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JP2015527568

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JP2015527568
Abstract A microsensor package (10) is provided that includes a microsensor (12) and a printed
circuit board (PCB) (14), or includes an array of microsensors and PCBs (14). The microsensor
(12) comprises a first substrate (16) having opposing front and back surfaces, a sensing element
(12) on the front surface of the first substrate (16), and a first substrate. And including through
chip vias disposed and electrically connected to the sensing element. The PCB (14) comprises a
second substrate (38) to which the back side of the first substrate (16) is adhered. The second
substrate (38) defines a recess (44) in which the bonding pad (42) is disposed and the through
chip vias (30, 32) of the microsensor (12) are connected to the PCB (14) Electrically connected to
the adhesive pad (42) of The microsensor package (10) further includes a shim (48) adhered to
the PCB (14), and the shim surrounds the outer boundary of the microsensor (12) and is
approximately the same as the microsensor (12) It has a thickness. [Selected figure] Figure 1 c
MICRO SENSOR PACKAGE AND RELATED METHOD OF ASSEMBLING MICRO SENSOR PACKAGE
[0001]
The present disclosure relates generally to sensors, and in particular to sensor packages and
related methods of assembling sensor packages.
[0002]
Measurement of physical quantities is often performed to determine and understand the effects
of physical phenomena.
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For example, measurements of noise and sources or causes of noise are often performed to
understand the physics behind the generation of noise. For example, measurements are
performed to identify where the noise is coming from.
[0003]
This type of analysis may be performed in the testing of the device. For example, noise data is
collected for aircraft engines, such as jet engines. The collected noise data is analyzed to
determine which components within and outside the jet engine contribute to the noise. These
various components are also referred to as component noise sources.
[0004]
The various structures or components in the jet engine or in the jet exhaust generated by the jet
engine contribute different noises at different frequencies. For example, various surfaces within
the jet engine duct and inlet contribute to noise during jet engine operation. For example, the
high velocity exhaust stream of a jet engine contributes to noise during engine operation.
[0005]
The surface may be treated with various compounds or components in an effort to reduce noise.
With this type of example, jet engines are tested with their surfaces to determine whether their
contribution to noise from various types of surfaces is reduced using various treatments. Be
done.
[0006]
Currently, multiple microphones are used to collect noise data. This noise data is processed to
produce a "schematic" of where the noise is coming from and to determine the intensity of the
radiated noise. In acquiring this data, acoustic sensors such as microphones are placed at various
locations. Hundreds or more to cover all sound propagation paths formed by connecting
hundreds of candidate noise source locations to dozens of measurement points of interest using
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the current array design One thousand array locations are required.
[0007]
Any number of different types of microphones have been tested for use in aeroacoustic
applications where the microphones have to meet any number of requirements. Micromachine
technology (MEMS) microphones are one of the latest types of promising microphones. However,
the road to inexpensive package MEMS sensors that meet the requirements of aeroacoustic
applications is currently unknown. Therefore, it is desirable to have microsensor packages and
related methods of fabricating microsensor packages that take into account at least some of the
problems described above, as well as other potential problems.
[0008]
Exemplary embodiments of the present disclosure are generally directed to microsensor
packages and related methods of assembly thereof. The microsensors of the exemplary
embodiments are robust, resistant to EMI (electromagnetic interference) and, if desired, also
ultrathin for individual sensors or groups of sensors. Packaged to get an ultra-flush setting. The
solution to this technical problem enables a number of sensor development scenarios, thereby
enabling application to individual sensors and several applications for multiple sensors not
currently available. For example, in the context of microphones, these development scenarios
may include large channel counts, high fidelity noise source position array development, and / or
flight testing and measurement at previously inaccessible locations in the wind tunnel test
section. Including the development of a similar array on the outer surface of the fuselage of the
aircraft for the scenario. The measurement fidelity provided by the exemplary embodiment is a
significant improvement over previous capabilities. The exemplary embodiment solves some
technical problems in order to obtain the desired sensor package effect.
[0009]
The micro sensor package of the exemplary embodiment and the associated method of its
assembly can solve any number of technical problems. For example, the exemplary embodiment
allows the sensing element of the sensor to position the sensing element in the plane of the
smooth surface and to do so with an inconsequential gap between the surface and the sensor Can
be created to be part of a smooth surface, with no major disruption to the smoothness of the
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surface. The exemplary embodiment also establishes a package that is resistant to EMI, which is
particularly important for high impedance sensor designs that are typically vulnerable to EMI.
