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JP2013144063

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DESCRIPTION JP2013144063
Abstract: The present invention provides an ultrasonic unit 30 that is easy to manufacture. An
ultrasonic unit (30) has a plurality of ultrasonic elements (60) each having a transmission /
reception unit (61) for transmitting and receiving ultrasonic waves formed on a first main surface
(60SA), and an ultrasonic element (60) fitted in each of a plurality of recesses (22). A holding
member 20 including a mated backing sheet 21 and a cylindrical hollow member 25 having the
backing sheet 21 joined to the outer peripheral surface, and a cable 80 for transmitting a signal
of the ultrasonic element 60. [Selected figure] Figure 7
ULTRASONIC UNIT, ULTRASONIC ENDOSCOPE, AND METHOD FOR MANUFACTURING
ULTRASONIC UNIT
[0001]
The present invention relates to an ultrasonic unit in which a plurality of ultrasonic elements are
disposed on the outer peripheral surface of a cylindrical holding member, an ultrasonic
endoscope having the ultrasonic unit, and a method of manufacturing the ultrasonic unit. About.
[0002]
2. Description of the Related Art An ultrasonic diagnostic method is in widespread use in which
an ultrasonic wave is irradiated to a test object and an internal state of the body is imaged and
diagnosed from an echo signal.
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An ultrasound endoscope is one of the ultrasound diagnostic apparatuses used for ultrasound
diagnosis. In the ultrasonic endoscope, an ultrasonic unit is disposed at the distal end portion of
an insertion portion to be inserted into the body. The ultrasound unit has a function of
converting an electric signal into an ultrasonic wave and transmitting it to the body, and also
receiving an ultrasonic wave reflected in the body and converting it into an electric signal.
[0003]
Piezoelectric ultrasonic transducer using a piezoelectric ceramic material (for example, PZT: lead
zirconate titanate) as an ultrasonic transducer for an ultrasonic unit, or capacitive ultrasonic
vibration manufactured using MEMS technology A child (Capacitive Micro-machined Ultrasonic
Transducer: c-MUT) is used.
[0004]
As disclosed in Japanese Patent Application Publication No. 2011-505206, the electronic
scanning ultrasonic unit has a large number of ultrasonic elements, each emitting ultrasonic
waves in a predetermined direction, in order to acquire a wide range of ultrasonic images. Have.
At the time of manufacturing the ultrasonic unit, it is necessary to arrange a large number of fine
ultrasonic elements at a predetermined interval in a cylindrical shape. However, it has not been
easy to arrange, for example, several hundred ultrasonic elements with high accuracy.
[0005]
JP 2011-505206 gazette
[0006]
Embodiments of the present invention aim to provide an ultrasonic unit that is easy to
manufacture, an ultrasonic endoscope that is easy to manufacture, and a method of
manufacturing an ultrasonic unit that is easy to manufacture.
[0007]
An ultrasonic unit according to an embodiment of the present invention has a plurality of
ultrasonic elements each having a transmitting / receiving unit for transmitting / receiving
ultrasonic waves formed on a first main surface, and a cylindrical shape having at least a part of
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the outer peripheral surface having a plurality of recesses. And a holding member in which an
ultrasonic element is fitted in each of the recesses, and a cable for transmitting a signal of the
ultrasonic element.
[0008]
In the ultrasonic endoscope according to another embodiment of the present invention, a
plurality of ultrasonic elements, each having a transmission / reception unit for transmitting /
receiving an ultrasonic wave formed on the first main surface, The ultrasonic unit includes a
holding member which is cylindrical with a recess and in which an ultrasonic element is fitted in
each of the recesses, and a cable for transmitting a signal of the ultrasonic element.
[0009]
A method of manufacturing an ultrasonic unit according to another embodiment of the present
invention includes the steps of: manufacturing a plurality of ultrasonic elements each having a
transmitting / receiving unit for transmitting / receiving an ultrasonic wave; A step of
manufacturing a member, a step of fitting an ultrasonic element into the recess of each of the
flexible members, and an outer periphery of at least a part of the flexible member into which the
plurality of ultrasonic elements are fitted Bonding to the outer peripheral surface of the hollow
member having a cylindrical surface.
