. The length dimension of each side of heat dissipation plate 87 is, for example, about 130
mm, and the thickness dimension thereof is, for example, 0.9 mm. Further, a ring-shaped sound
absorbing material 99 is interposed between the heat radiation plate 87 and the top plate 100
described later (see FIG. 18). Further, as shown in FIG. 14, an image of a guidance mark is
displayed on the surface of the panel 81, for example.
[0081]
As shown in FIG. 13 and the like, the front frame 82 has a square frame shape. The length of
each side of the front frame 82 is, for example, 137.5 mm so as to match the outside dimension
of the panel 81. As described above, the front frame 82 holds the periphery of the panel 81. In
addition, a back frame 83 is disposed on the back side of the front frame 82. On the front side of
the back frame 83, there is provided an opening recess 88 recessed toward the back side, and
the front frame 82 is fitted into the opening recess 88 (see FIG. 15). The external dimensions of
the back frame 83 are similar to the external dimensions of the speaker device 80. For example,
the dimensions of each side may be 158 mm and the thickness may be 8.4 mm. A space 89 is
formed between the back frame 83 and the panel 81 (see FIG. 18). In addition, aluminum is
adopted as a material of the front frame 82 and the back frame 83.
[0082]
11-05-2019
23
In addition, a driving body 84 is disposed substantially at the center of the speaker device 80. As
shown in FIGS. 13 and 15, the driving body 84 is composed of a voice coil body 90 and a
magnetic circuit 91. The voice coil body 90 has a voice coil bobbin 92 having a cylindrical shape,
and a voice coil 93 as an example of a drive coil wound around an outer peripheral surface of the
voice coil bobbin 92 and adhesively fixed. In the present embodiment, the voice coil body 90 is
adhesively mounted on the back surface 81 a of the panel 81 in a state of being mounted inside a
voice coil flange 94 which is an example of a flange having a ring shape. Specifically, the voice
coil flange 94 is disposed in the vicinity of the front end of the voice coil bobbin 92 so as to cover
the entire outer side of the voice coil bobbin 92.
[0083]
The inner diameter and height dimensions of the voice coil bobbin 92 are, for example, 25.9 mm
and 3.2 mm, respectively. The bobbin thickness of the voice coil bobbin 92 is, for example, 0.05
mm, and titanium is used as the material. The outer peripheral surface of the voice coil bobbin
92 around which the voice coil 93 is wound is coated with a heat-resistant resin which is an
insulating material. On the voice coil bobbin 92, for example, a wire having a diameter of 0.14
mm, which forms the voice coil 93, is wound over four layers, for example, with a winding width
of about 1.96 mm. With such a configuration, for example, a voice coil 93 having a direct current
resistance of about 3.4 to 3.9 Ω can be obtained.
[0084]
The voice coil flange 94 is a plate-like member having a ring shape, and aluminum is used as a
material. The voice coil flange 94 has an inner diameter of, for example, 26.12 mm, an outer
diameter of, for example, 46.12 mm, and a thickness of, for example, 0.5 mm. As shown in FIGS.
13 and 16, on the back surface 94a of the voice coil flange 94, two straight grooves 95, 95 are
formed from the inner peripheral side to the outer peripheral side of the voice coil flange. The
grooves 95, 95 are provided parallel to each other at a position separated by, for example, 16
mm from a central axis along the vertical direction of the voice coil flange 94. These grooves 95,
95 have, for example, a width dimension of 0.4 mm, for example, a depth dimension of 0.25 mm.
The surface of the voice coil flange 94 is subjected to black alumite treatment. The shape of the
voice coil flange 94 is not limited to the ring shape, and may be another shape.
[0085]
11-05-2019
24
With the voice coil body 90 attached to the inside of the voice coil flange 94, the two lead wires
96, 96 corresponding to the winding start portion and the winding end portion of the voice coil
93 from the voice coil bobbin 92 The lead wires 96, 96 are fixed in the grooves 95, 95 with an
adhesive. Thereafter, the voice coil flange 94 to which the voice coil body 90 is attached is
attached approximately to the center of the back surface 81 a of the panel 81 using an adhesive.
As an adhesive for bonding the lead wires 96 to the grooves 95 and an adhesive for bonding the
voice coil flange 94 to the panel 81, a two-component mixed adhesive is used.
