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JP2014000153

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DESCRIPTION JP2014000153
Abstract: The present invention provides an ultrasonic transducer that does not reduce the
function of absorbing unnecessary vibrations while ensuring contact with a subject. A substrate
(10), an upper electrode (16) and a lower electrode (12) disposed on the substrate (10) and
facing each other across a gap (14), a backing material (23) and a housing (24) disposed on the
lower surface of the substrate (10) The wiring pattern 21 disposed on the side surface and
electrically connected to the upper electrode 16 and the wiring pattern 22 disposed on the other
side surface of the substrate 10 and electrically connected to the lower electrode 12 and the side
surface of the wiring pattern 21 An ultrasonic transducer including an upper electrode drive
wiring 31 electrically connected and a lower electrode drive wiring 32 electrically connected to a
side surface of the wiring pattern 22. [Selected figure] Figure 2
Ultrasonic transducer
[0001]
The present invention relates to an ultrasonic transducer in which a transducer portion is
disposed on one side of a substrate.
[0002]
An ultrasonic transducer is conventionally used in an ultrasonic diagnostic apparatus or the like
that emits ultrasonic waves and creates a diagnostic image based on an echo signal reflected
from a subject.
[0003]
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1
As this ultrasonic transducer, a capacitive ultrasonic transducer (C-MUT (Capacitive
Micromachined Ultrasonic Transducer)) and a piezoelectric ultrasonic transducer (P-MUT
(Piezoelectric Micromachined Ultrasonic Transducer)) are known. ing.
Here, as a technique of C-MUT, for example, JP-A-2008-119318 and JP-A-2010-272956 can be
mentioned, and as a technique combining C-MUT and P-MUT, for example, JP-A-2007- No.
229328.
[0004]
FIG. 10 is a cross-sectional view showing an example of a conventional C-MUT.
[0005]
In the C-MUT, the first insulating layer 111, the lower electrode 112, the second insulating layer
113, the air gap 114, the third insulating layer 115, the upper electrode 116, the protective film
117 (see FIG. The third insulating layer 115, the upper electrode 116, and the protective film
117 above the air gap 114 are generically referred to as a membrane to form a vibrator portion.
Here, the side on which the vibrator portion of the substrate 110 is formed is referred to as the
upper surface side, and the opposite side is referred to as the lower surface side.
[0006]
In the P-MUT, a piezoelectric element is disposed instead of the air gap 114 in the C-MUT.
[0007]
Further, on the lower surface side of the substrate 110, a backing material 123 for absorbing
unnecessary vibration and a housing 124 provided so as to surround the outer periphery of the
backing material 123 for holding the backing material 123 are disposed. ing.
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Here, the portion where the backing material 123 is disposed is the opposite side portion
sandwiching the substrate 110 in the region where the air gap 114 is provided.
Further, the portion where the housing 124 is disposed is the opposite side portion sandwiching
the substrate 110 in the region surrounding the region where the air gap 114 is provided.
[0008]
Then, by applying a voltage between the lower electrode 112 and the upper electrode 116, the
membrane above the air gap 114 vibrates to transmit an ultrasonic wave. When an ultrasonic
wave is received, the membrane vibrates to change the distance between the lower electrode 112
and the upper electrode 116, and the voltage between the electrodes changes to be detected as
an electrical signal.
[0009]
By the way, since a silicon wafer or the like is used as the substrate 110, the wiring for supplying
electricity to the lower electrode 112 and the upper electrode 116 is connected on the upper
surface side for transmitting and receiving ultrasonic waves.
[0010]
That is, a part of the upper electrode 116 is exposed to the outside from the protective film 117
in a region where the air gap 114 is not provided, for example, on the left side of FIG. 10 to form
an electrode pad. It is connected to the upper electrode drive wiring 131 via the same.
[0011]
The lower electrode 112 is partially exposed to the outside from the second insulating layer 113,
the third insulating layer 115, the protective film 117, etc. in the region where the air gap 114 is
not provided, for example, on the right side of FIG. An electrode pad is formed, and the electrode
pad is connected to the lower electrode drive wiring 132 via the solder 135.
[0012]
The portion of the upper electrode drive wiring 131 opposed to the side surface of the substrate
110 is covered with the insulating cover 131a, and similarly, the portion of the lower electrode
drive wiring 132 is covered with the insulating cover 132a.