[0010]
According to the embodiment of the present invention, it is possible to provide an ultrasonic unit
that is easy to manufacture, an ultrasonic endoscope that is easy to manufacture, and a method
of manufacturing an ultrasonic unit that is easy to manufacture.
[0011]
It is an external view for demonstrating the ultrasound endoscope of 1st Embodiment.
It is a perspective view for demonstrating the front-end | tip part of the ultrasound endoscope of
1st Embodiment.
It is a perspective view for demonstrating the ultrasound unit of the front-end | tip part of the
ultrasound endoscope of 1st Embodiment.
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It is a perspective view for demonstrating the ultrasound element of the ultrasound unit of 1st
Embodiment.
It is a partial disassembled sectional view for demonstrating the structure of the ultrasound unit
of 1st Embodiment.
It is a flowchart for demonstrating the manufacturing method of the ultrasound unit of 1st
Embodiment.
It is a partial disassembled perspective view for demonstrating the manufacturing method of the
ultrasound unit of 1st Embodiment. It is sectional drawing for demonstrating the manufacturing
method of the ultrasound unit of 1st Embodiment. It is a perspective view for demonstrating the
ultrasonic unit of the modification of 1st Embodiment. It is a partial disassembled perspective
view for demonstrating the manufacturing method of the ultrasound unit of 2nd Embodiment. It
is a disassembled sectional view along the XI-XI line of FIG. 10 for demonstrating the ultrasound
unit of 2nd Embodiment. It is sectional drawing for demonstrating the ultrasound unit of 2nd
Embodiment. It is a perspective view for demonstrating the structure of the ultrasonic unit of the
modification of 2nd Embodiment. It is a top view of the flexible wiring board for demonstrating
the structure of the ultrasonic unit of the modification of 2nd Embodiment. It is a disassembled
sectional view for explaining the manufacturing method of the ultrasonic unit of a 3rd
embodiment. It is a perspective view for demonstrating the front-end | tip part of the ultrasound
endoscope of 4th Embodiment. It is a partial disassembled perspective view for demonstrating
the structure of the ultrasound unit of 4th Embodiment.
[0012]
First Embodiment Hereinafter, with reference to the drawings, an ultrasound unit 30 according
to a first embodiment, a method of manufacturing the ultrasound unit 30, and an ultrasound
endoscope 2 having an ultrasound unit 30 (hereinafter referred to as “ultrasonic unit Etc.). The
figures are all schematic diagrams for explanation, and the number of components, the size, the
ratio of the size, etc. are different from the actual ones.
[0013]
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<Configuration of Ultrasonic Endoscope> As shown in FIG. 1, the ultrasonic endoscope 2
constitutes the ultrasonic endoscope system 1 together with the ultrasonic observation device 3
and the monitor 4. The ultrasonic endoscope 2 includes an elongated insertion portion 11
inserted into the body, an operation portion 12 disposed at a proximal end of the insertion
portion 11, and a universal cord 13 extending from the side portion of the operation portion 12
Prepare.
[0014]
At the base end of the universal cord 13, a connector 14A connected to a light source device (not
shown) is disposed. From the connector 14A, a cable 15 detachably connected to the camera
control unit (not shown) via the connector 15A, and a cable 16 detachably connected to the
ultrasonic observation apparatus 3 via the connector 16A It is extended. A monitor 4 is
connected to the ultrasonic observation apparatus 3.
[0015]
The insertion portion 11 is positioned and operated from the distal end side in order from the
distal end rigid portion (hereinafter referred to as "the distal end portion") 17, the curved portion
18 positioned at the rear end of the distal end portion 17, and the rear end of the curved portion
18 A flexible tube portion 19 having a small diameter and a long length up to the portion 12 and
having flexibility is continuously provided. The ultrasonic unit 30 is disposed on the distal end
side of the distal end portion 17.
