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JP2016528783

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DESCRIPTION JP2016528783
The device includes a housing and a piezoelectric element coupled to the housing. The device
also includes an electromagnetic element coupled to the housing. The piezoelectric element is
configured to convert the first signal in the first frequency band to the first sound wave by
oscillating the first portion of the housing. The electromagnetic element is configured to convert
the second signal in the second frequency band to a second sound wave by oscillating the first
portion of the housing and the second portion of the housing. [Selected figure] Figure 1
Sound Generator Priority Claim
[0001]
[0001]This application claims the benefit of US Provisional Application No. 61 / 843,275, filed
on July 5, 2013, entitled "APPARATS AND METHOD FOR PROVIDING A FREQUENCY RESPONSE
FOR AUDIO SIGNALS," and December 18, 2013. Claim the priority from US non-provisional
application No. 14 / 133,092, entitled "APPARATS AND METHOD FOR PROVIDING A
FREQUENCY RESPONSE FOR AUDIO SIGNALS", the contents of each of which are incorporated by
reference in their entirety It is explicitly incorporated into the present specification.
[0002]
[0002]The present disclosure relates generally to providing a frequency response for an audio
signal.
[0003]
[0003]
11-05-2019
1
Advances in technology have resulted in smaller, more powerful computing devices.
For example, various portable personal computing devices now exist, including wireless
computing devices, such as portable wireless telephones, personal digital assistants (PDAs),
paging devices, etc. that are small, lightweight and easily carried by users. doing.
More specifically, portable wireless telephones, such as cellular telephones and Internet Protocol
(IP) telephones, can communicate voice and data packets across wireless networks. Furthermore,
many such wireless telephones include other types of devices incorporated therein. For example,
wireless telephones can also include digital still cameras, digital video cameras, digital recorders,
and audio file players. Also, such wireless telephones can process executable instructions,
including software applications such as web browser applications, which can be used to access
the Internet. As such, these wireless phones can include significant computing capabilities.
[0004]
[0004]
Sound reproduction capabilities for portable computing devices may be limited. For example,
wireless telephones can support audio signal playback for audio signals in a narrow acoustic
frequency range. However, there is an increasing need to support audio signal reproduction for a
wider range of acoustic frequencies. To illustrate, the wireless telephone may be an audio signal
within the Super Wideband frequency range (e.g., approximately 50 hertz (Hz) to approximately
14 kilohertz (kHz)) and / or an ultra sound signal (e.g., approximately 20 kHz) There is a desire
to support signals ranging from 1 to over 60 kHz. Conventional earpieces of wireless telephones
can not provide high fidelity frequency response for each audio signal in the ultra-wide band
frequency range or for ultra sound signals. For example, a wireless telephone can include a mass
transducer that moves. Moving mass transducers can use large diaphragms to reproduce sound
at low frequencies. However, high frequency signals produce irregular frequency responses from
moving mass transducers (e.g., due to vibration of the diaphragm).
[0005]
[0005]
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2
Conventional earphones may also limit the capabilities of wireless telephones in certain
circumstances. For example, conventional earphones can include an acoustic port associated with
a moving mass transducer to provide a frequency response to an audio signal. The acoustic port
can cause the internal circuitry of the wireless telephone to be damaged caused by water or other
environmental factors.
[0006]
[0006]
A method and apparatus for providing a frequency response for an audio signal is disclosed. The
audio signal may include high frequency components in the upper frequency band and low
frequency components in the lower frequency band. Filters (eg, high pass and low pass filters)
can distinguish high frequency components and low frequency components. The high frequency
component of the audio signal may be amplified and provided to a first actuator (e.g. a
piezoelectric element) coupled to the housing or front glass of the mobile device, and the low
frequency component may be amplified for the mobile A second actuator (eg, an electromagnetic
element or a moving mass transducer) coupled to the housing or front glass of the device may be
provided. The piezoelectric element can vibrate the first portion of the housing in response to
receiving the amplified high frequency component, and the electromagnetic element receives the
first portion of the amplified low frequency component in response to receiving the amplified low
frequency component. Part 2 can be vibrated. The first sound wave may be generated in
response to the vibration of the first portion of the housing by the piezoelectric element, and the
second sound is generated in response to the vibration of the first and second portions of the
housing by the electromagnetic element. sell. Locations along the housing where the first sound
wave intersects with the second sound wave (e.g. "sweet spot") may provide enhanced audio
quality (e.g. enhanced sound quality) it can. For example, its location along the housing covers
the entire ultra-wideband frequency range (e.g. approximately 50 hertz (Hz) to 14 kilohertz
(kHz)) and / or for audio signals covering ultra sound signals A frequency response can be
provided.