[0010]
The exemplary embodiment further includes attaching the sensor to a PCB (printed circuit board)
simultaneously with sealing the cavity and the vent channel on the back side of the sensor,
mounting the through-chip via Solve a problem. The exemplary embodiments also solve the
above-mentioned technical problems for multi-sensor packages, including precisely positioning
the sensors relative to one another. Furthermore, the exemplary embodiment produces a discrete
sensor package that incorporates the aforementioned resistance characteristics against EMI and
through chip via attachment and backside sealing. And, the exemplary embodiment solves the
technical problem in the method of fabricating the micro sensor package.
[0011]
According to one aspect of the exemplary embodiment, a micro sensor package is provided that
includes a micro sensor and a printed circuit board (PCB). The microsensor is a first substrate
having opposing front and back surfaces, a sensing element on the front surface of the first
substrate, and a through hole disposed within the first substrate and electrically connected to the
sensing element Includes chip vias. The PCB includes a second substrate to which the back side
of the first substrate is adhered. The second substrate defines a recess within which the bond pad
is disposed, and the through chip via of the microsensor is electrically connected to the bond pad
of the PCB. In one embodiment, the PCB includes vias disposed within the area of the second
substrate and is electrically connected to the bond pads opposite the through chip vias of the
microsensor electrically connected to the bond pads. .
[0012]
In one embodiment, the micro sensor package further includes a shim bonded to the PCB, and
the shim surrounds the outer boundary of the micro sensor and has approximately the same
thickness as the micro sensor. In this embodiment, the second substrate defines another recess
within which another adhesive pad is disposed, and the shim is electrically connected to the
other adhesive pad.
04-05-2019
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[0013]
In one embodiment, the through-chip vias of the microsensor are electrically connected to the
bond pad using a conductive adhesive disposed within the open volume of the recess above the
bond pad. In this embodiment, the open volume is larger than the volume of conductive adhesive
placed within the area. Also in this embodiment, the back side of the first substrate is bonded to
the PCB using an adhesive that surrounds and seals the conductive adhesive.
[0014]
In one embodiment, the microsensor is defined by a front surface defined by a portion of the
front surface of the first substrate and a corresponding portion of the back surface of the first
substrate within the scope of a cavity defined therein. It includes a diaphragm having a back
surface. In this embodiment, the back side of the first substrate further defines a vent channel
connecting the cavity to the front side of the first substrate. The back side of the first substrate is
then bonded to the PCB using an adhesive that surrounds and seals the cavities or cavities and
the vent channels.
[0015]
In the text and drawings, a microsensor package 10 is disclosed comprising: a microsensor 12
comprising a first substrate 16 having opposing front and back surfaces, an upper surface of the
first substrate 16 And a second substrate 38 to which the backside of the first substrate 16 is
bonded and through chip vias 30, 32 disposed within the range of the first substrate 16 and
electrically connected to the sensing element. And the second substrate 38 defines within that
range a recess 40 in which the adhesive pad 42 is disposed, and the through chip vias of the
microsensor 12 are electrically connected to the adhesive pads of the printed circuit board 14.
Be done.
[0016]
Advantageously, in the micro sensor package 10, the through chip vias 30, 32 of the micro
sensor 12 are bonded pads 42 using a conductive adhesive 46 disposed within the open volume
of the recess 40 on the bonding pad 42. And the open volume is larger than the volume of the
conductive adhesive 46 disposed within the area, and the back surface of the first substrate 16 is
an adhesive 44 that surrounds and seals the conductive adhesive 46. Are bonded to the printed
circuit board 14 using
04-05-2019
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[0017]
Advantageously, the microsensor package 10 further includes a shim 48 surrounding the outer
boundary of the microsensor 12 and adhered to the printed circuit board 14, the shim 48 having
approximately the same thickness as the microsensor 12.
Advantageously, in the micro sensor package 10, the second substrate 38 defines another recess
within which the further adhesive pad 42 is arranged, the shim 48 being another, for example
another, adhesive pad 42 Electrically connected to
[0018]
Advantageously, in the micro sensor package 10, the micro sensor 12 is a front surface defined
by a portion of the front surface of the first substrate 16 and of the first substrate 16 within the
cavity 26 defined therein. The back side of the first substrate 16 is bonded to the printed circuit
board 14 using an adhesive 44 which surrounds and seals the cavity 26 and includes a
diaphragm 18 having a back side defined by corresponding portions of the back side.
[0019]
Advantageously, in the micro sensor package 10, the back side of the first substrate 16 further
defines a vent channel 28 connecting the cavity 26 to the front side of the first substrate 16 and
the back side of the first substrate 16 is The printed circuit board 14 is bonded using an adhesive
44 that surrounds and seals the cavity 26 and the vent channel 28.