[0086]
Further, as shown in FIGS. 15 and 18, the magnetic circuit 91 is composed of a yoke 97, a
magnet 98, and a top plate 100. The yoke 97 is a base member of the magnetic circuit 91, and
has a substantially bottomed cylindrical shape. Specifically, the yoke 97 has a center guide
portion 97a having a substantially cylindrical shape, and a mounting portion extending
circumferentially outward at an end portion on the back side of the center guide portion 97a.
And 97b. A donut shaped magnet 98 is placed on the placement portion 97 b. The magnet 98 is
mounted on the mounting portion 97b so as to be located on the outer peripheral side of the
center guide portion 97a. Further, on the front side of the magnet 98, a doughnut-shaped top
plate 100 made of a magnetic material is disposed. A magnetic gap 101 having a predetermined
distance is formed between the outer peripheral portion of the center guide portion 97 a and the
inner peripheral portion of the top plate 100, and the voice coil 93 is disposed in the magnetic
gap 101.
[0087]
The magnetic circuit 91 is disposed on the back side of the voice coil body 90 so that the voice
coil 93 fits in the magnetic gap 101. The magnetic circuit 91 is fixed to the back frame 83 which
is a part of the housing via the magnetic circuit fixing ring 103. Specifically, the magnetic circuit
fixing ring 103 is screwed on the back side of the magnetic circuit 91 held in position in the back
frame 83 to position the magnetic circuit 91 in the front and back direction.
[0088]
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25
As shown in FIGS. 13 and 16, the front frame 82 is provided with a connector 104 for supplying
an external voltage. As a result, a voltage for light emission and sound generation of the panel 81
is supplied to the speaker device 80 through the connector 104. The connector pin 105 of the
connector 104 and the light emitting electrode (not shown) are connected using the panel light
emitting leads 106 and 106, and the connector pin 105 and the voice coil 93 are connected by
the sound emitting leads 107 and 107. The connection makes it possible to connect the wiring
required for light emission and sound generation of the panel 81 by the connector 104.
[0089]
Here, the lead wire 96 drawn from the voice coil bobbin 92 passes through the groove 95 of the
voice coil flange 94 and is drawn out from the voice coil flange 94. The lead wire 96 drawn out
from the voice coil flange 94 is connected to a tinsel wire 108 having a diameter of, for example,
about 0.6 mm. The tinsel wire 108 also runs on the back surface 81 a of the panel 81, and its
end is connected to the connector pin 105 of the connector 104. That is, the sound-production
lead wire 107 is composed of the lead wire 96 and the tinsel wire 108.
[0090]
In the present embodiment, an adhesive is applied to cover all the lead wires 96 in the lead wire
96, and in the tinsel wire 108, the contact portion between the tinsel wire 108 and the back
surface 81a of the panel 81, That is, an adhesive was applied to the area on the back side half of
the tinsel cord 108, and the sound-production lead wire 107 was attached to the back surface 81
a of the panel 81. An ultraviolet curing adhesive may be applied so as to cover the portion where
the tinsel wire 108 is wound, and the tinsel wire 108 may be fixed to the back surface 81 a of the
panel 81. By such a mounting method, it is possible to prevent a rattling noise generated at the
time of the amplitude of the panel 81.
[0091]
The ends of the tinsel cords 108 are connected to the connector pins 105 and the lead wires 96
by soldering. Although the heat sink 87 mounted on the panel 81 is a good conductor formed of
aluminum, in the present embodiment, since the surface of the heat sink 87 is subjected to
insulation processing, the respective leads are provided. Even if the exposed portion not covered
with the insulating film portion in the wire 96 and the tinsel wire 108 are brought into close
11-05-2019
26
contact with the surface of the heat sink 87, no short circuit occurs.
[0092]
FIG. 19 shows a graph of reproduction frequency characteristics of the speaker device 80
configured as described above.
[0093]
As shown in FIG. 19, the reproduction frequency characteristics at about 1000 Hz to about
10000 Hz become stable, and from the audio point of view, the speaker device 80 can output a
stable sound with a sound production amount sufficient for practical use. It is possible.
[0094]
Further, in the speaker device 80 as described above, the voice coil body 90 is directly attached
to the back surface 81 a of the panel 81.
For this reason, it is possible to easily arrange the sound-producing lead wire 107 in the space
89 with a simple configuration and practicality.
Therefore, it is possible to easily cope with thinning of the speaker device 80.