[0007]
[0007]
In a particular embodiment, the device includes a housing and a piezoelectric element coupled to
the housing. The device also includes an electromagnetic element coupled to the housing. The
piezoelectric element is configured to convert the first signal in the first frequency band to the
first sound wave by oscillating the first portion of the housing. The electromagnetic element is
11-05-2019
3
configured to convert the second signal in the second frequency band to a second sound wave by
oscillating the first portion of the housing and the second portion of the housing.
[0008]
[0008]
In another particular embodiment, a method includes driving a piezoelectric element coupled to a
first portion of a housing using a first signal in a first frequency band. The piezoelectric element
converts the first signal into a first sound wave by vibrating the first portion of the housing. The
method also includes driving an electromagnetic element coupled to the second portion of the
housing using the second signal in the second frequency band. The electromagnetic element
converts the second signal into a second sound wave by oscillating the first portion of the
housing and the second portion of the housing.
[0009]
[0009]
In another particular embodiment, the non-transitory computer readable medium is coupled to
the processor when executed by the processor using the first signal in the first frequency band to
the first portion of the housing And an instruction to drive the piezoelectric element. The
piezoelectric element converts the first signal into a first sound wave by vibrating the first
portion of the housing. The instructions are also executable to cause the processor to drive the
electromagnetic element coupled to the second portion of the housing using the second signal in
the second frequency band. The electromagnetic element converts the second signal into a
second sound wave by oscillating the first portion of the housing and the second portion of the
housing.
[0010]
[0010]
In another particular embodiment, an apparatus includes a housing and means for converting a
first signal into a first sound wave. The means for converting the first signal into the first sound
wave includes a first actuator that vibrates the first portion of the housing in response to
receiving the first signal. The first sound wave is generated in response to the first actuator
vibrating the first portion of the housing. The apparatus also includes means for converting the
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4
second signal into a second sound wave. A means for converting the second signal into a second
sound wave comprises vibrating the first portion of the housing and the second portion of the
housing in response to receiving the second signal. including. The second sound wave is
generated in response to the second actuator vibrating the first portion of the housing and the
second portion of the housing.
[0011]
[0011]
One particular advantage provided by at least one of the disclosed embodiments is for audio
signals within the ultra-wide band frequency range (e.g., approximately 50 hertz (Hz) to
approximately 14 kilohertz (kHz)). The ability to provide a frequency response. Another
advantage provided by at least one of the disclosed embodiments is the ability to generate sound
waves without an acoustic port in the housing, since there is no opening in the housing.
Waterproofing techniques for handheld audio devices can be enhanced. Other aspects,
advantages, and features of the present disclosure will be apparent after review of the entire
application, including the following sections: Brief Description of the Drawings, Detailed
Description of the Invention, and the Claims. It will be.
[0012]
FIG. 7 is a block diagram of a particular illustrative embodiment of a system operable to provide
a frequency response for an audio signal in the extended frequency range. FIG. 2 is a view of the
actuator of FIG. 1 coupled to a housing. FIG. 3 is a diagram of vibrations corresponding to sound
waves propagating along the housing of FIG. 2; FIG. 6 is a flow chart of a particular embodiment
of a method for providing a frequency response for an audio signal in the extended frequency
range. FIG. 6 is a block diagram of a wireless device including components operable to provide a
frequency response for an audio signal in an extended frequency range.