[0020]
Advantageously, in the micro sensor package 10, the printed circuit board 18 is disposed within
the second substrate 38 and to the through chip vias 30, 32 of the micro sensor 12 electrically
connected to the adhesive pads 42. It includes vias electrically connected to the opposing
adhesive pads 42.
[0021]
In one aspect, the microsensor package 10 includes an array of microsensors each including a
first substrate 16 having opposed front and back surfaces, a sensing element 12 on the front
surface of the first substrate 16, and a first substrate 16 includes printed circuit boards 14
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including through chip vias 30, 32 disposed within the range of 16 and electrically connected to
the sensing elements 12 and a second board 38 to which the back side of the first board 16 is
adhered; The second substrate 38 defines an array of recesses 40 in which the corresponding
array of bond pads 42 is disposed, and the through chip vias 30, 32 of the microsensors 12 of
each of the array of microsensors are of the bond pads 42. Electrically connected to each bond
pad 42 of the array.
[0022]
Advantageously, in the micro sensor package 10, for each micro sensor 12 of the array of micro
sensors, the through chip vias 30, 32 are within the open volume of the recess 40 on the
respective bond pad 42. A printed circuit using an adhesive 44 electrically connected to each
adhesive pad 42 with the conductive adhesive 46 disposed and the back of the first substrate 16
enclosing and sealing the conductive adhesive 46 It is bonded to the substrate 14.
[0023]
Advantageously, the microsensor package 10 further includes an array shim 68 surrounding the
outer boundary of the microsensor of the array of microsensors, the array shim 68 being bonded
to the printed circuit board and approximately the same thickness as the microsensor Have.
[0024]
Advantageously, the microsensor package 10 further comprises a plurality of individual shims 48
surrounding the outer boundary of each of the microsensors 12 and adhered to the printed
circuit board 14, the individual shims 48 being microsensors With approximately the same
thickness as 12, the array shims 68 surround the outer boundaries of the individual shims 48
and the microsensors of the array.
[0025]
Advantageously, in the micro-sensor package 10, the second substrate 38 defines another
plurality of recesses 44 in which another plurality of adhesive pads 42 is arranged, the individual
shims 48 another For example, it is electrically connected to each of a plurality of other adhesive
pads 48.
[0026]
Advantageously, in the micro-sensor package 10, for each micro-sensor 12 of the array of microsensors, the micro-sensor 12 comprises a front surface defined by a portion of the front surface
of the first substrate 16 and And a diaphragm 18 having a back surface defined by a
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corresponding portion of the back surface of the first substrate 16 within the range of cavities
defined therein, and for each microsensor 12 of the array of microsensors, The back side of the
first substrate 16 is bonded to the printed circuit board 18 using an adhesive 44 that surrounds
and seals the cavity 26.
[0027]
Advantageously, in the microsensor package 10, the back side of the first substrate 16 further
defines vent channels 28 connecting the cavities 26 to the front side of the first substrate 16 and
each of the array of microsensors The back surface of the first substrate 16 is bonded to the
printed circuit board 14 using an adhesive 44 that surrounds and seals the cavity 26 and the
vent channel 28.
[0028]
Advantageously, in the microsensor package 10, for each of the one or more microsensors 12 of
the array of microsensors, the printed circuit board 14 is disposed within the range of the second
substrate 38, And vias electrically connected to the adhesive pads 42 opposite to the through
chip vias 30, 32 of the microsensor 12 electrically connected to the adhesive pads 42.
[0029]
In one aspect, including mechanically bonding the microsensor 12 to the printed circuit board
14, the microsensor 12 senses a first substrate 16 having opposing front and back surfaces, the
front surface of the first substrate 16 The element 12, and the through chip vias 30, 32 disposed
within the range of the first substrate 16 and electrically connected to the sensing element 12,
the printed circuit board 14 within which the adhesive pad 42 is disposed Including the second
substrate 38 defining the recess 44 and mechanically bonding the microsensor 12 to the printed
circuit board 14 includes bonding the back of the first substrate 16 to the second substrate 38
And electrically bonding the micro sensor 12 to the printed circuit board 14 means that the
through chip vias 30 and 32 of the micro sensor 12 can Includes electrically bonded to de 42, a
method of assembling a microsensor package 10 is disclosed.
[0030]
Advantageously, in the method, the electrical adhesion is performed using the conductive
adhesive 46 disposed on the through chip vias 30, 32 or the adhesive pad 42 to the through chip
vias 30, 32 of the microsensor 12 to the adhesive pad 42. The conductive adhesive 46 is
disposed within the open volume of the recess on the adhesive pad 42 and the open volume is
disposed within the range, including electrical bonding, after the electrical bonding. The first
substrate is larger than the volume of the adhesive 46 and mechanical bonding and electrical
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bonding are simultaneously performed, and the mechanical bonding is performed using the
adhesive 44 which surrounds and seals the conductive adhesive 46. Mechanically bonding the
back side of the substrate 16 to the printed circuit board 14;
[0031]
Advantageously, the method further comprises mechanically bonding the shims 48 to the printed
circuit board 14, the microsensor 12 and the shims 48 such that the shims 48 surround the
outer boundary of the microsensors 12. And the shim 48 has approximately the same thickness
as the microsensor 12.