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[0013]
Further, the connection portion of the upper electrode drive wiring 131 and the lower electrode
drive wiring 132 is covered with the wiring protection member 133 so as to be insulated.
[0014]
However, when the wiring to the electrode is performed on the upper surface side of the
substrate 110, as shown in FIG. 10, the wiring portion protrudes higher than the membrane.
With such a structure, it is difficult to bring the membrane into contact with the subject
sufficiently, which in turn reduces the transmission / reception efficiency of ultrasonic waves.
[0015]
Therefore, a configuration for coping with such a problem will be described with reference to
FIG.
FIG. 11 is a cross-sectional view showing another example of a conventional C-MUT.
[0016]
In this example, wiring to the electrodes is performed on the lower surface side of the substrate
110.
For this purpose, a substrate 110 with through hole vias (through vias) is used as the substrate
110.
[0017]
That is, in the substrate 110, through-hole vias 141, 142, 143 which are vias penetrating in the
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thickness direction are formed.
[0018]
The upper electrode 116 is exposed on the side of the substrate 110 and is electrically connected
to the through hole via 141.
The lower electrode 112 is also exposed on the side of the substrate 110 and is connected to the
through hole via 142.
[0019]
An upper electrode drive wiring 131 and a lower electrode drive wiring 132 are disposed on the
lower surface side of the substrate 110.
The upper electrode drive wiring 131 is electrically connected to the through hole via 141, and
thus to the upper electrode 116.
Lower electrode drive interconnection 132 is electrically connected to through hole via 142 and
similarly electrically connected to lower electrode 112.
[0020]
JP 2008-119318 A JP JP 2010-272956 JP A JP 2007-229328 A
[0021]
However, in the configuration shown in FIG. 11, spaces 123a and 123b are provided on the
lower surface side of the substrate 110 and in the portion where the backing material 123
should be originally disposed, the upper electrode drive wiring 131 in the space 123a and the
lower part in the space 123b. The electrode drive wiring 132 is each arrange | positioned.
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Accordingly, in the spaces 123a and 123b, unnecessary absorption of vibration by the backing
material 123 can not be performed, so that the acoustic characteristics are impaired and the
resolution is lowered.
[0022]
In addition, in order to prevent the occurrence of a defect in the backing material 123, it is
conceivable to provide a space in a portion where the housing 124 is to be disposed, and to
dispose the upper electrode drive wiring 131 and the lower electrode drive wiring 132. In this
case, a thin portion is formed in the housing 124 to lower the strength, and a portion in which
the housing 124 is not in contact with the backing material 123 is generated, so the function of
holding the backing material 123 is reduced. It will not be stable.
[0023]
Thus, there is a need for an ultrasonic transducer that can absorb unnecessary vibrations while
ensuring contact with a subject.
[0024]
The present invention has been made in view of the above circumstances, and it is an object of
the present invention to provide an ultrasonic transducer that does not reduce the function of
absorbing unnecessary vibrations while ensuring the contact with a subject.
[0025]
In order to achieve the above object, an ultrasonic transducer according to one aspect of the
present invention is disposed on a substrate, one surface of the substrate, and includes a lower
electrode, an air gap or a piezoelectric element, the air gap or the piezoelectric material. A
vibrator portion having an upper electrode facing the lower electrode with an element interposed
therebetween, a backing material disposed on the other surface of the substrate, and the other
surface of the substrate so as to surround the outer periphery of the backing material And a first
conductive portion disposed on one side of the substrate and electrically connected to the upper
electrode, and disposed on the other side of the substrate, the lower electrode A second
conductive portion electrically connected to the first conductive portion, an upper electrode drive
wiring electrically connected to the side surface of the first conductive portion, and a lower
electrode drive electrically connected to the side surface of the second conductive portion And
wiring.
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[0026]
According to the ultrasonic transducer of the present invention, the function of absorbing
unnecessary vibration is not reduced while ensuring the contact with the object.
[0027]
BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows the whole structure
of the ultrasonic transducer in Embodiment 1 of this invention.
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1 when configured as a C-MUT in the
first embodiment.
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1 when configured as a P-MUT in the
first embodiment.
FIG. 14 is a cross-sectional view showing a C-MUT configured on a substrate with through-hole
vias in Embodiment 2 of the present invention.