[0095]
Further, in the speaker device 80 as described above, the voice coil 93 can be fixed with high
strength to the panel 81 by fixing the voice coil flange 94 to the back surface 81 a of the panel
81, and the panel 81 is driven. In this case, it is possible to reduce that the panel 81 is locally
vibrated. Further, the arrangement of the voice coil flange 94 can reinforce the strength of the
panel 81, and can reduce the occurrence of resonance at the contact portion between the voice
coil flange 94 and the panel 81.
[0096]
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27
Further, in the speaker device 80 as described above, the groove 95 is provided on the back
surface 94 a of the voice coil flange 94, and the lead wire 96 is inserted and arranged in the
groove 95. Therefore, the diameter dimension of the lead wire 96 is advantageous in space, and
it becomes easy to achieve thinning.
[0097]
Further, in the speaker device 80 as described above, the sound generation lead wire 107 and
the panel 81 are integrated via the voice coil flange 94. Therefore, the space 89 can be
effectively used to make the speaker device 80 thinner.
[0098]
Further, in the speaker device 80 as described above, the sound absorbing material 99 is
disposed between the top plate 100 and the voice coil flange 94. Therefore, the amplitude in the
thinned space 89 can be made uniform, and the generation of abnormal noise can be effectively
prevented. In particular, since the sound absorbing material 99 has a ring shape, non-uniform
vibration can be suppressed, and sound quality can be improved.
[0099]
Eighth Embodiment Hereinafter, a speaker device 110 and a wiring structure thereof according
to an eighth embodiment of the present invention will be described with reference to the
drawings. In the loudspeaker device 110 and the wiring structure thereof according to the eighth
embodiment, the same reference numerals are given to parts in common with the seventh
embodiment, and the description will be omitted or simplified.
[0100]
FIG. 20 is an exploded perspective view of the speaker device 110 according to the eighth
embodiment of the present invention as viewed obliquely from the back side. FIG. 21 is an
enlarged view of a portion surrounded by an alternate long and short dash line F in FIG. FIG. 22
11-05-2019
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is an enlarged view of a portion surrounded by an alternate long and short dash line G in FIG.
[0101]
As shown in FIG. 20, the speaker device 110 mainly includes a panel 111 which is an example of
a diaphragm, a housing 112 which supports the panel 111, and a driving body 84 which vibrates
the panel 111. The housing 112 has a front frame 114 supporting the panel 111 and a back
plate 115 supporting the panel 111 and the front frame 114 from the back side. In the present
embodiment, an IEL panel is employed as the panel 111. As a dimension example of the speaker
device 110, for example, it is possible to set the width dimension in the left-right direction to 225
mm, the length dimension in the vertical direction to 312 mm, and the thickness dimension to
7.4 mm. As a material of the panel 111, a panel other than the IEL panel may be adopted.
[0102]
The panel 111 is, for example, an alumite-treated aluminum plate having a length of 307.6 mm
and a thickness of 0.4 mm, for example, a length of 307.6 mm and a thickness of 0.9 mm. It is
comprised by sticking and mounting the IEL panel which has these with an adhesive.
[0103]
As shown in FIG. 20, the front frame 114 has a substantially square frame-like outer frame
portion 116 provided on the outer periphery of the front frame 114, and a magnetic circuit
mounted to hold the driver 84 substantially at the center of the front frame 114. A magnetic
circuit flange portion 117 which is an example of a portion, and a total of eight rail portions 118
bridged between the outer frame portion 116 and the magnetic circuit flange portion 117.
For this reason, the front frame 114 has, for example, a total of eight substantially rectangular
openings 120 on the top and bottom, left and right, both left and right sides, and both right and
left sides of the magnetic circuit flange portion 117. That is, the front frame 114 has a form of a
substantially parallel cross in a plan view. The front frame 114 is formed, for example, by cutting
an aluminum plate having a thickness of 8 mm with a milling cutter. The outer dimensions of the
front frame 114 are the same as the outer dimensions of the speaker device 110, for example,
225 mm in width in the horizontal direction, 312 mm in length in the vertical direction, and 7.4
mm in thickness, for example. It is possible to form
11-05-2019
29
[0104]
Furthermore, the front side of the front frame 114 has, for example, a width of 2 mm at the outer
edge of the outer frame portion 116, and the area inside thereof is subjected to a counterbore
process, for example, with a depth of 0.8 mm. On the other hand, the back surface of the front
frame 114 has a width of, for example, 2 mm at the outer edge of the outer frame portion 116 as
in the front side, and a 1.5 mm deep counterbore is applied to the inner area thereof. It is done.
