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JP2005354151

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DESCRIPTION JP2005354151
PROBLEM TO BE SOLVED: To realize high-density mounting and obtain highly reliable and
sufficient vibration power. SOLUTION: An internal coil 12 as a component of a speaker is formed
by a wiring pattern inside the LSI 1, and is supported by an external coil 31 or a permanent
magnet and these on the surface of the printed board 2 opposite to the LSI 1 mounting surface. A
diaphragm 3 composed of a movable member is provided, and a current is flowed in a direction
to generate a repulsive magnetic force between the internal coil 12 and the external coil 31 or a
permanent magnet, thereby constructing a semiconductor device with a built-in speaker. The
surface of the printed circuit board 2 facing the diaphragm 3 may be provided with a recess or a
hole. [Selected figure] Figure 1
Semiconductor device
[0001]
The present invention relates to a semiconductor device incorporating a speaker.
[0002]
If a multi-functional circuit is incorporated into an LSI, the number of parts can be reduced, and if
the speaker is miniaturized, the acoustic device can be miniaturized accordingly.
However, there is still no change in having to provide a speaker other than the IC. In the case of
mounting a speaker on an audio device, a space for that is required, which is an obstacle to
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miniaturizing the device. In addition, since the LSI and the speaker are separate bodies, the
speaker and the LSI must be attached to the acoustic device, and in some cases, a mounting
operation such as wiring between the LSI and the speaker is required. There is also a problem
that it takes time and effort.
[0003]
Therefore, conventionally, a sound generating body by a piezoelectric element is attached to an
IC package, and a semiconductor integrated circuit (for example, see Patent Document 1) which
drives the sound generating body by a sound generation drive circuit on an IC chip in the
package Semiconductor device (for example, see Patent Document 2) incorporating a thin film
and an acoustic functional element for vibrating a vibrating thin film by a drive means and a
signal processing unit incorporated in the same (for example, see Patent Document 2) An
electroacoustic integrated circuit having an integral integration structure by directly bonding an
electroacoustic element using a piezoelectric substrate containing as a main component by
hydrogen bonding or covalent bonding of hydrogen or oxygen or hydrogen group at the
interface (for example, patent document 3) has been proposed. JP-A-9-55443 JP-A-4-96266 JPA-7-169661
[0004]
However, according to the technology disclosed in Patent Document 1, although the speaker can
be incorporated in the IC package, incorporating the movable body as the movable body in the IC
package is, for example, inside through the vibrating body. There is a problem from the
viewpoint of reliability due to the infiltration of water, etc., and its practical use is difficult.
Further, according to the techniques disclosed in Patent Document 2 and Patent Document 3,
although it is possible to provide a semiconductor device in which a vibrating body is mounted
on the same semiconductor substrate, the vibration amplitude can not be secured, and sufficient
vibration power is generated. I can not do it.
[0005]
The present invention has been made in view of the above circumstances, and by using a
semiconductor substrate as a part of a speaker, high density mounting can be achieved, and high
reliability and sufficient vibration power can be obtained. An object of the present invention is to
provide a semiconductor device.
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2
[0006]
In order to solve the above-described problems, the semiconductor device of the present
invention is mounted on an internal coil formed by a wiring pattern inside the semiconductor
integrated circuit and on the back surface of a substrate on which the semiconductor integrated
circuit is mounted to flow alternating current. An external coil connected to the wiring pattern so
that a repulsive magnetic force acts between the internal coil and the internal coil, and a
diaphragm made of a movable material supporting the external coil.
[0007]
Further, in the present invention, a recess or a hole is provided on a surface of the substrate
facing the diaphragm.
[0008]
Further, in the present invention, the external coil is connected to the internal coil through a
semiconductor integrated circuit terminal.
[0009]
Further, in the present invention, the external coil is connected to the internal coil through a lead
frame disposed on four sides of the package.
[0010]
In order to solve the above-described problems, the semiconductor device of the present
invention is mounted on an internal coil formed by a wiring pattern inside the semiconductor
integrated circuit and on the back surface of a substrate on which the semiconductor integrated
circuit is mounted to flow alternating current. It is characterized in that it comprises a permanent
magnet attached so that a repulsive magnetic force acts with the internal coil, and a diaphragm
of a movable material for supporting the permanent magnet.
[0011]
According to the present invention, the internal coil to be the component of the speaker is
formed by the wiring pattern inside the integrated circuit, and is supported by the external coil or
permanent magnet and these on the surface opposite to the mounting surface of the
semiconductor integrated circuit. A semiconductor device with a built-in speaker can be
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constructed by providing a diaphragm composed of a movable member and supplying a current
in a direction to generate a repulsive magnetic force between the internal coil and the external
coil or a permanent magnet. Since the semiconductor substrate can be used as a part of the
speaker and the vibration amplitude corresponding to the thickness of the semiconductor
substrate can be secured, a sufficient speaker output can be obtained.