[0016]
The operation unit 12 includes an angle knob 12A that controls bending of the bending unit 18
in a desired direction, an air / water button 12B that performs air supply and water supply
operations, a suction button 12C that performs suction operation, and a body to be described
later. A treatment tool insertion port 12D or the like which is an entrance of a treatment tool
having a puncture needle or the like is disposed.
[0017]
Then, as shown in FIG. 2, at the distal end portion 17 where the ultrasonic unit 30 of the
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ultrasonic endoscope 2 is disposed, an illumination lens cover 31 which constitutes an
illumination optical system, and an observation optical system are observed. A lens cover 32, a
forceps port 33 from which a treatment tool such as a puncture needle 5 (see FIG. 16) or the like
protrudes as described later, and an air / water supply nozzle (not shown) are provided.
[0018]
<Configuration of Ultrasonic Unit> Next, the configuration of the ultrasonic unit 30 will be
described with reference to FIGS. 3, 4 and 5.
[0019]
As shown in FIG. 3, the ultrasonic unit 30 includes an ultrasonic array 60 M having a plurality of
ultrasonic elements 60 substantially rectangular in plan view, and a holding member 20 in which
the plurality of ultrasonic elements 60 are joined to the outer peripheral surface. And a cable 80
connected to each of the ultrasonic elements 60 and the conductors 81A and 81B for
transmitting a signal.
[0020]
As shown in FIG. 4, the ultrasonic element 60, which is a basic unit for transmitting and receiving
ultrasonic waves, has a first major surface 60SA and a second major surface 60SB opposite to the
first major surface 60SA.
A transmitting / receiving unit 61 for transmitting and receiving ultrasonic waves is formed
substantially at the center of the first main surface 60SA of the ultrasonic element 60, and
external electrodes 62A and 62B are provided at both ends of the first main surface 60SA. It is
arranged.
As shown in FIG. 3, the external electrodes 62A and 62B are connected to the conductors 81A
and 81B of the cable 80, respectively.
Hereinafter, for example, each of the external electrodes 62A and 62B is referred to as an
external electrode 62.
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The external electrode 62A is connected to the drive potential side of a voltage signal generation
unit (not shown) of the ultrasonic observation apparatus 3 via a cable 80. On the other hand, the
external electrode 62B is at the ground potential.
[0021]
That is, the cable 80 is inserted into the distal end portion 17, the bending portion 18, the
flexible tube portion 19, the operation portion 12, the universal cord 13, and the cable 16, and
ultrasonic observation is performed via the connector 16A. It is connected to the device 3.
[0022]
In the transmitting and receiving unit 61, a plurality of capacitance type ultrasonic cells 10 are
arranged in a matrix.
In FIG. 4, only a part of the ultrasonic cells 10 is schematically shown. In the ultrasonic cell 10,
the upper electrode constituting the membrane is disposed to face the lower electrode via a
cavity (air gap). The external electrode 62A is a common electrode of the lower electrodes of the
plurality of ultrasonic cells 10, and the external electrode 62B is a common electrode of the
upper electrodes of the plurality of ultrasonic cells 10.
[0023]
As shown in FIG. 5, in the ultrasonic array 60M, a plurality of ultrasonic elements 60 having a
rectangular shape in a plan view are disposed in a cylindrical shape with parallel long sides in
parallel at predetermined intervals on the outer peripheral surface of the cylindrical holding
member 20. It is a radial type transducer group.
[0024]
The holding member 20 includes a backing sheet 21 made of an elastic member which is a
flexible member, and a cylindrical hollow member 25 in which the backing sheet 21 is joined to
the outer peripheral surface.
The ultrasonic element 60 is fitted in the recess 22 of the backing sheet 21, and the second
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major surface 60 </ b> SB is bonded to the bottom of the recess 22 via the adhesive layer 24.
[0025]
That is, the planar view size of the recess 22 is substantially the same as the planar view size of
the ultrasonic element 60, and the depth of the recess 22 is substantially the same as the
thickness of the ultrasonic element 60.
[0026]
As described later, the ultrasonic array 60M is manufactured by joining a planar backing sheet
21 in which the ultrasonic element 60 is fitted in the recess 22 while bending along the outer
peripheral surface of the hollow member 25.