For this reason, step portions 121 (only the step portions 121 on the back side are shown) along
the square frame shape are formed on the front side and the back side of the outer frame portion
116. The portion on the inner side of the step portion 121 in the outer frame portion 116, the
magnetic circuit flange portion 117 and the crosspiece portion 118 are formed in a state where
the counterbore processing is performed, and the front side and the rear side are flush with each
other. It has become.
[0105]
Further, the front side of the front frame 114 is, for example, spotted with a depth of 2.9 mm at a
position separated by, for example, 14 mm from the outer edge of the outer frame portion 116
toward the inner peripheral side. By this spot facing process, the stepped portion 121 on the
front side of the front frame 114 has, for example, a substantially square frame-like contact
surface having a width of 12 mm. That is, a step is further formed at a position separated by, for
example, 12 mm from the outer periphery of the step portion 121 on the front side toward the
inside. Then, the panel 111 is mounted on the front side of the front frame 114 so as to be fitted
into the step portion 121 on the front side. Therefore, in a state where the panel 111 is mounted
on the front side of the front frame 114, the panel 111 does not contact the front frame 114 in
an area inside the contact portion.
[0106]
In the present embodiment, all of the outer frame portion 116, the magnetic circuit flange
portion 117, and the crosspiece portion 118 are integrally provided, but the front frame 114 is
not limited to this configuration. Alternatively, in consideration of maintenance or the like, part
or all of the outer frame portion 116, the magnetic circuit flange portion 117 and the crosspiece
portion 118 may be formed as separate parts. For example, the magnetic circuit flange portion
117 and the rail portion 118 may be integrally formed, and the outer frame portion 116 may be
11-05-2019
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a separate part, or the outer frame portion 116 and the rail portion 118 are integrally formed. It
may be a separate part.
[0107]
Further, on the back side of the magnetic circuit flange portion 117, a hole portion 122 for
disposing the driving body 84 is formed. The hole portion 122 is provided at the center of the
magnetic circuit flange portion 117, that is, at the center portion of the front frame 114 in plan
view. The hole 122 is, for example, a through hole 122 a having a diameter of 56.02 mm, and a
ring step portion 122 b formed in a ring shape in plan view on the outer periphery of the
through hole 122 a on the back side of the magnetic circuit flange portion 117. Have. The ring
stepped portion 122b is formed by, for example, countersinking at a diameter of 74.1 mm and a
depth of 1.5 mm outside the through hole 122a. In addition, for example, a total of eight tap
holes 123 are provided at intervals of 45 degrees along the circumferential direction at a
position of, for example, 33 mm from the center of the through hole 122a in the ring stepped
portion 122b. The diameter of the tap hole 123 is, for example, 2 mm.
[0108]
At the left side of the center line along the vertical direction of the front frame 114, long grooves
124 along the vertical direction are formed in the two cross bars 118 and the magnetic circuit
flange portion 117 provided along the vertical direction. It is done. The long groove 124 is a hole
between the upper long groove 125 formed upward from the hole 122, the lower long groove
126 formed downward from the hole 122, and the upper long groove 125 and the lower long
groove 126. And an arc long groove 127 formed in an arc shape on the outer periphery of the
portion 122. The long groove 124 is formed, for example, as a groove having a width of 2.6 mm
and a depth of 1.6 mm. Further, a substantially U-shaped U-shaped long groove 128 is formed in
the outer peripheral portion of the opening 120 provided below the magnetic circuit flange
portion 117 so as to be continuous with the lower long groove 126.
[0109]
The driver 84 is composed of a voice coil body 90 and a magnetic circuit 91. The voice coil body
90 has a voice coil bobbin 92 and a voice coil 93 wound around the outer peripheral surface of
the voice coil bobbin 92 and adhesively fixed. In the present embodiment, the voice coil body 90
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is attached to the back surface 111 a of the panel 111 by adhesion in a state where the voice coil
body 90 is attached to the inside of the voice coil flange 94. The height dimension of the voice
coil bobbin 92 used in the present embodiment is, for example, 1 mm larger than that of the
voice coil bobbin 92 used in the seventh embodiment.