[0013]
[0017]
FIG. 1 illustrates a particular illustrative embodiment of a system 100 operable to provide a
frequency response for audio signals within a particular frequency range. For example, system
100 can provide a frequency response for an audio signal within the entire ultra-wide band
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5
frequency range (e.g., approximately 50 hertz (Hz) to approximately 14 kilohertz (kHz)). System
100 can include an audio encoder / decoder (CODEC) 102, a high pass filter 104, a low pass
filter 106, a first amplifier 108, a second amplifier 110, a piezoelectric element 112, and an
electromagnetic element 114.
[0014]
[0018]
Audio CODEC 102 may be configured to generate audio signal 120. For example, audio CODEC
102 may include a digital to analog converter and may decode digital audio signals into audio
signals 120 (eg, analog audio signals). In particular embodiments, audio signal 120 may have
frequency components within the ultra-wide band frequency range or ultra-sound range. As a
non-limiting example, the audio signal 120 can have high frequency components ranging
approximately from 1 kHz to 14 kHz, and the audio signal 120 has low frequency components
ranging approximately from 50 hz to 1 kHz be able to. Audio signal 120 may be provided to high
pass filter 104 and to low pass filter 106.
[0015]
[0019]
High pass filter 104 may be configured to receive audio signal 120 and generate a first drive
signal 122 (e.g., a high frequency drive signal) by removing low frequency components of audio
signal 120. For example, the high pass filter 104 can provide the first amplifier 108 with high
frequency components (eg, components having frequencies above 1 kHz) of the audio signal 120,
and the high pass filter 104 can be a low frequency component of the audio signal 120. Can
block. For example, high pass filter 104 may reduce the amount of low frequency components of
audio signal 120 provided to first amplifier 108. Low pass filter 106 may also be configured to
receive audio signal 120 and generate a second drive signal 124 (e.g., a low frequency drive
signal) by removing high frequency components of audio signal 120. For example, the low pass
filter 106 can provide the second amplifier 110 with low frequency components of the audio
signal 120 (e.g., components having a frequency less than 1 kHz), and the low pass filter 106
may Can block. For example, low pass filter 106 may reduce the amount of high frequency
components of audio signal 120 provided to second amplifier 110. Although the "cut-off"
frequencies of the high pass filter 104 and the low pass filter 106 are described with respect to a
frequency of approximately 1 kHz, different frequencies may be used to improve the
performance of the system 100. In particular embodiments, high pass filter 104 and low pass
filter 106 may have different "cut-off" frequencies. As a non-limiting example, the high pass filter
11-05-2019
6
104 can block components of the audio signal 120 having a frequency of less than 1.4 kHz, and
the low pass filter 106 may include components of the audio signal 120 having a frequency of
greater than 1.3 kHz. Can block.
[0016]
[0020]
The first amplifier 108 receives the first drive signal 122 (eg, the high frequency component of
the audio signal 120) and amplifies the first drive signal 122 to generate an amplified first drive
signal. It can be configured as follows. The first amplifier 108 can provide the piezoelectric
element 112 with a first signal 132. The first signal 132 can include an amplified first drive
signal. In certain embodiments, the first signal 132 can have a frequency within a first frequency
band. The first frequency band may range approximately from 1 kHz to 15 kHz.
[0017]
[0021]
The second amplifier 110 receives the second drive signal 124 (eg, the low frequency component
of the audio signal 120) and amplifies the second drive signal 124 to generate an amplified
second drive signal. It can be configured as follows. The second amplifier 110 can provide a
second signal 134 to the electromagnetic element 114. The second signal 134 can include an
amplified second drive signal. In certain embodiments, the second signal 134 can have a
frequency within a second frequency band. The second frequency band can range approximately
from 50 Hz to 1 kHz.