[0032]
Advantageously, in the method, the mechanical and electrical adhesion of the microsensor 12
further comprises mechanically and electrically adhering the array of microsensors to the printed
circuit board 14 and the mechanical of the shim 48 Bonding involves mechanically bonding the
array shims 68 to the printed circuit board 14 such that the array shims 68 surround the outer
boundaries of the microsensors 12 of the array of microsensors.
[0033]
Advantageously, also in the method, the mechanical adhesion of the shims 48 is further such that
the individual shims 48 surround the outer boundary of each of the microsensors 12 and the
array shims 68 are individual shims 48 and the array Mechanically bonding the plurality of
individual shims 48 to the printed circuit board 14 so as to surround the outer boundary of the
microsensor 12 of FIG.
[0034]
Advantageously, in the method, the second substrate 38 further defines another plurality of
recesses in which another plurality of adhesive pads 42 are arranged, and the method further
comprises the individual shims 48 Electrically bonding the individual shims 48 to the printed
circuit board 14, including electrically bonding to each of, for example, another, plurality of
adhesive pads 42.
[0035]
Advantageously, also in the method, the micro sensor 12 comprises a front surface defined by a
portion of the front surface of the first substrate 16 and a back surface of the first substrate 16
within the range of the cavity 26 defined therein. Of the back surface of the first substrate 16 to
the printed circuit board 14 using an adhesive 44 that encloses and seals the cavity 26 and
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includes a diaphragm 18 having a back surface defined by corresponding portions of Including
mechanical bonding.
[0036]
Advantageously, in the method, the back side of the first substrate 16 further defines a vent
channel 28 connecting the cavity 26 to the front side of the first substrate 16 and the mechanical
adhesion is And mechanically bonding the back surface of the first substrate 16 to the printed
circuit board 14 using an adhesive 44 that surrounds and seals the vent channel 28.
[0037]
In another aspect of the exemplary embodiments, a micro sensor package including an array of
micro sensors and a method of assembling the micro sensor package are provided.
The features, functions, and advantages described above may be implemented independently in
the various embodiments or may be combined in yet other embodiments.
These embodiments will be described in more detail with reference to the following description
and the accompanying drawings.
[0038]
While the above describes exemplary embodiments of the present invention in general terms,
reference will now be made to the accompanying drawings.
These drawings are not necessarily drawn to scale.
[0039]
Figures 1a, 1b, and 1c (collectively "Figure 1") are cutaway views, top views, and exaggerated
cross-sectional views of a microsensor package according to one exemplary embodiment It is.
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10
Figures 1a, 1b, and 1c (collectively "Figure 1") are cutaway views, top views, and exaggerated
cross-sectional views of a microsensor package according to one exemplary embodiment It is.
Figures 1a, 1b, and 1c (collectively "Figure 1") are cutaway views, top views, and exaggerated
cross-sectional views of a microsensor package according to one exemplary embodiment It is.
2 and 3 are exaggerated cross-sectional views of the micro-sensor package of FIG. 1 at various
assembly stages, according to one exemplary embodiment.
2 and 3 are exaggerated cross-sectional views of the micro-sensor package of FIG. 1 at various
assembly stages, according to one exemplary embodiment.
FIG. 4 is a flow chart illustrating various steps in a method of assembling a microsensor package,
according to one exemplary embodiment.
Figures 5a and 5b (collectively "Figure 5") are perspective views of a micro sensor package
including an array of sensors according to an exemplary embodiment.
Figures 5a and 5b (collectively "Figure 5") are perspective views of a micro sensor package
including an array of sensors according to an exemplary embodiment.
FIG. 6 is a flow diagram of an exemplary aircraft manufacturing and service method.
FIG. 7 is a block diagram of an exemplary aircraft.
[0040]
Although some embodiments of the present disclosure will be described in more detail with
reference to the attached drawings, the attached drawings do not show all the embodiments of
04-05-2019
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the present disclosure.
Indeed, the various embodiments of the present disclosure can be embodied in many different
forms and should not be construed as limited to the embodiments set forth herein, but rather the
present disclosure is comprehensive and complete. These embodiments are provided to fully
convey the scope of the present disclosure to those skilled in the art.
For example, in the present description, reference is made to the dimensions of the components
that appear to be relevant.