For this reason, the cylindrical backing sheet 21 has a joint line 21S.
[0027]
The backing sheet 21 not only defines the disposition position of the ultrasonic element 60, but
also has a function to attenuate unnecessary ultrasonic waves.
[0028]
<Operation of Ultrasonic Unit> Next, the operation of the ultrasonic unit 30 will be briefly
described.
[0029]
At the time of ultrasonic wave generation, the voltage signal generator applies a drive voltage
signal to the lower electrode via the external electrode 62A.
When a voltage is applied to the lower electrode, the upper electrode at ground potential is
attracted to the lower electrode by electrostatic force, so the membrane including the upper
electrode is deformed.
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When the voltage applied to the lower electrode disappears, the membrane recovers to its
original shape by the elastic force. The deformation / recovery of this membrane generates an
ultrasonic wave.
[0030]
On the other hand, at the time of ultrasonic wave reception, the membrane including the upper
electrode is deformed by the received ultrasonic energy. Then, since the distance between the
upper electrode and the lower electrode changes, the capacitance between them changes. Then, a
current flows in the capacitance signal detection unit (not shown) of the ultrasonic observation
apparatus 3 due to the capacitance change. That is, the received ultrasonic energy is converted
into a capacitive signal.
[0031]
<Method of Manufacturing Ultrasonic Unit> Next, a method of manufacturing the ultrasonic unit
30 will be described with reference to the flowchart of FIG.
[0032]
<Step S10> Transmitting / Receiving Portion 61 for Transmitting / Receiving Ultrasonic Waves
Formed at Approximately Center Portion of First Main Surface 60SA, shown in FIG. 4, and
External Electrode Provided at End of First Main Surface 60SA And a plurality of capacitive
ultrasonic elements 60 are fabricated using MEMS technology.
[0033]
A large number of ultrasonic elements 60 can be manufactured at once by a wafer process.
In the wafer process, a wafer on which a large number of ultrasonic elements 60 are formed is
separated into individual ultrasonic elements 60 in a cutting process.
[0034]
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<Step S11> A backing sheet 21 having a plurality of recesses 22 on the surface is produced.
The material of the backing sheet 21 is, for example, one obtained by curing an epoxy resin
containing alumina powder. In addition, as a material of the backing sheet 21, resin, such as
epoxy type, silicon type, polyimide type, polyether imide, PEEK, urethane type or fluorine type, or
chloroprene rubber, propylene type rubber, butadiene type rubber, urethane type rubber, A
rubber such as silicone rubber or fluorine-based rubber may be used, and further, a metal such
as tungsten or alumina, zirconia, silica, tungsten oxide, piezoelectric ceramic powder, or a
ceramic such as ferrite, glass, glass, Alternatively, a mixture of one or more substances or fillers
in the form of powder, fibers, hollow particles or the like such as resin may be used.
[0035]
The recessed portions 22 are formed in the same number as the number of ultrasonic elements
60 to be joined, and when the ultrasonic elements 60 are arranged in a cylindrical shape, they
are accurately formed at a predetermined pitch so as to be equally spaced at equal intervals. ing.
The recess 22 is formed by, for example, a molding method using a mold or a grinding method.
[0036]
<Step S12> As shown in FIG. 7, the ultrasonic element 60 is fitted in the concave portion 22 of
the planar backing sheet 21 and is joined via the adhesive layer 24.
[0037]
For example, an epoxy-based adhesive containing 1 to 2% of a silane coupling agent can be
preferably used as the adhesive layer 24.
Here, the thickness of the adhesive layer 24 is preferably 10% or less, particularly preferably 1%
or less, of the wavelength λ of the center frequency of the ultrasonic wave to be transmitted and
received, from the viewpoint of acoustic matching. For example, when the frequency of 5 MHz
and the speed of sound of the bonding layer 24 are 2600 m / s, λ = 520 μm, the thickness of
the bonding layer 24 is preferably 52 μm or less, and particularly preferably 5.2 μm or less.