[0018]
[0022]
The piezoelectric element 112 may be configured to receive the first signal 132 and convert the
first signal 132 into a first sound wave. The piezoelectric element 112 may be a first actuator
configured to convert the first signal 132 into a first sound wave by oscillating a first portion of
the housing 150. For example, the piezoelectric element 112 can include or be formed of a
piezoelectric material 146 that exhibits a piezoelectric effect. That is, depending on the electric
field, the piezoelectric material 146 can change its shape or dimensions. Piezoelectric element
112 may also include a first electrode 142 coupled to a first side of piezoelectric material 146
11-05-2019
7
and a second station 144 coupled to a second side of piezoelectric material 146. In particular
embodiments, the piezoelectric material 146 can include berlinite, quartz, topaz, barium titanate,
or any combination thereof. The first electrode 142 and / or the second electrode 144 may be
coupled to receive the first signal 132 via an electrical contact. The first electrode 142 and the
second electrode 144 can generate an electric field across the piezoelectric material 146 in
response to receiving the first signal 132. The piezoelectric element 112 can change its shape in
accordance with the electric field. As described in further detail in connection with FIG. 3, a first
sound wave may be generated in response to the vibration of the piezoelectric material 146
contacting the first portion of the housing 150.
[0019]
[0023]
The electromagnetic element 114 may be configured to receive the second signal 134 and
convert the second signal 134 to a second sound wave. In particular embodiments, the
electromagnetic element 114 may be a moving mass transducer. The electromagnetic element
114 may be a second actuator configured to convert the second signal 134 into a second sound
wave by oscillating the second portion of the housing 150. For example, the electromagnetic
element 114 includes a magnet 155, a coil 160 coupled to receive a second signal via an
electrical contact, and a first material 170 coupled to a second portion of the housing 150. Can.
Dampening members 165 may be coupled between the magnet 155 and the second portion of
the housing 150. In particular embodiments, the damping member 165 can include an elastic
polymer. The coil 160 can generate a magnetic field in response to receiving the second signal
134. The interaction of the magnetic field of the coil 160 and the magnetic field of the magnet
155 may move the magnet 155 relative to the housing 150. Movement of the magnet 155 can
induce the occurrence of vibrations in the second portion of the housing 150. Vibration based on
movement of the magnet may propagate to a first portion of the housing 150 (eg, propagate
along the entire housing 150).
[0020]
[0024]
In certain embodiments, the piezoelectric element 112 and the electromagnetic element 114 can
be mounted (eg, positioned) on the glass of the front of the mobile device. For example, the front
glass can be part of or attached to the housing 150 of the mobile device. In particular
embodiments, the housing 150 may be associated with an earpiece of a handheld audio device.
For example, the housing 150 may be the outer casing of an earphone and may not include an
11-05-2019
8
acoustic port.
[0021]
[0025]
The system 100 uses ultra-wideband frequencies by using two amplifier configurations to drive
frequency components in the upper frequency band with the piezoelectric element 112 and drive
frequency components in the lower frequency band with the electromagnetic element 114.
Sound waves can be generated that span a range and / or ultra sound range. For example, system
100 can convert the high frequency components of audio signal 120 to a first sound wave (eg, a
high frequency wave) by vibrating a first portion of housing 150 with piezoelectric element 112.
Additionally, system 100 can convert the low frequency components of audio signal 120 to a
second sound wave (eg, a low frequency wave) by oscillating the second portion of housing 150
with electromagnetic element 114 . Because the first and second sound waves are generated by
the induced vibration in the housing 150, no acoustic port is required in the housing 150.
[0022]
[0026]
Referring to FIG. 2, a diagram of the electromagnetic element 114 coupled to the housing 150 is
illustrated. In certain embodiments, the housing 150 can include a glass portion and / or a plastic
portion. The electromagnetic element 114 may be coupled to the glass and / or plastic portions
of the housing 150. Also, the piezoelectric element 112 of FIG. 1 may be coupled to the housing
150 at another location (not shown in FIG. 2).
[0023]
[0027]
The electromagnetic element 114 can include a magnet 155, a first material 170, a coil 160, and
a damping member 165. The coil 160 may be coupled to receive the second signal 134 via the
electrical contact 206. The coil 160 can generate a magnetic field in response to receiving the
second signal 134. The magnet 155 can move (eg, vibrate) in response to the interaction
between the magnetic field of the coil 160 and the magnetic field of the magnet 155. Electrical
contact (s) 206 may be positioned along the housing 150 (e.g., in front of the electromagnetic
element 114) to allow the back of the electromagnetic element 114 (and the magnet 155) to
11-05-2019
9
move.