These and other similar relationships may be perfect or approximate to account for possible
changes such as due to engineering tolerances.
Like numbers refer to like elements throughout.
[0041]
Exemplary embodiments are described herein with reference to MEMS sensors fabricated for
specific applications, such as aeroacoustic applications.
However, it should be understood that the exemplary embodiments are equally applicable to
other applications, both inside and outside the aerospace industry.
It should also be understood that the exemplary embodiments are equally applicable to micro
sensors other than MEMS based microphones.
[0042]
Referring to FIG. 1, which includes FIGS. 1a, 1b, and 1c, a micro sensor package 10 is illustrated
in accordance with an exemplary embodiment of the present disclosure.
04-05-2019
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FIGS. 1a and 1b are a cut-away view and top view of a quarter of a micro sensor package.
FIG. 1 c (and likewise FIGS. 2 and 3 described below) can be used to capture any number of
components of the package that would otherwise not be captured by a typical cross-sectional
view. And FIG. 1 b is an exaggerated cross-sectional view with respect to FIG.
[0043]
As shown, the micro sensor package includes a MEMS sensor 12 (in this case a microphone)
having opposing front and back surfaces, the back surface being bonded or otherwise fixed to a
printed circuit board (PCB) 14 ing. Again, as indicated above, the microphone shown is only one
example of the many sensors associated with the sensor package of the exemplary embodiment
and the method of assembly. Also in particular, the PCB is shown in simplified form in FIG. 1
without the other micro or electrical components that the PCB is typically considered to include.
[0044]
Although various features of sensor 12 are shown and described herein to facilitate
understanding of the exemplary embodiments, the sensor has additional or alternative features.
obtain. In one embodiment, the sensor includes a substrate (first substrate) 16 having opposing
front and back surfaces, and includes a sensing element on the front surface. As shown in the
context of a microphone, the sensing element may be or may otherwise be a stack of layers (eg, a
stack of annular layers) surrounding the outer boundary of the diaphragm 18 (eg, a circular
diaphragm). The stack of layers includes lower and upper electrodes 20, 22 and a piezoelectric
material 24 interposed therebetween. Thereafter, in one embodiment, the diaphragm is
configured to distort in response to the incident sound pressure, which in turn causes the stack
of layers to produce a corresponding output voltage.
[0045]
Diaphragm 18 includes a front surface defined by a portion of the front surface of the substrate
and a back surface defined by a corresponding portion of the back surface of the substrate within
the area of cavity 26 defined therein. In one embodiment, the back side of the substrate further
04-05-2019
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defines a vent channel 28 connecting the cavity to the front side of the substrate such that both
surfaces of the diaphragm are exposed to the same static pressure. This allows the sensor
(microphone) to measure dynamic pressure separately from sensing static pressure.
[0046]
The sensing element is electrically connected to other electronics to capture the output voltage
generated by the sensing element. Thereafter, in one embodiment, sensor 12 includes one or
more through chip vias disposed within the substrate and electrically connected to the sensing
elements. In one embodiment, the sensor includes two through chip vias 30, 32 electrically
connected to respective ones of the lower and upper electrodes 20, 22 by respective wires 34,
36. In one embodiment where the substrate is formed of silicon, the through chip vias are
through silicon vias (TSVs). These vias allow the backside electrical connection to the sensor and
more specifically its sensing element, rather than the more typical frontside electrical connection.
Hence, the exemplary embodiment can avoid the wire bonds typically required for frontal
electrical connection, and the frontal electrical connection is smooth for sensor package 10 Is
fragile and catastrophic to the front side.
[0047]
It should again be noted that there are details of the sensors 12 which are not shown or
described herein, and that they are outside the scope of the present disclosure. It should also be
noted that FIG. 1 is not drawn to scale. The sensing element on the front surface of the substrate
16 and, more particularly, in one embodiment, the lower and upper electrodes 20, 22 and the
piezoelectric material 24 inserted between, in fact, the thickness of the substrate It is quite thin
compared to In one embodiment, the sensing element has a thickness of approximately 2
micrometers for a diaphragm 18 having a thickness of approximately 7 micrometers, and the
substrate has a thickness of approximately 400 micrometers. Have. Therefore, the front of the
sensor, including the sensing element, has a roughness of a few micrometers within the sensor
package 10 having a desired roughness of approximately 10 micrometers or less. Therefore,
because the sensing element is so thin, the front of the sensor with the diaphragm is considered
smooth.