FIG. 13 is a cross-sectional view showing a state in which a substrate having a C-MUT is cut at a
through hole via portion in the second embodiment;
FIG. 13 is a cross-sectional view showing a state in which wiring is performed on a substrate cut
at a through hole via portion in the second embodiment; Sectional drawing which shows a mode
that C-MUT was comprised on the board | substrate with a blind via | veer in Embodiment 3 of
this invention. FIG. 14 is a cross-sectional view showing a state in which a substrate having a CMUT is cut at a blind via portion in the third embodiment. FIG. 14 is a cross-sectional view
showing a state in which wiring is performed on a substrate cut at a blind via portion in the third
embodiment. Sectional drawing which shows an example of the conventional C-MUT. Sectional
drawing which shows the other example of the conventional C-MUT.
[0028]
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Hereinafter, embodiments of the present invention will be described with reference to the
drawings. Embodiment 1
[0029]
1 to 3 show Embodiment 1 of the present invention, and FIG. 1 is a perspective view showing an
entire configuration of an ultrasonic transducer.
[0030]
As shown in FIG. 1, the ultrasonic transducer 1 is configured by arranging an ultrasonic vibration
unit 3 on a housing unit 2.
[0031]
The ultrasonic vibration unit 3 is configured by arranging a plurality of MUT elements 3a which
are units for inputting and outputting a drive control signal, and each MUT element 3a is formed
with a plurality of MUT cells 3b serving as a vibration unit.
[0032]
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1 when configured as a C-MUT.
FIG. 2 shows an example in which a capacitive ultrasonic transducer (C-MUT (Capacitive
Micromachined Ultrasonic Transducer)) is adopted as the ultrasonic transducer 1.
[0033]
In the C-MUT, a first insulating layer 11, a lower electrode 12, a second insulating layer 13, a
void 14 (this void 14 is also referred to as a cavity), a A vibrator portion is formed by laminating
the three insulating layers 15, the upper electrode 16, and the protective film 17 (the third
insulating layer 15, the upper electrode 16, and the protective film 17 on the air gaps 14 are
collectively referred to as a membrane). It is
Hereinafter, the side on which the vibrator portion of the substrate 10 is formed is referred to as
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the upper surface side, and the opposite side is referred to as the lower surface side.
[0034]
First, the first insulating layer 11 is formed to cover the entire top surface of the substrate 10.
[0035]
Further, on the substrate 10, the second wiring pattern 22 which is the second conductive
portion is directly formed on the right side in FIG. 2 at the latest before forming the lower
electrode 12, and at the latest before forming the upper electrode 16. The first wiring pattern 21
which is a first conductive portion is directly formed on the left side surface in FIG.
These wiring patterns 21 and 22 are formed at least to the same position as the upper surface of
the substrate 10, and in the example shown in FIG. 2, further formed to the same position as the
lower surface of the substrate 10.
[0036]
The lower electrode 12 is formed to cover a region corresponding to the air gap 14, and in the
example shown in FIG. 2, extends from the region corresponding to the air gap 14 to the right
and is connected to the second wiring pattern 22 .
[0037]
The second insulating layer 13 is formed to cover the entire upper surface of the lower electrode
12 and the upper surface of the first insulating layer 11 exposed from the lower electrode 12.
[0038]
For example, a sacrificial layer having the same shape as that of the air gap 14 is first formed on
the upper surface of the second insulating layer 13, and then the third insulating layer 15 is
formed, and then the sacrificial layer is removed after the third insulating layer 15 is formed.
Thus, the air gap 14 is formed.
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The gaps 14 correspond one-to-one to the MUT cells 3 b serving as the above-described vibration
unit.
[0039]
The third insulating layer 15 is formed to cover the entire top surface of the second insulating
layer 13 with the air gap 14 interposed therebetween as described above.
[0040]
Similar to the lower electrode 12, the upper electrode 16 is formed to cover a region
corresponding to the air gap 14, and is opposed to the lower electrode 12 with the air gap 14
interposed therebetween.
Then, in the example shown in FIG. 2, the upper electrode 16 is extended leftward from the
region corresponding to the air gap 14 and connected to the first wiring pattern 21.
[0041]
The protective film 17 is formed to cover the entire upper surface of the upper electrode 16 and
the upper surface of the third insulating layer 15 exposed from the upper electrode 16.
[0042]
The layers from the substrate 10 to the protective film 17 as described above are included in the
ultrasonic vibration unit 3 shown in FIG.
