close

Вход

Забыли?

вход по аккаунту

?

JPS5211792

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JPS5211792
Patent Office Secretary Katayama Ishibe 1, title of invention 3, inventor's name Vu ow Fugang
Sass (1 other) □ 4, patent applicant address Zug Bahnhof Strasse 28 ° (1 other) 0 0 Japan
Patent Office ■ Japanese Patent Application Laid-Open No. 52-117920 Published Japanese
Patent Application No. 52. (1977) 1.28 ■ Japanese Patent Application No. 51-g1g '70 Office
Serial Number Description 1 strength 40) name 4 small material blockon-contacted carrier
manufacturing method thereof 2 claim claim $ 巳 -1, raster V (Thus, in a carrier to which
material blocks separated from each other are bonded, the material block '(10) which is in
contact with the carrier (carrier strip 11) has the same width' kNL, and one plane height of the
material block is the entire iN agent The carrier according to claim 1, wherein the carrier having
a block of material having M's not taken as t'FfW, 2 and the adhesive bond (adhesive 8) are
water-soluble. 3. The temperature Kl · · · · · 2i combination (adhesive 8) is 220 "C or less. T E 1 =
Carrier according to 1 item 1 claims. 4, The material block (10) is made of piezoelectric ceramic!
The carrier listed in one of the range 1 to 3 of the revision M request.
2, number 2 of the invention described in the claims
3. Detailed Description of the Invention The present invention fJA relates to small material blocks
fixed adjacently on the carrier apart from one another according to a raster, and to a process for
the production thereof. Such carriers with material blocks are necessary for mass production of
very small parts in so-called raster technology, where the parts to be produced are arranged
adjacent to one mount, the distance of which remains constant To be chosen. In order to set the
material block, the material blocks are fixed with the same raster dimensions and t carriers are
required. Japanese Patent Application No. 51- of the same application filed on the same day
entitled "Tome pickup and its production method" by the present applicant shows a ninth such
mass production method for producing a so-called pressure big-up, which comprises (7) ceramic
04-05-2019
1
block . However, the invention can also be practiced. From the purpose of use, it is important that
the material pro- ture and the turk accurately occupy the desired position, and it is important
that the raster size be maintained tightly, so that this condition is satisfied and at the same time it
is economical. The purpose is to obtain a preparation method. The object of this invention is to
cut into a strip of material which is fixed to an adhesive which is at least stable to liquid cleaners
on a cutting mount according to the invention into strips, wash them with a cleaning agent and
produce one cut. Material which is fixed on the carrier plate by the second adhesive which is
stable to the used casting material and the solvent of the first layering material, and which is
filled with the casting material later. And after changing the first cutting direction and direction
after filling the material (especially at @ corner), cut again by strip cutting @ vc, and then the
obtained carrier is cut into strip cutting unit (8 2.) The solution of the adhesive by the solvent of
the adhesive, the sinking base material is dissolved from the groove, and the solution is solved by
cutting the carrier sheet metal together in one cutting process VC. As liquid cleaners which do
not attack the first adhesive, oils and solvents such as trichlorotrifluoroethane are listed. In
particular, a strip-like carrier is thus obtained, in which the material blocks are bonded, the
material blocks bonded to the carrier being of the same width, the side aligned in one plane
being free of adhesive. This material block can be stored on a glued carrier and can therefore be
marketed as a semi-finished product. The first adhesive f can be used as a pouring material to
simplify the principle. In that case, only two laydowns would be due for this method, and that FIA
* 1 adhesive would be stable to the solvent of the second laydown, and the 'm2 glue would be
Must be stable to the adhesive's adhesive solvent (9).