The lower limit of the thickness of the adhesive layer 24 is preferably 0.01% or more of the
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wavelength λ, that is, 0.052 μm or more, from the viewpoint of bonding reliability.
[0038]
In order to prevent a drop in efficiency when transmitting and receiving ultrasonic waves, it is
preferable that the surface of the transmitting and receiving unit 61 of the ultrasonic element 60
and the surface of the backing sheet 21 be on the same surface without any level difference.
Therefore, the depth of the recess 22 is substantially the same as the thickness of the ultrasonic
element 60, but is set in consideration of the thickness of the adhesive layer 24.
[0039]
The plurality of ultrasonic elements 60 manufactured by the wafer process may be engaged with
the backing sheet 21 in a state of an element group including the plurality of ultrasonic elements
60 without completely separating them in the cutting process. For example, a resist film covering
the plurality of ultrasonic elements 6 in a wafer state is provided, and cutting is performed with
the resist film left, so that an element group in which the plurality of ultrasonic elements 60 are
connected by the resist film is manufactured. Ru. By fitting the recesses 22 of the backing sheet
21 as the element group and removing the resist film, a plurality of ultrasonic elements can be
collectively disposed with high accuracy while maintaining the positioning accuracy.
[0040]
<Step S13> The lead 81 of the cable 80 is connected to the external electrode 62 of the
ultrasonic element 60 fitted in the recess 22 of the backing sheet 21. For the connection, for
example, a solder joint is used.
[0041]
The external electrode 62 and the conducting wire 81 do not have to be directly joined. That is,
at this stage, the relay lead may be connected to the external electrode 62, and for example, it
may be connected to the lead 81 via a relay wiring board in a later step.
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[0042]
<Step S14> As shown in FIG. 8, the planar backing sheet 21 in which the plurality of ultrasonic
elements 60 are fitted is rolled so that the first main surface 60SA of the ultrasonic element 60 is
the outer surface. And the outer peripheral surface of the cylindrical hollow member 25. Then,
the plurality of ultrasonic elements 60 are automatically disposed at predetermined positions on
the cylindrical outer peripheral surface. For bonding, for example, an adhesive similar to the
adhesive layer 24 is used.
[0043]
Preferably, the resin sealing material or the like is filled in the hollow portion on the inner
periphery of the hollow member 25 after the backing sheet 21 is joined to fix the conducting
wire 81 and the cable 80.
[0044]
As already described, it is not easy to dispose a large number of ultrasonic elements 60 precisely
at predetermined positions on a curved surface.
However, in the ultrasonic unit 30, after the ultrasonic element 60 is fitted in the concave portion
22 of the planar backing sheet 21, the backing sheet 21 is wound around the outer peripheral
surface of the hollow member 25 so that the predetermined position can be easily and
accurately. It is easy to manufacture because it can be disposed on the
[0045]
That is, by setting the plurality of recesses 22 of the backing sheet 21 to a size and a
predetermined pitch in which the ultrasonic elements 60 are fitted, the ultrasonic elements 60
are fitted to the respective recesses 22 to facilitate high-precision positioning. Can be done.
Further, by rolling the backing sheet 21 integrated with the ultrasonic element 60 connected to
the cable 80 into a cylindrical shape, an electronic scanning in which a plurality of ultrasonic
elements 60 are accurately arranged in a cylindrical shape at a predetermined pitch The
ultrasonic unit 30 of the mold can be manufactured with less man-hours than in the prior art.
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[0046]
Also, although the process of connecting the lead 81 to the external electrode 62 of the
ultrasonic element 60 disposed on the curved surface is complicated, in the ultrasonic unit 30,
the ultrasonic element in a state of being joined to the planar backing sheet 21. Since the
conducting wire 81 is connected to the 60 external electrodes 62, manufacture is easy.
[0047]
The above embodiment has been described by taking the ultrasonic unit 30 and the ultrasonic
endoscope 2 manufactured by the capacitive MEMS technology as an example.