[0043]
On the other hand, the housing portion 2 shown in FIG. 1 includes the backing material 23 and
the housing 24.
[0044]
That is, on the lower surface side of the substrate 10 corresponding to the area in which the air
gap 14 is provided, the backing material 23 for absorbing unnecessary vibration is disposed.
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[0045]
Furthermore, in order to hold the backing material 23, a housing 24 is provided so as to
surround the outer periphery of the backing material 23.
Therefore, the portion where the housing 24 is disposed is the opposite side of the region
surrounding the region where the air gap 14 is provided (therefore, the region where the air gap
14 is not provided) across the substrate 10.
[0046]
As an actual manufacturing process, the housing 24 may be disposed first, and then the backing
material 23 may be filled in the housing 24 or the like.
[0047]
As described above, wiring is performed for the ultrasonic transducer 1 in which the housing unit
2 is disposed in the ultrasonic vibration unit 3.
[0048]
That is, the upper electrode drive wiring 31 is electrically connected and fixed to the side surface
of the first wiring pattern 21 shown in FIG. Ru.
[0049]
Similarly, the lower electrode drive wiring 32 is electrically connected and fixed to the side
surface of the second wiring pattern 22 shown in FIG. Be done.
[0050]
Further, a portion of the upper electrode drive wiring 31 covered by the insulating outer skin 31
a and a portion of the lower electrode drive wiring 32 covered by the insulating outer skin 32 a
are fixed to the side surface of the housing 24.
[0051]
Then, the first wiring pattern 21, the upper electrode drive wiring 31 electrically connected to
the side surface of the first wiring pattern 21, the second wiring pattern 22, and the side surface
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of the second wiring pattern 22 are electrically connected. A wire protection material 33 for
insulatingly covering the connected lower electrode drive wire 32 (or further the side surface of
the housing 24) is further formed of a nonconductive material.
[0052]
Such an ultrasonic transducer 1 roughly performs, for example, the following operation.
[0053]
A bias voltage is applied between the upper electrode 16 and the lower electrode 12 through the
upper electrode drive wiring 31 and the lower electrode drive wiring 32, and the third insulating
layer 15, the upper electrode 16, and the protective film 17 above the air gap 14. Apply tension
to the membrane composed of
[0054]
In this state, when a drive signal is supplied to the lower electrode 12 and the upper electrode
16, the above-described membrane vibrates to transmit an ultrasonic wave.
[0055]
In addition, when ultrasonic waves are received in a state where a bias voltage is applied between
the lower electrode 12 and the upper electrode 16, this membrane vibrates and the distance
between the lower electrode 12 and the upper electrode 16 changes, so that the electrode The
voltage between them changes and is detected as an electrical signal.
[0056]
In addition, although the capacitive ultrasonic transducer (C-MUT) provided with the space | gap
14 in FIG. 2 was shown in FIG. 2 as the ultrasonic transducer 1, it replaces with this and a
piezoelectric ultrasonic wave as shown in FIG. It may be an oscillator (P-MUT (Piezoelectric
Micromachined Ultrasonic Transducer)).
Here, FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1 when configured as a P-MUT.
[0057]
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12
The P-MUT shown in FIG. 3 has a piezoelectric element 14 p (this piezoelectric element 14 p is
also called a piezoelectric element) in place of the air gap 14 in the C-MUT shown in FIG. 2.
[0058]
Also for such a C-MUT, it is possible to have the same wiring structure as the above-described PMUT.
[0059]
According to the first embodiment, the wiring patterns 21 and 22 are provided directly on both
side surfaces of the substrate 10 to connect the upper electrode 16 and the lower electrode 12,
respectively. Since the upper electrode drive wiring 31 and the lower electrode drive wiring 32
are respectively connected, it is not necessary to perform wiring on the upper surface side of the
substrate 10.
As a result, the wiring does not protrude upward beyond the protective film 17, so that the
contact with the subject can be secured, and ultrasonic waves can be transmitted and received to
the subject with high efficiency.
[0060]
Further, since the backing material 23 is disposed on the lower surface side of the substrate 10
corresponding to the area in which the air gap 14 (or the piezoelectric element 14p) is provided,
unnecessary vibration can be sufficiently absorbed.
Furthermore, since the housing 24 is also provided to surround the outer periphery of the
backing material 23, the shape of the backing material 23 is stabilized.
Thus, the original resolution of the ultrasonic transducer 1 can be secured without impairing the
acoustic characteristics.