In particular, the first adhesive is soluble in oil, water and soluble in trichloroethylene, which is
stable to trichlorotrifluoroethane. For example, the first agent is polymethylene methacrylate. On
the contrary, the second adhesive is stable to oil, trichlorotrifluoroethane and trichloroethylene,
but water soluble. In this case, the adhesive is stable at temperatures up to at least 220 ° C., and
has the following composition (1): glue known under the name: 6) 1 water containing) 6
micronized amorphous porous 0.1 part by weight of silicic acid, 1 drop of denside 1/10/10 fs, an
organic adhesive agent (CaS04-2H * 0) 1 to 3 parts by weight, boric acid anhydride (BgOs) ', 0.. '5
parts by weight (individual weight m (1> tolerance ± 30%) but in this case several tolerances are
advantageous. (LO) EndPage: 3 moisture 癲 肴 截 select the same amount as the dry substance of
adhesive dysentery. ゐ, コ ラ コ ラ and (コ ラ) anhydrous boric acid can be replaced by other
water-binding substances. Details of this substance U-= German patent application P2408231 V
This is described. This adhesive can be used as the second adhesive in the process of the
invention. According to the method of the present invention to the second adhesive according to
the method of the present invention to the material-2 always to connect the piezoelectric
ceramic, the glue plate or the resulting material block, in particular the piezoceramic block, to the
carrier which is 1t-I by cutting the carrier plate CC. used. . For oil and water, as a cleanser, it is
preferable to use an oil, a dimineral oil, and then trichlorotrifluoroethane for deoiling. When
manufacturing pressure buildup of 1 video disc, the piezoelectric ceramic plate used as a
04-05-2019
2
material plate, in particular has a starting size tube with a thickness of 100 to 250 μm, and its
exclusion side ring in particular has a length lO of 1 side to 1 side It is a square of 15N n or a
rectangle, or a circle of (vc diameter to -18B). 5 Double-sided metallized pressure to avoid
installing electrodes later! Ceramic plates are advantageously used. After the oil residue is
washed, it can be removed by brushing with a brush, which is generated due to goldation during
cutting. Metal carriers are generally suitable for use as carriers temporarily and are metal sheets
of a thickness of about o, sm + n, and must correspond at least to the starting dimensions of the
piezoceramic sheet on its outer ring. Now, the present invention will be described with reference
to the drawings. In FIG. 1a, the material plate 1 is used as the first adhesive 2 and is adhered to
the cutting mount 3 by means of a liquid, remethylene methacrylate, a steel, a steel 5 and so on.
Indigo lard 114 (FIG. 3) is provided. , Polymethylene methacrylate?
In the process and all the following processes, the plastic can be replaced by a glass plastic in the
form of aJ solution in trichloroethylene, but this plastic can be dissolved in
trichlorotrifluoroethane, oil and water. 7. Ilニーい。 Q) L V (bonded fl, ft material plate,
especially piezoelectric ceramic plate 1) is cut to a size of rasq as shown by a cutting device such
as a saw or other suitable cutting device suitable for cutting with a ceramic cutting f The result is
a material strip 6 bonded to the plastic ring of the cutting mount 3 as shown in FIGS. 1 b and 4.
Materials) IJ's, the cutting residue on the surface of the pro is washed with oil, then the oil is
washed with trichlorotrifluoroethane not dissolving polyethylene methacrylate and degreased.
The cutting of the metallized piezoceramic surface is particularly removed by means of a glass
brush. The cleaned, preferably ceramic, carrier plate 7 is then adhered to the cleaned material
strip 6 which is subsequently cleaned once more with trichlorotrifluoroethane and which is in
turn adhered to the cutting mount 3. The second adhesive 8 necessary for this is, in particular,
stable to oils, trichloroethylene and trichlorotrifluoroethane, but soluble in water (13).