This is because the capacitive ultrasonic unit is particularly suitable for miniaturization, and the
effects of the present invention are remarkable. However, as will be described later, it is apparent
that the present invention has the same effect also in a piezoelectric ultrasonic unit and an
ultrasonic endoscope using PZT and other piezoelectric ceramics.
[0048]
<Modification of First Embodiment> As shown in FIG. 9, an ultrasonic unit 30A and an ultrasonic
endoscope 2A according to a modification of the first embodiment have a plurality of external
electrodes 62B of an ultrasonic element 60. Are connected to the lead 81B. The external
electrodes 62B of the plurality of ultrasonic elements 60 fitted in the recesses 22 of the planar
backing sheet 21 are linearly arranged. For this reason, the plurality of external electrodes 62B
are shorted by one shorting line 81B1. And short circuit line 81B1 is connected with one
conducting wire 81B. That is, since the plurality of external electrodes 62B are all at the same
ground potential, the connection with the conducting wire 81B can be made common.
[0049]
The short circuit line 81B1 may be connected to one lead wire 81B which is a ground line at at
least one place, but may be connected to a plurality of the lead wires 81B. When the cable 80 is a
coaxial cable, a shield wire is used for the conducting wire 81B.
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[0050]
The short circuit line 81B1 is made of a linear or ribbon conductor such as aluminum or copper,
and is connected to the external electrode 62B by a known method such as ultrasonic waves or
heating. Alternatively, the short circuit line 81B1 may be formed by forming a conductive film
made of a conductor such as aluminum or copper through a metal mask, for example. The
conductive film can be formed by a sputtering method, an evaporation method, or a plating
method.
[0051]
The ultrasonic unit 30A and the ultrasonic endoscope 2A have the effects of the ultrasonic unit
30 and the like, and furthermore, there is no need to connect the plurality of external electrodes
62B to the conducting wire 81B, so that manufacture is easier. It is.
[0052]
Second Embodiment Next, an ultrasound unit 30B, an ultrasound endoscope 2B, and the like
according to a second embodiment will be described.
The ultrasonic unit 30B and the like are similar to the ultrasonic unit 30 and the like, so the same
components are denoted by the same reference numerals and the description thereof will be
omitted.
[0053]
As shown in FIGS. 10, 11, and 12, in the ultrasonic unit 30B, the holding member 20B includes
the flexible wiring board 23 in which the recess 22B is formed, the backing sheet 21B, and the
cylindrical hollow member 25. Have. An opening 29 is formed on the bottom of the recess 22B of
the flexible wiring board 23. In other words, a part of the recess 22B of the flexible wiring board
23 is a through hole. The size of the opening 29 is substantially the same as the size of the
transmitting and receiving unit 61 of the ultrasonic element 60.
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[0054]
In the ultrasonic unit 30 of the first embodiment, the ultrasonic element 60 is fitted such that the
second main surface 60SB abuts on the bottom surface of the recess 22 via the adhesive layer
24. On the other hand, in the ultrasonic unit 30B of the present embodiment, the ultrasonic
element 60 is fitted such that the first main surface 60SA is in contact with the bottom surface of
the recess 22B. That is, in the ultrasonic unit 30 and the ultrasonic unit 30B, the fitting direction
to the recess of the ultrasonic element 60 is different by 180 degrees.
[0055]
The cable electrode 28 is disposed on the back surface 23SB facing the forming surface (front
surface) 23SA of the opening 29 of the flexible wiring board 23, and the cable electrode 28 has
the bottom surface of the recess 22B via the internal wiring 27. The relay electrode 26 is
connected to the The relay electrode 26 is connected to the external electrode 62 by, for
example, a flip chip mounting method when the ultrasonic element 60 is fitted in the recess 22B.
[0056]
That is, the ultrasonic element 60 having the external electrode 62 on the first main surface
60SA is fitted such that the first main surface 60SA is in contact with the bottom surface of the
recess 22B in which the opening 29 corresponding to the transmitting / receiving unit 61 is
formed. The flexible wiring board 23 having the relay electrode 26 connected to the external
electrode 62 on the bottom surface of the recess 22B, the second main surface 60SB of the
ultrasonic element 60, and the back surface of the flexible wiring board 23 A backing sheet 21B
for attenuating ultrasonic waves to which 23SB is joined, and a cylindrical hollow member 25 are
provided. The flexible wiring board 23 further includes a cable electrode 28 to which the cable
80 is connected, and an internal wire 27 connecting the relay electrode 26 and the cable
electrode 28.