[0110]
With the voice coil body 90 attached to the inside of the voice coil flange 94, the two lead wires
96, 96 corresponding to the winding start portion and the winding end portion of the voice coil
93 from the voice coil bobbin 92 The lead wires 96, 96 are fixed in the grooves 95, 95 with an
adhesive. Thereafter, the voice coil flange 94 to which the voice coil body 90 is attached is
attached approximately to the center of the back surface of the panel 81 using an adhesive.
Further, the magnetic circuit 91 is constituted of a yoke 97, a magnet, and a top plate as in the
seventh embodiment.
[0111]
As in the case of the seventh embodiment, the magnetic circuit 91 is disposed on the back side of
the voice coil body 90 so that the voice coil 93 fits in the magnetic gap. The magnetic circuit 91
is fixed to the back plate 115 which is a part of the housing via the magnetic circuit fixing ring
103. Specifically, the magnetic circuit 91 is disposed in the hole 122 in a state where the back
plate 115 is attached to the back side of the front frame 114. After that, the magnetic circuit
fixing ring 103 is disposed on the back side of the ring step portion 122b, and a screw is inserted
into the through hole provided in the magnetic circuit fixing ring 103 and screwed into the tap
hole 123. Positioning is done.
[0112]
On the other hand, as shown in FIG. 20, in the long groove 124 and the U-shaped long groove
128 in the front frame 114, the cyclic lead wires 130 as an example of two wiring members for
driving the voice coil are arranged. It is The cyclic lead wire 130 is a generally used wire having a
conductive metal wire coated with a vinyl chloride resin, for example, a wire having a diameter of
about 1 mm.
11-05-2019
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[0113]
A connector terminal 131 is disposed below the front frame 114, and one end of the circulation
lead 130 is connected to the connector pin 132 of the connector terminal 131. Further, in the
case of the present embodiment, while driving the central portion of the back surface 111a of the
panel 111 by the driving body 84, for example, a total of four piezoelectric vibrations are
arranged on the center line along the other portions in the vertical direction. It is driven by the
body 140. That is, the panel 111 is driven by the 2 WAY drive method.
[0114]
The piezoelectric vibrating body 140 is configured as a so-called bimorph piezoelectric element
including a stainless steel metal substrate 141 (shim) and two piezoelectric elements 142
disposed with the metal substrate 141 interposed therebetween. The piezoelectric element 142
is, for example, a rectangular thin plate having a height of 13.5 mm, a width of 31 mm, and a
thickness of 0.8 mm. Then, the piezoelectric vibrating body 140 is attached to the back surface
111 a of the panel 111 via the attachment 143.
[0115]
The fixture 143 is constituted by a pair of support members 144, 144. The support member 144
has a prismatic portion 145 exhibiting a prismatic shape as a whole and a quadrangular prism
portion 146 provided at both ends thereof. For example, the prismatic prism portion 145 and the
quadrangular prism portion 146 are integrally made of an acrylic resin material. It is formed. The
piezoelectric vibrator 140 sandwiches the front and back surfaces of the central portion thereof
with the support member 144 (the prism portion 145), and fixes it by means of adhesion or the
like in the sandwiched state. Further, the support member 144 holding the piezoelectric vibrator
140 is adhesively attached to the back surface 111 a of the panel 111 with an acrylic adhesive.
For this reason, the vibration of the piezoelectric vibrator 140 is transmitted to the back surface
111 a of the panel 111 through the support member 144 (attachment 143).
[0116]
In order to vibrate the piezoelectric vibrator 140, it is necessary to input an electrical signal. As
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shown in FIG. 20 and FIG. 21, the input of the electric signal to the piezoelectric vibrating
member 140 connects the piezo elements 142 arranged on the front and the back by wiring, the
input lead wire 149 is the surface of the piezo element 142 and the metal substrate 141 It is
made by connecting each to the surface of. In this embodiment, as shown in FIG. 21, one end of
an input lead wire 149 made of a tinsel wire is connected to the surface of the piezoelectric
element 142 or the surface of a metal substrate 141 by soldering, and the input lead The other
end of the wire 149 is connected by soldering to the end of the circulation lead 130 which is
wound in the long groove 124 described above.