Furthermore, the adhesive is stable at temperatures up to at least 220.degree. The layer
thickness of the adhesive is about 0,05 wm7. The prestressing with the adhesive press results in
an adhesive layer of uniform thickness during the drying process of the adhesive 8, so that the
surface of the pair of carrier plates 7 is parallel to the surface of the material strip 6. After drying
of the adhesive 8, the polyethylene methacrylate used as an adhesive of the cutting mount 3 and
the material strip 6 is completely dissolved by immersing the cutting mount 3 in the solvent of
the first adhesive 2, ie trichloroethylene. Do. Therefore, with the M weld adhesive 8 at the desired
rask dimensions (in particular 0.4 for the rask dimensions, piezoelectric ceramic, with a width of
0.2 IIm for the piezoelectric ceramic), the carrier plate of the shell ceramic 7. A material strip 6
bonded to is obtained. The carrier plate 7 with the material strip 6 bonded by the solid arrows
between FIG. 1b and the IC diagram is relative to the cutting device [90] relative to the cutting
device around the axis running down from the top (14) EndPage: 4 (1). It is shown that it must be
rolled. Furthermore, the carrier plate 7 is bonded to the cutting mount 3 by means of the first
adhesive 2, in particular polymethylene methacrylate, on the side which has not been bonded.
04-05-2019
3
This mount 3 may be coated with polymethylene methacrylate (forms a (removable) part of a
strip cutter like the 1 lau K cut mount shown). The grooves 13 shown in FIG. 1b between the
material strips 6 are filled with the same first + Jk adhesive 2 (polymethylene methacrylate) in
order to be subjected to the cutting forces generated in the chisel 2 cutting process. (For that
reason the inverted arrangement of FIG. 1c must be reversed. FIG. 1c is a sequence of strip, plate
and adhesive layer in FIG. 1b to facilitate understanding of the individual steps. 2.) A step of
pouring the first adhesive material 2 as a pouring material for 1ill 3 by means of dashed arrows
is implied. As shown by the next VC line 9, it is cut into strips. A carrier strip lL (a second (M
machine) adhesive 8) bonded material block 10 obtained by processing the carrier plate 7 by this
method is obtained, for example, a piezoelectric ceramic block. FIG. 1 d shows the removal of the
first adhesive (polymethylene methacrylate) by means of a suitable solvent (trichloroethylene)
from the cutting device part or cutting mount 3. The carrier l'l having the material block 10i
manufactured in this way is shown in FIG. A comb-like body is obtained, which corresponds to,
for example, the square rask dimension for the so-called rask assembly of the center distance
1ijlix pressure transducer element of the material block IO. It is storable, is stable to the solvent
outside the water plate by adhesive bonding with its second agent 8 vc, and withstands
temperatures up to at least 220 ° C. FIG. 3 is a perspective view of FIG. 1a. On the cutting
mount 3 of the cutting device, the first if and layer, C ring 4 is provided, and the material plate 1
is fixed thereon with the adhesive 2. On the left side of the knitting 4 is shown a state in which
the material plate 1 (FIG. 1a) is cut into material strips 6. The right part of FIG. 4 shows a part of
a state in which the carrier plate 7 is adhered to the material strip 6 with the second adhesive at
the backing. $ J5 shows the situation after cutting the material strip 6 and the carrier plate 7 of
FIG. 1c. As it extends from left to right in FIG. 5 during the last cutting, carriers IJ tab 11 are
formed which extend left to right. A number of material blocks 10 are arranged on each carrier
strip. FIG. 6 corresponds to a carrier IIK having a material block lO according to FIG. 1 d. A
second method is shown in FIG. 2K.
The carrier plate 7 is cut with a gx adhesive 2 in the form of liquid polymethylene methacrylate
which is subsequently cured. It is fixed to the base 3 and its supporting surface is likewise coated
(17) with the already cured polymethylene methacrylate. Next, a material plate l is adhered to the
carrier plate 7 by means of a second water-soluble adhesive 8. The adhesive layer is <lco, 05fi.
The use of a bonding press ensures that the plate surfaces are bonded parallel to one another.