[0057]
In addition, in order to connect the cable 80, the backing sheet 21B is not joined to the surface of
the cable electrode formation region of the back surface 23SB of the flexible wiring board 23.
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[0058]
The ultrasonic unit 30B and the like have the same effect as the ultrasonic unit 30 and the like,
that is, to support the ultrasonic element 60 having the opening 29 corresponding to the size and
position of the transmitting and receiving unit 61 of the ultrasonic element 60. The formed
recess 22B allows positioning of the ultrasonic element 60 to be performed easily and with high
accuracy.
Further, after the ultrasonic element 60 is fitted, the backing sheet 21B is joined to the back
surface 23SB of the flexible wiring board 23, and the backing sheet 21B is made the outer
periphery of the hollow member 25 together with the flexible wiring board 23 integrated with
the ultrasonic element 60. By rounding into a cylindrical shape, it is possible to manufacture the
electronic scanning type ultrasonic unit 30B in which the ultrasonic elements 60 are arranged in
a cylindrical shape with high accuracy at a predetermined pitch with less man-hours as
compared with the prior art.
[0059]
Furthermore, since the ultrasonic unit 30B is electrically connected to the ultrasonic element 60
simultaneously with the fitting (positioning / arranging) of the ultrasonic element 60, the
manufacturing process is simplified. Further, in the ultrasonic unit 30 according to the first
embodiment, the lead 81 is connected to the external electrode 62 of the same first main surface
60SA as the transmitting and receiving unit 61 of the ultrasonic element 60, so the outer
diameter is large. The On the other hand, the ultrasonic unit 30B of the second embodiment has
an outer diameter smaller than that of the ultrasonic element 60 because the conducting wire 81
is connected to the cable electrode 28 of the back surface 23SB of the flexible wiring board 23.
[0060]
<Modified Example of Second Embodiment> As shown in FIGS. 13 and 14, in the ultrasonic unit
30C and the ultrasonic endoscope 2C of the modified example 1 of the second embodiment, the
flexible wiring board 23C has a plurality of external parts. The plurality of internal wirings 27B
from the plurality of relay electrodes 26B respectively connected to the electrode 62B are shortcircuited by one internal wiring 27B1, and are connected to one cable electrode 28B. And one
04-05-2019
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cable electrode 28B is connected with one conducting wire 81B. That is, since the plurality of
external electrodes 62B are all at the same ground potential, the connection with the conducting
wire 81B is made common. On the other hand, the conducting wire 81A is connected to the relay
electrodes 26A of the driving potential.
[0061]
The ultrasonic unit 30C and the ultrasonic endoscope 2C have the effect of the ultrasonic unit
30B and the like, and further, there is no need to connect the plurality of external electrodes 62B
to the respective conducting wires 81B, so that manufacture is easier. is there.
[0062]
Third Embodiment Next, an ultrasound unit 30D, an ultrasound endoscope 2D, and the like
according to a third embodiment will be described.
The ultrasonic unit 30D and the like are similar to the ultrasonic unit 30B and the like, so the
same components are denoted by the same reference numerals and the description thereof will
be omitted.
[0063]
As shown in FIG. 15, an ultrasonic element 60D of an ultrasonic unit 30D according to the third
embodiment has a transmission / reception surface 61D and an external electrode 62A on a first
main surface 60SA, and an external on a second main surface 60SB. It has an electrode 62B. The
ultrasonic element 60D is, for example, a piezoelectric vibrator using PZT or another
piezoelectric ceramic. In addition, even if it is an electrostatic capacitance type ultrasonic element
using MEMS technology, the same structure as the ultrasonic element 60D by disposing the
external electrode 62B on the second main surface 60SB through the through wiring. Can be
made.