[0024]
[0028]
The first material 170 may be coupled to the housing 150 via an adhesive. For example, the first
adhesive 222 may be coupled to the first side of the damping member 165 and to the housing
150. A second adhesive 224 may be coupled to the second side of the damping member 165 and
to the first material 170. Damping member 165 can include an elastomeric polymer.
[0025]
[0029]
In operation, the electrical contacts 206 can provide the coil 160 with a second signal 134. In
response to receiving the second signal 134, the coil 160 can generate a magnetic field that
causes the magnet 155 to move (e.g., toward or away from the housing 150). The movement of
the magnet 155 causes the housing 150 to vibrate. Vibration of the housing 150 can generate a
second sound wave (e.g., a low frequency wave). No acoustic port is required in the housing 150
as the vibration of the housing 150 is used to generate the second sound wave.
[0026]
[0030]
Referring to FIG. 3, a diagram of the vibrations corresponding to the sound waves propagating
along the housing 150 is shown. Housing 150 can include a first portion 302 and a second
portion 304. In particular embodiments, the first portion 302 and the second portion 304 of the
housing 150 may each correspond to a glass portion of the housing 150, such as a display
screen of a portable computing device. In another particular embodiment, the first portion 302
and the second portion 304 of the housing 150 may each correspond to a plastic portion of the
housing 150. In another particular embodiment, the housing 150 comprises a front glass of a
mobile device.
[0027]
[0031]
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10
The piezoelectric element 112 of FIG. 1 is coupled to a first portion 302 of the housing 150 to
generate a first vibration corresponding to a first sound wave (eg, a high frequency wave),
illustrated as a dotted line. It can be done. The electromagnetic element 114 of FIG. 1 is coupled
to the second portion 304 of the housing 150 to generate a second vibration corresponding to a
second sound wave (eg, a low frequency wave), illustrated as a solid line. It can be done. The first
vibration has a relatively high loss. However, the second vibration has a relatively low loss,
allowing the second vibration to intersect the first vibration at “sweet spot” 306. The sweet
spot 306 may correspond to a particular location where the quality of the sound is enhanced by
the first vibration crossing the second vibration. For example, sweet spots 306 may correspond
to locations along housing 150 where the high frequency components of audio signal 120 of FIG.
1 and the low frequency components of audio signal 120 are reproduced in a relatively reliable
manner.
[0028]
[0032]
In certain embodiments, housing 150, piezoelectric element 112, and electromagnetic element
114 may be integrated into a handheld device. For example, housing 150, piezoelectric element
112, and electromagnetic element 114 may be integrated into a portable (eg, wireless) telephone.
In this example, the housing 150 may correspond to the outer casing (including the front glass)
of the portable telephone. Piezoelectric element 112 and electromagnetic element 114 may be
coupled to housing 150 at selective locations (eg, first portion 302 and second portion 304).
[0029]
[0033]
In certain embodiments, the second element can propagate along the entire housing 150 so that
the electromagnetic element 114 and the piezoelectric element 112 can be multiple without
reducing the quality of the enhanced sound corresponding to the sweet spot 306. Can be coupled
to the housing at different locations. For example, the electromagnetic element 114 may be
coupled to the front surface of the housing 150 and the piezoelectric element 112 may be
coupled to the back surface of the housing 150. The sweet spot 306 may occur anywhere where
the second vibration intersects the first vibration based on the arrangement of the piezoelectric
element 112 and the electromagnetic element 114.
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11
[0030]
[0034]
The sweet spot 306 can replace conventional acoustic ports by generating sound waves that are
audible to the user across a relatively large area of the housing 150. For example, the sweet spot
306 can provide a relatively large area on the housing 150 where the audio quality is enhanced
as compared to the relatively small area (e.g., a few millimeters) associated with a conventional
acoustic port. The user can hear the sound along each location of the housing 150 vibrating in
response to the piezoelectric element 112 or the electromagnetic element 114, but the vibration
located at the sweet spot 306 is on both the piezoelectric element 112 and the electromagnetic
element 114. Sound waves can be generated on the basis of this. Thus, the sound wave generated
at sweet spot 306 may be associated with both high frequency components of audio signal 120
and low frequency components of audio signal 120. Replacing a conventional acoustic port with
a sweet spot 306 can improve waterproofing for handheld audio devices as there is no opening
in the housing 150 for outputting sound. Thus, the embodiments disclosed herein can reduce the
likelihood that the portable telephone's internal circuitry will be damaged by water or other
environmental factors.