[0048]
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The problem in the sensor package 10 is to connect the vias 30, 32 to the electronics required to
power the sensor 12, to adjust its output, and to the sensor of which the sensor flash is a part
The front of the package is used to make the front of the sensor flash. And while sealing the
cavity 26 and the vent 28, achieving the above is a bigger problem. In accordance with the
exemplary embodiment, the PCB 14 includes a substrate (second substrate) 38 that defines one
or more recesses 40 within which the respective adhesive pads 42 are disposed. The embedded
bond pads are placed on the PCB to allow one or more electrical connections to exist between the
sensor or its components and the PCB. These embedded bond pads make it possible to obtain a
flash sensor package with a sealed cavity / vent.
[0049]
The sensor 12 is mechanically bonded to the PCB 14 using a suitable adhesive 44 such as epoxy
and electrically connected to the PCB using a conductive adhesive 46. Examples of suitable
conductive adhesives include solder, conductive (eg, silver) epoxy, or the like. As another
example, the conductive adhesive comprises gold bumps or gold studs and a suitable epoxy. In
one embodiment, the conductive adhesive more specifically electrically connects the vias 30, 32
and their respective bond pads 42, which are aligned with one another. The conductive adhesive
is disposed within the recess 40 including the adhesive pad and in an amount not exceeding the
open volume of each recess above the adhesive pad therein. The adhesive surrounds cavity 26
and vent 28 at the front of the PCB. The adhesive thereby seals the electrical connection made by
the conductive adhesive and seals the cavity and the vent, which in turn provide robust adhesion
between the sensor and the PCB.
[0050]
At the boundary between the front of the sensor 12 and the PCB 14 there are steps. The sensor
package is further bonded to the PCB, such as by surrounding the outer boundary of the sensor
and using a suitable adhesive 44, to take into account the steps and produce an overall relatively
smooth surface. , The shim 48 is included. Since the shim has approximately the same thickness
as the sensor, the entire sensor package, including the sensor diaphragm 18, has a smooth
surface on its front surface. The shims are constructed of a conductive material (e.g., brass) and
are electrically connected to sensor ground to provide protection against electromagnetic
interference (EMI). Therefore, the shim is placed over the embedded bond pad 42 of the PCB and
electrically connected to the bond pad using the conductive adhesive 46. In one embodiment,
each recess 40, adhesive pad and conductive adhesive are as described above for electrically
connecting the sensor vias 30, 32 to the respective embedded adhesive pads. Will be placed. Also
04-05-2019
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as before, the adhesive seals the electrical connection made by the conductive adhesive and
provides robust adhesion between the shim and the PCB.
[0051]
In one embodiment, the sensor 12 is fully packaged as a stand-alone unit with its cavities / vents
26, 28 sealed. In this regard, the PCB 14 further includes one or more vias within its substrate
38, and two exemplary vias 50, 52 are shown. PCB vias are placed in close proximity to and
electrically connected to one or more of the buried bond pads 42 opposite the sensor vias 30, 32
electrically connected to the respective buried bond pads Ru. Therefore, the sensor package 10 is
electrically connected to another electronic assembly by a PCB via. Although not shown, in one
exemplary package, the electrical connections between the bond pads to which the shims 48 are
electrically connected and the sensor ground are made using traces on the PCB.
[0052]
Referring now to FIGS. 2 and 3, and back to FIG. 1c, they relate to the assembly of sensor
package 10, including sensor 12, PCB 14 and shim 48, according to one exemplary embodiment.
In one embodiment, the assembly of the sensor package precedes the fabrication of the sensor,
the PCB, and the shim, each of which is fabricated according to any number of different steps,
such as a micromachining step of deposition and removal. . For example, more specifically,
fabrication of the sensor includes fabricating one or more through chip vias 30, 32 through the
substrate 16, and fabricating a sensing element on the front surface of the substrate, and vias the
sensing element Electrically connecting to the More specifically, fabrication of the sensing
element of one embodiment patterns and etches the front of the sensor to form the lower and
upper electrodes 20, 22 and the piezoelectric material 24 inserted between them. Including. The
backside of the sensor is etched to define a cavity 26 and a vent 28. As shown in FIGS. 2 and 3,
dotted line 54 represents the boundary created between packaging after the sensor is fabricated
to seal the cavity and the vent. Other details regarding the fabrication of the sensor are not
closely related to the exemplary embodiment and therefore are omitted from the present
disclosure.
[0053]
In one embodiment, fabrication of the PCB 14 includes fabricating one or more vias 50, 52 in the
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substrate 38, and forming one or more wires or other electrical components (not shown). ,
Patterning and etching the front side of the PCB. The front side of the PCB is further etched to
define one or more recesses 40 within which the adhesive pads 42 are disposed. As with the
sensor, other details regarding the fabrication of the PCB are not closely related to the exemplary
embodiment and are therefore omitted from the present disclosure.