[0061]
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13
Then, for example, in the case where wiring is made to the ultrasonic vibration unit 3 and then
connected to the housing unit 2, since it is necessary to carry out the work without damaging the
wiring connection to the ultrasonic vibration unit 3, the connection operation is extremely
difficult It is.
On the other hand, when connecting the ultrasonic vibration unit 3 after fixing the wiring to the
housing unit 2, the wiring connection unit such as a flexible printed board is minutely bent at the
end of the housing unit 2 facing the substrate 10. And it is necessary to fix the electrode surfaces
so as to be conductive, which similarly requires a difficult task.
On the other hand, according to the present embodiment, since wiring can be performed to the
ultrasonic transducer 1 in which the ultrasonic vibration unit 3 and the housing unit 2 are
connected, there is an advantage that the assemblability is improved.
Second Embodiment
[0062]
4 to 6 show Embodiment 2 of the present invention, and FIG. 4 is a cross-sectional view showing
a C-MUT formed on a substrate with through-hole vias, and FIG. 5 shows a C-MUT. 6 is a crosssectional view showing a state in which wiring is performed on the substrate cut at the through
hole via portion.
[0063]
In the second embodiment, the same parts as those of the first embodiment described above are
denoted by the same reference numerals and descriptions thereof will be omitted, and only
different points will be mainly described.
[0064]
In addition, although C-MUT is mentioned as an example and demonstrated also in this
embodiment, it is the same as that of Embodiment 1 that it may be P-MUT.
[0065]
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14
In the present embodiment, as shown in FIG. 4, the substrate 10 in which the through hole vias
41, 42 and 43 are provided at appropriate intervals is used as the substrate 10.
Here, the respective through hole vias 41, 42 and 43 are vias provided penetrating in the
thickness direction of the substrate 10 (that is, vias exposed at least on the upper surface of the
substrate 10).
In the cross-sectional view of FIG. 4, the through hole via 41 is provided on the left side of the
substrate 10 and the through hole via 42 is provided on the right side. Are through-hole vias 43.
Of the through-hole vias 41, 42 and 43, the through-hole via 43 is provided at a position
corresponding to the region in which the air gap 14 (or the piezoelectric element 14p) is
provided. (Or the piezoelectric element 14p) is provided at a position corresponding to the area
where it is not provided.
[0066]
The first insulating layer 11 to the protective film 17 are sequentially stacked on the upper
surface of the substrate 10 to form the vibrator portion, as in the first embodiment described
above.
However, the upper electrode 16 is formed so as to be electrically connected to the through hole
via 41, and the lower electrode 12 is formed so as to be electrically connected to the through
hole via.
[0067]
Next, as shown in FIG. 4, the substrate 10 in which the vibrator portion is formed is cut in the
thickness direction of the substrate 10 so as to expose the through hole via 41 and the through
hole via 42.
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The through hole via 41 thus exposed becomes a first conductive portion, and the through hole
via 42 becomes a second conductive portion.
[0068]
However, since it is difficult to cut only the substrate 10 without cutting the through hole vias 41
and 42, practically, the through hole vias 41 and 42 should be included at the position indicated
by the arrow B in FIG. The substrate 10 is to be cut.
[0069]
Subsequently, as shown in FIG. 6, after the backing material 23 and the housing 24 are attached
to the substrate 10, the upper electrode drive wiring 31 is electrically connected to the cut
surface of the through hole via 41 which is the first conductive portion. The lower electrode
drive wiring 32 is fixed and electrically connected and fixed to the cut surface of the through
hole via 42 which is the second conductive portion.
[0070]
Thereafter, the wiring connection portion is covered with the wiring protection material 33 as in
the first embodiment described above.
[0071]
According to the second embodiment, through-hole vias are provided at positions corresponding
to regions where air gaps 14 (or piezoelectric elements 14p) are not provided using substrate 10
provided with through-hole vias. By using 41 and 42 as the first conductive portion and the
second conductive portion, substantially the same effect as that of the first embodiment
described above can be obtained.
Third Embodiment
[0072]
7 to 9 show Embodiment 3 of the present invention, and FIG. 7 is a cross-sectional view showing
a C-MUT formed on a substrate with blind vias, and FIG. 8 is a C-MUT formed FIG. 9 is a crosssectional view showing a state in which wiring is performed on the substrate cut at the blind via
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portion.