[0064]
And flexible wiring board 23D in which crevice 22B with opening 29 was formed, and backing
04-05-2019
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sheet 21B constitute a holding member of ultrasonic element 60D with hollow member 25 (not
shown). The flexible wiring board 23D has a relay electrode 26A flip-chip connected to the
external electrode 62A, and a cable electrode 28A connected to the relay electrode 26A via the
internal wiring 27A. The cable electrode 28A is disposed on the back surface 23SB of the flexible
wiring board 23D.
[0065]
The conducting wire 81 is solder-bonded, for example, to the external electrode 62B of the
ultrasonic element 60D fitted in the recess 22B and the cable electrode 28A of the flexible wiring
board 23D.
[0066]
In the ultrasound unit 30D and the ultrasound endoscope 2D, the external electrodes 62A and
62B of the ultrasound element 60D are disposed on different surfaces, but have the same effect
as the ultrasound unit 30 and the like.
[0067]
Fourth Embodiment Next, an ultrasonic unit 30E and the like according to a fourth embodiment
will be described.
The ultrasonic unit 30E and so on are similar to the ultrasonic unit 30 and so on, so the same
components are denoted by the same reference numerals and the description thereof will be
omitted.
[0068]
As shown in FIG. 16, an ultrasound unit 30E disposed at the distal end portion 17 of the
ultrasound endoscope 2E has an ultrasound array 60ME which is a convex-type transducer
group.
The ultrasound unit 30E scans a plane including the puncture needle 5 protruding from the
forceps port 33.
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[0069]
As shown in FIG. 17, the holding member 20E of the ultrasonic array 60ME of the ultrasonic unit
30E has a cylindrical shape with a part of the outer peripheral surface having a plurality of
recesses 22. And holding member 20E has backing sheet 21E which is a flexible member with a
plurality of crevices 22, and hollow member 25E by which backing sheet 21E was joined to the
peripheral face.
[0070]
In the ultrasonic element 60E, two external electrodes 62 are formed at one end.
[0071]
As described above, the ultrasonic unit 30E has a plurality of ultrasonic elements 60E each
having a transmission / reception unit 61 for transmitting and receiving ultrasonic waves formed
on the first main surface 60SA, and a plurality of outer peripheral surfaces thereof. A holding
member 20E which is cylindrical with a recess 22 and in which the ultrasonic element 60E is
fitted in each recess 22 and a cable 80 for transmitting a signal of the ultrasonic element 60E are
provided.
[0072]
The ultrasound unit 30E and the ultrasound endoscope 2E have the same effects as the
ultrasound unit 30 and the like.
Similarly, the method of manufacturing the ultrasonic unit 30E has the effects of the method of
manufacturing the ultrasonic unit 30, and the like.
[0073]
Further, as the ultrasonic unit of the embodiment, the ultrasonic array 60M of the radial type
transducer group described in the first embodiment and the like, and the ultrasonic array 60ME
of the convex type transducer group described in the fourth embodiment, May be included.
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[0074]
In addition, the same effect as ultrasonic unit 30A-30D can be provided by using the structure
shown by ultrasonic unit 30A-30D also with the ultrasonic unit which has a convex type | mold
vibrator group.
[0075]
That is, the present invention is not limited to the above-described embodiment or modification,
and various changes, modifications, for example, combinations of components of the embodiment
can be made without departing from the scope of the present invention. It is.
[0076]
DESCRIPTION OF SYMBOLS 1 ... Ultrasonic endoscope system, 2, 2A-2E ... Ultrasonic endoscope,
3 ... Ultrasonic observation apparatus, 10 ... Ultrasonic cell, 20 ... Holding member, 21 ... Backing
sheet, 22 ... Concave part, 23 ... Flexible wiring board 24 Adhesive layer 25 Hollow member 26
Relay electrode 27 Internal wiring 28 Cable electrode 29 Opening 30 30, 30A to 30E Ultrasonic
unit 60 Ultrasonic element 60M ... Ultrasonic array, 61 ... Transmission / reception unit, 62 ...
External electrode, 80 ... Cable, 81 ... Conducted wire
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