[0054]
Assembling the sensor 12, PCB 14 and shims 48 covers one or more vias 30, 32, adhesive pads
42, and / or shims for their electrical connection, as described above. , Depositing conductive
adhesive 46. As shown in FIGS. 2 and 3, in one embodiment, the conductive adhesive covers the
vias on the back of the sensor substrate 16 for their electrical connection to the respective PCB
bond pads. Then, it is deposited as a ball (e.g., by a suitable epoxy) that is bonded (e.g., by a
suitable epoxy) over another of the PCB adhesive pads for its electrical connection to the shim. In
FIG. 2, the shims are simultaneously bonded to the PCB electrically with a conductive adhesive
and mechanically with a suitable adhesive 44. As shown, the conductive adhesive deposited as a
ball is compressed (eg, to form bumps or studs) in the recess 40 having an open volume slightly
larger than the volume of the conductive adhesive Be done.
[0055]
In one embodiment, shims 48 and sensors 12 are simultaneously bonded to PCB 14. In another
embodiment, the shim is glued in front of the sensor. In this alternative embodiment, the shim
provides a guide for bonding the sensor to the PCB by first bonding the shim to the PCB. Similar
to the shims, in FIG. 3, the sensor is simultaneously electrically bonded to the PCB electrically
with a conductive adhesive and with a suitable adhesive 44, which is in FIG. 1c. The sensor
package 10 shown is provided. Also as before, the conductive adhesive deposited as balls is
compressed in the respective recesses 40 each having an open volume slightly larger than the
volume of the conductive adhesive.
[0056]
FIG. 4 illustrates various steps in a method 56 of assembling the micro sensor package 10, in
accordance with an exemplary embodiment of the present disclosure. As shown at blocks 58 and
60, the method includes mechanically and electrically bonding the microsensor 12 to the printed
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circuit board 14, which bonding is performed simultaneously in one embodiment. The
microsensor is disposed within the first substrate 16 having opposing front and back surfaces,
the sensing element on the front surface of the first substrate, and the first substrate and is
electrically connected to the sensing element Through chip vias 30, 32 (one or more) are
included. In one embodiment, the microsensor has a front surface having a roughness of less
than a few micrometers within a sensor package having a desired roughness of approximately 10
micrometers or less. The printed circuit board comprises a second substrate 38 which defines
within it a recess 40 in which the bonding pad 42 is arranged.
[0057]
Mechanically bonding the microsensor 12 to the printed circuit board 14 includes bonding the
back of the first substrate 16 to the second substrate 38. And, electrically bonding the
microsensor to the printed circuit board includes electrically bonding the microchip through chip
vias 30, 32 to the adhesive pad 42 of the printed circuit board.
[0058]
In one embodiment, the electrical adhesion is to electrically adhere the through chip vias 30, 32
of the microsensor 12 to the bond pads 42 using a conductive adhesive 46 deposited over the
through chip vias or bond pads. And then the conductive adhesive is disposed within the open
volume of the recess above the adhesive pad. The mechanical bonding then involves mechanical
bonding of the back of the first substrate 16 to the printed circuit board 14 using an adhesive 44
that surrounds and seals the conductive adhesive.
[0059]
In one embodiment, as shown at blocks 62 and 64, the method further includes mechanically and
electrically adhering the shim 48 to the printed circuit board 14, which adhesively bonds the
sensor 12 to the printed circuit board Before, after, or simultaneously with bonding to In this
embodiment, the microsensors and shims are mechanically bonded to the printed circuit board
such that the shims surround the outer boundaries of the microsensors, and the shims have
approximately the same thickness as the microsensors. Also, in this embodiment, the second
substrate defines another recess within which another adhesive pad is disposed. Thereafter,
electrical bonding includes electrically bonding the shim to the other bonding pads of the second
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substrate.
[0060]
In one embodiment, the microsensor 12 has a front surface defined by a portion of the front
surface of the first substrate 16 and a corresponding portion of the back surface of the first
substrate within the cavity 26 defined therein. It includes a diaphragm 18 having a back surface
defined. In this embodiment, the back side of the first substrate further defines a vent channel 28
connecting the cavity to the front side of the first substrate. Thereafter, mechanical bonding
involves mechanical bonding of the back side of the first substrate to the printed circuit board 14
using an adhesive 44 that surrounds and seals the cavities and vent channels.
