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JPS57166499

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DESCRIPTION JPS57166499
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a conventional
ultrasonic ceramic microphone, and FIG. 2 is an ultrasonic ceramic mirror of the present
invention. Fig. 3a is a cross-sectional view showing an embodiment of an airplane. b and c are top
views showing another example of the shape of the ring constituting the microphone of the
present invention, and FIG. 4 is a comparison diagram of the sensitivity-frequency characteristics
of the product of the present invention and the conventional product. 7
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ииииииииииииииииииииииииииии иии Piezoelectric ceramic vibrator и и и и и и и и и и и и и и и и и и и и и и Buffer material, 11 .....
Elastic adhesive.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic
ceramic microphone having a sealed structure in which a piezoelectric ceramic vibrator is
attached to the inner bottom surface of a truncated conical case and the piezoelectric ceramic
vibrator is shielded from the outside air. . First, a conventional microphone of this type will be
described with reference to FIG. In FIG. 1, 1 is a circle); he ''-xc *** has, = otes + ? 16, so that the
thickness of the side portion is thicker than the thickness of the bottom portion, 7 / (9911)). It is
composed of two. A piezoelectric ceramic vibrator 2 is bonded to the inner bottom surface of the
case 1 to form a vibrating portion. A terminal plate 3 formed of a metal base and a resin plate is
attached to the opening of the case 1 through an elastic adhesive 4 so that the inside of the case
1 is sealed. In FIG. 1, 5, 5 'are terminals and 6, 6' are lead wires. However, with such a
conventional microphone structure, the vibration area is increased, the acoustic sensitivity is
improved, and the vibration interference due to the thickness difference is reduced, so that the
shape is large and the case processing cost is high. It was something I had. SUMMARY OF THE
INVENTION The object of the present invention is to improve the disadvantages of the prior art,
to miniaturize it, to reduce the vibration damping due to the support state of the case, and to
provide an ultrasonic ceramic microphone with a low cost structure. One real business example
04-05-2019
1
of the present invention will be described below with reference to FIG. Reference numeral 7
denotes a truncated cone-shaped case, in which a piezoelectric ceramic vibrator 8 is bonded to
the inner bottom surface 7a to form a vibrating portion). Here, the frusto-conical case 7 has a
structure capable of obtaining a large vibration amplitude by setting the shape and dimensions
so that the vibration mode approximates each of the respective frustums of the truncated cone
when the base portion 13 'is vibrated. can do. A ring made of metal or resin from nine companies
is fixed to the inside of the truncated cone-shaped case 7. The ring 9 receives the vibration
transmitted to the side of the case 7 and vibrates inward. That is, the ring 9 can improve the
vibration efficiency of the vibration surface. As the shape of the ring 9, for example, the effect
can be obtained by adopting any of the shapes shown in FIGS. 3a, 3b and 3c instead. A shock
absorbing material 10 is installed on the ring 9 from the opening of the truncated cone shaped
case 7. A terminal plate 11 made of a metal base and a resin plate is fixed to the opening of the
truncated cone shaped case 7 through an elastic adhesive 12. In FIG. 2, 13.13 'are terminals, and
14 and 14' are leads. The sensitivity-frequency characteristics of the microphone of this
embodiment are as shown by the curve B in FIG. 4, and the curves of the curves 4 and 1 in FIG.
These show the characteristics of the conventional example shown in FIG.
As described above, in the microphone of the present invention, high sensitivity can be achieved
by designing a truncated cone-shaped case, and at the same time a ring is provided on the inner
side of the case to suppress vibration interference of the case side, and conversely, a vibrating
portion Because of the structure capable of improving the vibration amplitude of the sensor, it is
possible to obtain high sensitivity and wide band sensitivity-frequency characteristics. In
particular, since the thickness of the frusto-conical case can be made uniform by incorporating
the ring, the processing cost is low and miniaturization can be realized.
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