[0031]
[0035]
Referring to FIG. 4, a particular embodiment of a method 400 for providing a frequency response
for an audio signal in the extended frequency range is illustrated. Method 400 may be performed
by system 100 of FIG. 1 with respect to housing 150 illustrated in FIGS. 2-3. The sequence of
steps in FIG. 4 is for illustrative purposes only. Those skilled in the art will further recognize that
each block 402, 404 can be performed in the reverse order or simultaneously.
[0032]
[0036]
The method 400 includes, at 402, driving a piezoelectric element coupled to a first portion of the
housing using a first signal in a first frequency band. For example, the first amplifier 108 can
amplify the first drive signal 122 (eg, amplify high frequency components of the audio signal
120) to generate an amplified first drive signal. The first amplifier 108 can provide a first signal
132 (e.g., an amplified first drive signal) to the electrodes 142, 144 of the piezoelectric element
11-05-2019
12
112 via electrical contacts. In response to receiving the first signal 132, the piezoelectric element
112 can change shape in the first portion 304 of the housing 150 to induce a vibration (eg, a
first vibration). Vibration of the housing 150 can generate a first sound wave corresponding to
the first signal 132.
[0033]
[0037]
The electromagnetic element coupled to the second portion of the housing may be driven at 404
using a second signal in a second frequency band. For example, the second amplifier 110 can
amplify the second drive signal 124 (eg, amplify low frequency components of the audio signal
120) to generate an amplified second drive signal. The second amplifier 110 can provide a
second signal 134 (eg, an amplified second drive signal) to the coil 160 of the electromagnetic
element 114 via the electrical contact 206. The coil 160 can generate a magnetic field in
response to receiving the second signal 134. The interaction of the magnetic field of the coil 160
and the magnetic field of the magnet 155 can cause the magnet 155 to move relative to the
housing 150. The relative movement of the magnet 155 and the housing 150 can induce a
second vibration in the first portion 302 of the housing 150 and in the second portion 304 of the
housing 150. The second vibration of the housing 150 can generate a second sound wave that
corresponds to the second signal 134.
[0034]
[0038]
In particular embodiments, method 400 can include receiving an audio signal. For example, high
pass filter 104 may receive audio signal 120 from audio CODEC 102, and low pass filter 106
may also receive audio signal 120 from audio CODEC 102.
[0035]
[0039]
In particular embodiments, method 400 can include generating a first signal within a first
frequency band. For example, the high pass filter 104 can pass high frequency components of
the audio signal 120 (eg, components having frequencies above 1 kHz) to generate the first drive
signal 122, and the high pass filter 104 can It can block 120 low frequency components. The
11-05-2019
13
first drive signal 122 may be amplified by the first amplifier 108 to generate a first signal 132.
[0036]
[0040]
In particular embodiments, method 400 can include generating a second signal within a second
frequency band. For example, low pass filter 106 may pass low frequency components of audio
signal 120 (e.g., components having a frequency less than 1 kHz) to generate second drive signal
124, and low pass filter 106 may It can block 120 high frequency components. The second drive
signal 124 may be amplified by the second amplifier 110 to generate a second signal 134. The
first frequency band may be higher than the second frequency band. For example, in certain
embodiments, the first frequency band may range approximately from 1 kHz to 60 kHz, and the
second frequency band may range approximately from 50 Hz to 1 kHz.
[0037]
[0041]
System 400 of FIG. 4 uses two amplifier configurations to drive frequency components in the
upper frequency band with piezoelectric element 112 and to drive frequency components in the
lower frequency band with electromagnetic element 114. Sound waves can be generated that
span an ultra-wide band frequency range. For example, high frequency components of the audio
signal 120 may be converted to a first sound wave (eg, high frequency wave) by vibrating the
first portion 302 of the housing 150 with the piezoelectric element 112. Additionally, low
frequency components of the audio signal 120 can be converted to a second sound wave (eg, low
frequency wave) by oscillating the second portion 304 of the housing 150 with the
electromagnetic element 114.