[0117]
Further, in the present embodiment, since the para wiring is used for the wiring of the four
piezoelectric vibrators 140 disposed in the front frame 114, as shown in FIG. 21, the respective
cyclic lead wires 130 are covered. The vinyl chloride resin being cut off is peeled off at a desired
location, and one end of a jumper wire 147 of a predetermined length is connected by soldering
to the surface of the metal wire exposed from the peeled portion. On the other hand, as shown in
FIG. 21, the other end of the jumper wire 147 extends inside the opening 120, and the other end
of the jumper wire 147 is connected to the piezo element 142 and the metal substrate 141. It is
connected to the end of the input lead wire 149 by soldering. In addition, after both are wireconnected in the connection part of the jumper wire 147 and the cyclic | annular lead wire 130,
an ultraviolet curing adhesive is provided to this connection part, and the ultraviolet ray is made
to be effective. For this reason, the connection portion between the jumper wire 147 and the
circulation lead 130 is sealed in the long groove 124. Further, a desired portion of the circulation
lead 130 and a peripheral portion of the connector terminal 131 are also sealed as described
above. In the present embodiment, the jumper wire 147, the circulation lead wire 130, and the
like are locally sealed in the long groove 124. However, all of the jumper wire 147, the
circulation lead wire 130, and the like in the long grooves 124, 128 are sealed. May be sealed.
[0118]
The front frame 114 is made of aluminum and is a good conductive material, but in the present
embodiment, the surface is subjected to an alumite treatment. For this reason, alumite serves as
an insulating material, and a soldered portion or the like to a portion where the metal wire is
exposed in the above-mentioned jumper wire 147 or the cyclic lead wire 130 is prevented from
contacting with the outside and shorting.
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[0119]
Further, in the present embodiment, as shown in FIG. 20, for example, the lead wire 96 drawn
from the voice coil 93 has a width of about 4 mm, for example, a length of about 30 mm, for
example, a rectangular The copper foil 150 which is an example of the conductor which exhibits
a thin plate body is connected. The lead wire 96 is connected to one end of the copper foil 150.
Further, as shown in FIG. 22, the other end side of the copper foil 150 is connected by soldering
to the cyclic lead wire 130 disposed so as to be wound in the U-shaped long groove 128 via the
tinsel wire 151. That is, the lead wire 96 is connected to the circulation lead wire 130 via the
copper foil 150. The copper foil 150 is attached to the back surface 111 a of the panel 111 with
an adhesive. As a result, even when the panel 111 having a large area vibrates with a large
amplitude, the lead wire 96 can be prevented from coming into contact with the metal front
frame 114 to generate noise, and furthermore, the lead wire 96 can be made of metal. It is
possible to prevent a short circuit in contact with the front frame 114 made of aluminum.
[0120]
FIG. 23 shows a graph of reproduction frequency characteristics of the speaker device 110
configured as described above. In FIG. 23, the frequency characteristic of the speaker device 110
of the present embodiment is indicated by a solid line, and the frequency characteristic of the
conventional speaker device is indicated by a broken line.
[0121]
As shown in FIG. 23, in the speaker device 110 according to the present embodiment, a dip does
not occur at about 2000 Hz as compared with the conventional speaker device, and the
reproduction frequency characteristics at about 2000 Hz to about 10000 Hz are stable. It has
become. Therefore, from the audio point of view, the speaker device 110 can output stable sound
with a sound production amount sufficient for practical use.
[0122]
In the speaker device 110 configured as described above, the thin film conductor such as the
copper foil 150 is mounted on the back surface 111 a of the panel 111. As described above, by
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using the copper foil 150 as a relay or as an input conductor for the voice coil 93, the space
between the panel 111 and the housing 112 can be effectively used, and as a result, the speaker
device 110 can be used. It is advantageous to reduce the thickness of the
[0123]
Further, in the speaker device 110 configured as described above, the long grooves 124 and 128
are provided in the front frame 114, and wiring materials such as the cyclic lead wires 130 are
arranged and mounted on the long grooves 124 and 128. With such a configuration, it is
possible to reduce the number of wiring operations. In addition, various wiring members such as
the cyclic lead 130 do not come in contact with the back surface 111 a of the panel 111, so that
various wires can be reliably fixed in the housing 112.
[0124]
Further, in the speaker device 110 configured as described above, by providing the long grooves
124, 128 and the like in the front frame 114, various wiring members such as the circulation
lead 130 and the like can be reliably arranged in the housing 112. It is assumed. For this reason,
various lead wires can be prevented from being randomly disposed in the space between the
panel 111 and the housing 112. Therefore, when the panel 111 vibrates, the wires such as the
lead wires 96 and 130 contact the back surface 111a of the panel 111, and generation of
abnormal noise can be prevented, and the speaker device 110 can be thinned.