[0061]
Referring now to FIG. 5, the sensor package 10 includes a single sensor 12 bonded to the PCB
14, and in another embodiment, an array of sensors is bonded to the PCB. The PCB in this
alternative embodiment includes an array of embedded bond pads 42 (an array of recesses 40
including an array of corresponding bond pads) for electrical connection to the respective
sensors. Also in this alternative embodiment, the package includes one or more shims
surrounding the sensors of the array. For example, as shown in FIG. 5a, the package includes a
plurality of individual shims 48 surrounding each sensor of the array, and additionally at least at
least one of the individual shims and each sensor It contains a single array shim 66 surrounding
several. In another embodiment, as shown in FIG. 5b, the package includes a single array shim 68
surrounding at least some if not all of the sensors of the array without each individual shim.
[0062]
In one embodiment, as shown in FIG. 5a, the array shims 66 are in the form of individual shims
48 and respective sensors 12 and the cutouts in which the shims and sensors are located. Made
to include. In another embodiment, as shown in FIG. 5b, the array shims 68 are fabricated to
include a cutout in the shape of the sensor without individual shims and within which the sensor
is disposed . The sensor package containing the array of sensors is assembled in a manner similar
to that described above, and includes bonding all of the sensors simultaneously or one at a time
to the PCB. In one embodiment, the array shims are glued in front of the array of sensors and any
individual shims. Thus, the array shims provide a guide for bonding the sensor and any individual
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shims to the PCB 14. In a more specific embodiment, the array shims provide a guide for bonding
the individual shims, which in turn provide a guide for bonding the sensors. However, in any
instance, by including backside electrical connections using vias through the sensors, the sensors
of the array are more precisely positioned with respect to one another.
[0063]
The exemplary embodiments of the present disclosure may be used in various applications,
particularly in the field of the transportation industry, including, for example, aerospace, ships,
and automobiles. Thus, referring now to FIGS. 6 and 7, the exemplary embodiment may be used
within the context of the aircraft manufacturing and service method 70 shown in FIG. 6 and the
aircraft 86 shown in FIG. it can. In the pre-production phase, the exemplary method includes
aircraft specifications and design 72 and material procurement 74. In one example, aircraft
specifications and designs include technology development and product definitions, which in
turn include test and evaluation components for which the illustrative embodiments are
employed. Exemplary embodiments also include model scales during technology and product
development testing, such as, for example, on test models (eg, wind tunnels), on test models, and
/ or on walls or other installable locations. Be adopted in the exam.
[0064]
In the production phase, production 76 of aircraft components and subassemblies and system
integration 78 take place. Thereafter, the aircraft is operated 82 via approval and delivery 80.
While being operated by the customer, the aircraft is subject to regular maintenance and
maintenance 84 (including remodeling, restructuring, renovations, etc.).
[0065]
Each of the steps of method 70 may be performed or carried out by a system integrator, a third
party, and / or an operator (eg, a customer). For the purposes of this specification, a system
integrator may include, but is not limited to, any number of aircraft manufacturers, and
subcontractors of major systems, and third parties, including but not limited to, any number of
vendors. , Subcontractors, and suppliers, and the operator may be an airline, leasing company,
military association, service agency, or the like.
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[0066]
As shown in FIG. 7, the aircraft 86 produced by the example method 70 includes an airframe 88
having a plurality of systems 90 and an interior 92. Examples of high level systems include one
or more of a propulsion system 94, an electrical system 96, a hydraulic system 98, and an
environmental system 100. Any number of other systems may be included. Although an
aerospace example is shown, the principles of the present disclosure may be provided to other
industries, such as the automotive industry.
[0067]
As noted above, the devices and methods implemented herein may be used at one or more
optional stages of the production and maintenance method 70. For example, the components or
subassemblies corresponding to production process 76 are made or manufactured in a manner
similar to the components or subassemblies manufactured during operation of aircraft 86. Also,
one or more of the apparatus embodiments, method embodiments, or combinations thereof may
be used, for example, to substantially reduce the cost of the aircraft, or substantially reduce the
cost of the aircraft. Can be used in Similarly, one or more of the apparatus embodiments, method
embodiments, or combinations thereof may be utilized during operation of the aircraft, for
example, but not limited to, maintenance and maintenance 84.
[0068]
Numerous modifications and other embodiments of the disclosure set forth herein will come to
mind to one skilled in the art having the benefit of the teachings presented in the foregoing
description and the associated drawings. I will. Accordingly, it is to be understood that the
invention is not limited to the specific embodiments disclosed, and that variations and other
embodiments are intended to be included within the scope of the appended claims. Furthermore,
while the above description and the accompanying drawings describe embodiments in terms of
specific exemplary combinations of elements and / or functions, elements according to other
embodiments may be used without departing from the scope of the claims. It should be
understood that different combinations of and / or functions may be provided. In this respect, for
example, combinations of elements and / or functions other than those specified above are also
considered as being presented in the claims. Although specific terms are employed herein, they
are used in a generic and descriptive sense only and not for purposes of limitation.
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