[0038]
[0042]
Referring to FIG. 5, a block diagram of a wireless device 500 is illustrated that includes
components operable to provide a frequency response for an audio signal in the extended
frequency range. Device 500 includes a processor 510, such as a digital signal processor (DSP),
coupled to memory 532.
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14
[0039]
[0043]
FIG. 5 also illustrates a display controller 526 coupled to the processor 510 and the display 528.
Camera controller 590 may be coupled to processor 510 and camera 592. Device 500 may
include system 100 of FIG. For example, device 500 includes audio CODEC 102 of FIG. 1 coupled
to processor 510. Device 500 also includes high pass filter 104 of FIG. 1, low pass filter 106 of
FIG. 1, first amplifier 108 of FIG. 1, second amplifier 110 of FIG. 1, piezoelectric element 112 of
FIG. 1, and electromagnetic element 114 of FIG. including. Piezoelectric element 112 may be
coupled to a first portion of the housing, and electromagnetic element 114 may be coupled to a
second portion of the housing. Thus, piezoelectric element 112 and electromagnetic element 114
can generate sound waves in response to the signals provided by processor 510 to CODEC 102.
The signals may include voice call signals, streaming media signals received via antenna 542,
audio file playback signals, and the like. Device 500 also includes a microphone 518 coupled to
audio CODEC 102.
[0040]
[0044]
Memory 532 may be a tangible non-transitory processor readable storage medium including
instructions 558. Instructions 558 may be executed by a processor, such as processor 510 or
components thereof, to perform method 440 of FIG. FIG. 5 also shows that wireless controller
540 may be coupled to processor 510 and to antenna 542 via radio frequency (RF) interface
580. In particular embodiments, processor 510, display controller 526, memory 532, CODEC
508, wireless controller 540, and RF interface 580 are included in system in package or system
on chip device 522. In particular embodiments, input device 530 and power supply 544 are
coupled to system on chip device 522. In a further specific embodiment, as illustrated in FIG. 5, a
display 528, an input device 530, a microphone 518, an antenna 542, a high pass filter 104, a
low pass filter 106, a first amplifier 108, a second amplifier 110, The piezoelectric element 112,
the electromagnetic element 114, and the power source 544 are external to the system on chip
device 522. However, display 528, input device 530, microphone 518, antenna 542, high pass
filter 104, low pass filter 106, first amplifier 108, second amplifier 110, piezoelectric element
112, electromagnetic element 114, RF interface 580, and power supply 544. Each may be
coupled to components of a system-on-chip device 522, such as an interface or controller.
[0041]
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15
[0045]
In connection with the described embodiments, a first apparatus is disclosed that includes a
housing (eg, the housing 150 of FIG. 1) and means for converting a first signal to a first sound
wave. The means for converting the first signal into the first sound wave includes a first actuator
that vibrates the first portion of the housing in response to receiving the first signal. The first
sound wave is generated in response to the first actuator vibrating the first portion of the
housing. The means for converting the first signal to the first sound wave may be the
piezoelectric element 112 of FIG. 1, the housing 150 of FIG. 1, the first portion 302 of the
housing 150 of FIG. It can include one or more other devices, circuits, or modules for converting
one signal, or any combination thereof.
[0042]
[0046]
The first apparatus may also include means for converting the second signal into a second sound
wave. A means for converting the second signal into a second sound wave comprises vibrating
the first portion of the housing and the second portion of the housing in response to receiving
the second signal. including. The second sound wave is generated in response to the second
actuator vibrating the first portion of the housing and the second portion of the housing. The
means for converting the second signal to the second sound wave may be the electromagnetic
element 114 of FIG. 1-2 and its components, the housing 150 of FIG. 1, the second portion 304
of the housing 150 of FIG. 3, the second And / or one or more other devices, circuits, or modules,
or any combination thereof, for converting the second signal into sound waves.