[0125]
Further, in the speaker device 110 configured as described above, the front frame 114 has a
configuration in which the outer frame portion 116, the magnetic circuit flange portion 117, and
the bar portion 118 are integrally provided. Therefore, the number of manufacturing steps of the
housing 112 can be significantly reduced. Further, with such a configuration, the strength of the
speaker device 110 can be improved, and the sound quality can be improved and the weight can
be reduced.
[0126]
As mentioned above, although one embodiment of the present invention was described, the
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present invention is not limited to the above-mentioned form, and can be carried out in variously
modified forms.
[0127]
In the first to sixth embodiments described above, the copper foil 18 is connected to the lead
wires 17, 31, 41 and 62 made of a tinsel wire, but the lead wire 17 connected to the copper foil
18 , 31, 41, it is not limited to adopting a tinsel wire, for example, a general wire in which lead
wires 17, 31, 41, 62 are coated with a metal wire with a vinyl chloride resin It is good also as etc.
[0128]
Further, in the first to sixth embodiments described above, the lead wires 17, 31, 41, 62 are bent
in a gentle arc toward the outside, but the lead wires 17, 31, 41, 62 are For example, the lead
wires 17, 31, 41, and 62 may be bent in other shapes, or may not be bent.
[0129]
In the seventh and eighth embodiments described above, the voice coil flange 94 is disposed, but
the voice coil flange 94 is not disposed, and the lead wires 96 are provided on the back surfaces
81a and 111a of the panels 81 and 111, respectively. You may make it adhere directly.
[0130]
Further, in the above-described eighth embodiment, the lead wire 96 is connected to the
circulation lead wire 130 using the copper foil 150, but instead of the copper foil 150, plating
with a conductor may be performed according to the purpose. Alternatively, means such as vapor
deposition may be adopted, and it is also possible to adopt pattern printing in consideration of
the vibration resistance of the relevant part.
If such a method is applied, a desired wiring pattern is drawn on a printed circuit board or a
flexible printed circuit board, and actuators such as the voice coil 93 and the piezoelectric
element 142 are mounted on the wiring pattern surface, and the printed circuit board etc. itself
Can be directly generated, and the number of wiring steps of the speaker device 110 can be
significantly reduced.
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[0131]
In the eighth embodiment described above, the panel 111 having the IEL panel mounted on the
aluminum plate is made to sound, but the material of the panel 111 is not limited to this, and a
panel material suitable for the purpose is selected. You may do it.
[0132]
In the seventh and eighth embodiments described above, aluminum is adopted as the material of
the case, but the material of the case is not limited to aluminum, and other metals, resins or
metals may be used. Depending on the purpose, a composite material of a resin and a resin may
be used.
The sound quality can be improved by making the resonance points different with the respective
materials used for the housing being different.
[0133]
In the seventh embodiment described above, the sound absorbing material 99 is disposed
between the top plate 100 and the voice coil flange 94. However, the sound absorbing material
99 may not be disposed. Instead of 99, another member such as a cushioning material may be
disposed.
Also in the eighth embodiment described above, a sound absorbing material may be disposed
between the top plate 100 and the voice coil flange 94.
[0134]
1, 30, 40, 50, 60, 70, 80, 110 ... speaker device 10, 81, 111 ... panel (diaphragm) 10a, 81a, 111a
... back surface 11, 89 ... space 14, 91 ... magnetic circuit 15, 94 Voice coil bobbin (drive coil
holding portion) 16, 93 Voice coil (drive coil) 17, 31, 41, 62, 72, 96 Lead wire (input lead wire)
18 Copper foil 21 Magnet flange (Part of the housing) 24, 100 ... top plate 51, 61, 94 ... voice coil
flange (flange) 63, 96 ... groove 82 ... front frame (part of the housing) 83 ... back frame (one of
the housing 99) Sound absorbing material 109, 112: Case 116: Outer frame portion 117:
Magnetic circuit flange portion (magnetic circuit mounting portion) 118: Cross portion 125:
Upper long groove (groove) 126: Bottom Long groove (grooves) 128 ... U elongated groove
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(grooves) 130 ... Circuit leads (wiring member) 150 ... copper (conductor)
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