[0073]
In the third embodiment, the same parts as those in the first and second embodiments described
above will be assigned the same reference numerals and descriptions thereof will be omitted, and
only differences will be mainly described.
[0074]
In addition, although C-MUT is mentioned as an example and demonstrated also in this
embodiment, it is the same as Embodiment 1 and 2 that it may be P-MUT.
[0075]
Although Embodiment 2 mentioned above formed the 1st electric conduction part and the 2nd
electric conduction part using a through hole via, this embodiment forms a 1st electric
conduction part and a 2nd electric conduction part using a blind via. It has become.
[0076]
That is, the substrate 10 of the present embodiment is formed by laminating the first substrate
10A on the upper side and the second substrate 10B on the lower side.
[0077]
Although the vias 41A and 42A are provided in the first substrate 10A, the vias are not provided
in the second substrate 10B.
Therefore, the vias 41A and 42A are blind vias when viewed from the entire substrate 10 (the
entire first substrate 10A and the second substrate 10B), and the upper surface of the substrate
10 (on which the vibrator portion is formed) Exposed to the surface, but not exposed to the lower
surface (the surface on the housing 24 side).
[0078]
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17
The first insulating layer 11 to the protective film 17 are sequentially stacked on the upper
surface of the substrate 10 (that is, the upper surface of the first substrate 10A) to form the
vibrator portion as in the first and second embodiments described above. It is.
However, the upper electrode 16 is electrically connected to the blind via 41A and the lower
electrode 12 to the blind via 42A.
[0079]
The blind vias 41A and 42A are provided at positions corresponding to the regions where the air
gap 14 (or the piezoelectric element 14p) is not provided, as in the through hole vias 41 and 42
of the second embodiment.
[0080]
Then, as shown in FIG. 7, the blind via 41A at the position indicated by the arrow C in FIG. 8 is
more practical so that the substrate 10 on which the vibrator portion is formed exposes the blind
via 41A and the blind via 42A. , 42A are cut in the thickness direction.
The blind via 41A thus exposed becomes the first conductive portion, and the blind via 42A
becomes the second conductive portion.
[0081]
Subsequently, as shown in FIG. 9, after the backing material 23 and the housing 24 are attached
to the substrate 10, the upper electrode drive wiring 31 is electrically connected to the cut
surface of the blind via 41A which is the first conductive portion and fixed. The lower electrode
drive wiring 32 is electrically connected and fixed to the cut surface of the blind via 42A which is
the second conductive portion.
[0082]
Thereafter, the wiring connection portion is covered with the wiring protection material 33 as in
the first and second embodiments described above.
[0083]
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18
According to the third embodiment, even by using the substrate 10 provided with the blind vias
41A and 42A, substantially the same effect as the second embodiment using the substrate 10
provided with the through hole vias 41 and 42 is provided. Can be played.
[0084]
The present invention is not limited to the above-described embodiment as it is, and in the
implementation stage, the constituent elements can be modified and embodied without departing
from the scope of the invention.
In addition, various inventions can be formed by appropriate combinations of a plurality of
components disclosed in the above embodiments.
For example, some components may be deleted from all the components shown in the
embodiment.
Furthermore, the constituent elements in different embodiments may be combined as
appropriate.
As a matter of course, various modifications and applications are possible without departing from
the scope of the invention.
[0085]
DESCRIPTION OF SYMBOLS 1 ... Ultrasonic transducer 2 ... Housing part 3 ... Ultrasonic vibration
part 3a ... MUT element 3b ... MUT cell 10 ... Board | substrate 10A ... 1st board | substrate 10B ...
2nd board | substrate 11 ... 1st insulating layer (oscillator part) 12 Lower electrode (vibrator
portion) 13 second insulating layer (vibrator portion) 14 air gap (vibrator portion) 14 p
piezoelectric element (vibrator portion) 15 third insulating layer (vibrator portion) 16 upper
portion Electrodes (vibrator portion) 17: protective film (vibrator portion) 21: wiring pattern
(first conductive portion) 22: wiring pattern (second conductive portion) 23: backing material 24:
housing 31: upper electrode drive wiring 31a: Insulating sheath 32 lower electrode drive wiring
32a insulating sheath 33 wiring protective material 41 through hole via (first conductive portion)
42 through hole via (second conductive portion) 43 through hole via 41A bra India via (first
conductive part) 42A ... blind via (second conductive part)
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