[0043]
[0047]
In the context of the described embodiment, a second apparatus is disclosed which comprises
means for receiving an audio signal. For example, the means for receiving an audio signal may be
the CODEC 102 of FIG. 1, the high pass filter 104 of FIG. 1, the low pass filter 106 of FIG. 1, the
first amplifier 108 of FIG. 1, the second amplifier 110 of FIG. The processor 510 may be
programmed to execute the five instructions 558, one or more other devices, circuits, or modules
for receiving audio signals, or any combination thereof.
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[0044]
[0048]
The second apparatus may also include means for generating a first signal within the first
frequency band. For example, the means for generating the first signal may include the high pass
filter 104 of FIG. 1, the first amplifier 108 of FIG. 1, a processor 510 programmed to execute the
instructions 558 of FIG. Can include one or more other devices, circuits, or modules, or any
combination thereof, to generate.
[0045]
[0049]
The second apparatus can also include means for generating a second signal within the second
frequency band. For example, the means for generating the second signal may include the low
pass filter 106 of FIG. 1, the second amplifier 110 of FIG. 1, a processor 510 programmed to
execute the instructions 558 of FIG. One or more other devices, circuits, or modules, or any
combination thereof, for filtering the signal may be included.
[0046]
[0050]
The second apparatus can also include means for generating a first sound wave based on the first
signal. For example, the means for generating the first sound wave may be the piezoelectric
element 112 of FIG. 1, the piezoelectric material 146 of FIG. 1, the housing 150 of FIG. 1, one or
more other for generating the first sound wave. Devices, circuits, or modules, or any combination
thereof.
[0047]
[0051]
The second apparatus can also include means for generating a second sound wave based on the
second signal. For example, the means for generating the second sound wave may be the
electromagnetic element 114 of FIG. 1, the magnet 155 of FIG. 1, the damping member 165 of
FIG. 1, the first material 170 of FIG. Housing 150 of FIG. 1, may include one or more other
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17
devices, circuits, or modules for generating the second sound wave, or any combination thereof.
[0048]
[0052]
Those skilled in the art will appreciate that the various exemplary logic blocks, configurations,
modules, circuits, and algorithm steps described in the context of the embodiments disclosed
herein are electronic hardware, computer software being executed by a processor. It will be
further appreciated that it may be implemented as, or a combination of both. Various illustrative
components, blocks, configurations, modules, circuits, and steps have been described above
generally in terms of their functionality. Whether such functionality is implemented as hardware
or processor-executable instructions depends upon the particular application and design
constraints imposed on the overall system. Those skilled in the art can modify the various
methods for each particular application to perform the functions described, but such
implementation decisions should be interpreted as causing a departure from the scope of the
present disclosure. Absent.
[0049]
[0053]
The algorithm or method steps described in connection with the embodiments disclosed herein
may be embodied directly in hardware, in a software module executed by a processor, or a
combination of the two. The software modules include random access memory (RAM), flash
memory, read only memory (ROM), programmable read only memory (PROM), erasable
programmable read only memory (EPROM), electrically erasable programmable read only
memory (EEPROM TM), registers, hard disks, removable disks, compact disk-read only memory
(CD-ROM), or any other form of non-transitory storage medium known in the art. An illustrative
storage medium is coupled to the processor such that the processor can read information from,
and write information to, the storage medium. In the alternative, the storage medium may be
integral to the processor. The processor and the storage medium may reside in an application
specific integrated circuit (ASIC). The ASIC may reside in a computing device or user terminal. In
the alternative, the processor and the storage medium may reside as discrete components in a
computing device or user terminal.
[0050]
[0054]
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18
The previous description of the disclosed embodiments is provided to enable any person skilled
in the art to make or use the disclosed embodiments. Various modifications to these
embodiments will be readily apparent to those skilled in the art, and the principles defined herein
may be applied to other embodiments without departing from the scope of the present
disclosure. Thus, the present disclosure is not intended to be limited to the embodiments set
forth herein but is capable of consistent with the principles and novel features as defined by the
following claims. It will be given a wide range.
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19
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