The material is fixed to the bending mount 3 by means of the first agent 2 described in the
description of the method principle described above. The plate is then cut so that the plate l is
completely separated from the saw or other cutting device π at the desired rask dimension and
the carrier plate 7Vc only has a cut c-S. At that time W'2bL! As shown after U [90 ° rotation, the
material glued to lath J-ilf caliper plate 7) IJ tube 6 results. 1 before washing. ? In order to be
subjected to de-energization and cutting forces, it is filled with adhesive # 1 (polymethylene
methacrylate) as implied by the dashed line. After curing, rotate 90 ° with respect to the first
04-05-2019
4
cutting direction as shown by line 9, (18) EndPage: 5 saws or other cutting device 1cJ: perform
another l + w cutting with a raster dimension. Since the strip of material 6 and the carrier plate 7
are now completely cut, in contrast to a single cut, a second C-shaped material block 10 bonded
to the carrier in the form of a carrier strip 11 results from the adhesive 8 vC. The carrier strip is
already separated from the cavity mount 3 since it must be dissolved with polymethylene
methacrylate and trichloroethylene before reaching the state mK of FIG. 2c. As a result, an
arrangement like that shown in FIG. 7 is obtained. Unlike the crunchy arrangement of FIG. 6, the
grooves 13 between the material blocks lO of FIG. 7 extend to the carrier material 11, whereby
the second contact ij ,! Also @ 8 is completely separated. In addition to the method principle of
the present invention, the first method, generally shown in FIG. 1, adheres to the material plate 1
only after the carrier plate 7'i has been cut and cleaned. The material strip q is melted from the
(first) cutting mount and glued to the second cutting mount 3 forming the carrier plate 7'fr strip
cutting device member, filling in the groove 13f and then the carrier plate Cutting the material
strip 6 with 7 and changing it to the first cutting direction, and then holding the material block
LOf on the carrier of the remaining material) IJ's 7'll '(H second cutting mount 3) It features.
(The two cutting mounts 3 may be the same because they are required not sequentially but
sequentially between the steps. For the curing time of the layer 4 it is particularly advantageous
to provide a separate cutting mount. 2) The first method of the material plate l) to the feature of
the second method according to FIG. 2 VC 1) forming a cutting device member on the carrier
plate 7 '1 with the first adhesive 2 before cutting IJ It is to be glued to the mount 3 and then to
coat the material plate 1 with the second adhesive 8 to the recarya plate 7. Material blocks
shown in Figures 6 and 7? It is apparent that the bonded key jIJ is manufactured according to
the method of the present invention. This means that the surface in one plane, that is, the surface
where the material block IO and the surface of the carrier 110 are in one plane, in other words,
the sixth step 7 + XIO before m112 and the invisible back face Because it is' / g. Furthermore, the
17r material block lO and the carrier ll [are mutually the same width. The grooves 13 between
the material blocks in FIG. 6 VC differ from those in FIG. Do not reach to l ° C. If the material
block 10 is to be machined, the method of the rear tta Q 4 made from Q Q), in particular the
quality of the adhesive, for example the quality of the adhesive (for example the front 12 of FIG.
6 and 7), T11. Has a small advantage, such as, for example, it is important to use high frequency
as a piezoelectric conversion element. In this case, since the second adhesive 8 can be completely
dissolved, there are 7 residuals 7 that remain after the VCC mass rise.
4. Brief description of the drawings. FIG. 1 is a view showing the steps of the first method
according to the present invention, FIG. 1 is a perspective view showing an intermediate step in
mud 3 to a plan view. FIG. 2 is a perspective view showing the final product according to the
method of 2 ′. '1 ... Material board,' 2 ...: first adhesive, 3 ... cutting ('21) '' ', 6 ... material strip, 7
... keying board. 8: Second adhesive, lO: material block, 11: carrier strip (22) EndPage: 66, list of
04-05-2019
5
attached documents (1) specification 1 letter G) drawing 1 letter (3) power of attorney 1, 7
Inventors, patent applicants or agents other than the above (1) Inventor's address Berlin 28
Germany Zilve Stelveek 7 Name Kunter Yoshiko (2) Agent 481-EndPage: 7
04-05-2019
6
Документ
Категория
Без категории
Просмотров
0
Размер файла
18 Кб
Теги
jps5211792
1/--страниц
Пожаловаться на содержимое документа