Also, at this time, it is advantageous to transport the magnetic field by providing a recess at a
position facing the diaphragm of the substrate or making a hole.
Furthermore, since the semiconductor substrate itself does not vibrate due to the presence of the
vibrating body, there are few problems with reliability, and the diaphragm can be adjusted to a
necessary size.
[0012]
Further, the external coil can be realized by a WCSP (Water-level Chip Size Package) by
connecting to the internal coil through the semiconductor integrated circuit terminal, and the
external coil is an internal coil through a lead frame disposed on four sides of the package. It is
possible to realize by QFP (Quad flat Package) etc. by connecting to.
[0013]
FIG. 1 is a view showing an example of the cross-sectional structure of a semiconductor device of
the present invention mounted on a WCSP.
As shown in FIG. 1, the internal coil 12 is formed by the wiring pattern of the amplifier inside the
LSI 1.
Further, the diaphragm 3 configured of the external coil 31 and the movable member supported
by the external coil 31 is externally attached.
Then, a connection is made such that a magnetic force (arrow in the figure) that repels when the
audio signal 11 flows in the inside of the LSI 1 acts on both the coils 12 and 31.
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Here, although the external coil 31 is illustrated as being provided inside the diaphragm 3, the
external coil 31 may be mounted on the surface opposite to the mounting surface of the printed
circuit board 2 of the LSI 1.
In addition, a cone paper used in a normal speaker is used as the diaphragm 3 here.
[0014]
That is, the external coil 31 is mounted on the back surface of the printed circuit board 2 on
which the LSI 1 is mounted, and the repulsive magnetic force acts on the internal magnetic coil
12 when an alternating current corresponding to the audio signal 11 flows. It is connected to the
internal wiring pattern (internal coil 12) through the terminal 13. As a result, since the external
coil 31 is supported by the diaphragm 3 made of a movable material, it vibrates by the repulsive
magnetic force, and the vibration is transmitted to the diaphragm 3 to generate a sound.
[0015]
Here, a hole is provided at a position facing the diaphragm 3 of the printed circuit board 2. This
is provided to secure the vibration amplitude of the diaphragm 3. The space between the printed
circuit board 2 and the diaphragm 3 is a passage for air for the diaphragm 3 to vibrate.
Furthermore, the presence of the holes favors the transport of the magnetic field.
[0016]
FIG. 2 is a cross-sectional view of another embodiment of the present invention implemented in a
WCSP. Here, a recess (recess) is provided at a position facing the vibration plate 3 of the printed
circuit board 2. Depending on the permeability of the printed circuit board 2, it is effective in the
case where the magnetic field can be secured without making a hole as in the embodiment
shown in FIG. Also, in this case, the air passage portion is formed by placing a distance between
the printed circuit board 2 and the diaphragm 3.
[0017]
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FIG. 3 is a cross-sectional view of yet another embodiment of the present invention implemented
in a WCSP. As shown here, by arranging the vibration 3 with respect to the printed circuit board
2 at a distance (d) equivalent to a predetermined vibration amplitude, the hole and the recess in
the embodiment shown in FIG. 2 are unnecessary. become. However, in this case, it is assumed
that the printed circuit board has a magnetic permeability that allows magnetic field traffic. In
any of the embodiments shown in FIGS. 1 to 3, the external coil 31 may be replaced by a
permanent magnet.
[0018]
FIG. 4 is a view showing the cross-sectional structure of the semiconductor device of the present
invention mounted in a normal package, for example, mounted in a QFP. Here, only an example
in which a hole is made in the printed circuit board 2 is shown. The difference from the
embodiment shown in FIG. 1 is that the external coil 31 connected externally is connected to the
internal wiring pattern (internal coil 12) via the lead frames (pins 41 for external input and
output) arranged on the four sides of the package 4 It is about being connected, others are
similar. Also here, since the external coil 31 is supported by the diaphragm 3 made of a movable
material, it is vibrated by the repulsive magnetic force generated by the connection relationship
between both the coils 12 and 31, and the vibration is transmitted to the diaphragm 3 to
generate sound. Occur. Here, only the example in which the hole is made in the surface of the
printed circuit board 2 opposite to the diaphragm 3 is shown, but as in the embodiment shown in
FIG. As in the embodiment, the diaphragm 3 may be spaced apart so as to secure a
predetermined amplitude without processing the printed circuit board 2.
[0019]
As described above, according to the present invention, the internal coil 12 serving as a speaker
component is formed by the wiring pattern inside the LSI, and supported by the external coil 31
or permanent magnet and these on the substrate surface opposite to the LSI mounting surface.
The semiconductor device with a built-in speaker can be constructed by flowing the current in
the direction to generate the repulsive magnetic force between the internal coil 12 and the
external coil 31 or the permanent magnet, by providing the diaphragm 3 configured of the
movable member . At this time, since the printed circuit board 2 can be used as a part of the
speaker and the vibration amplitude corresponding to the thickness of the printed circuit board 2
can be secured, a sufficient speaker output can be obtained. Furthermore, since the printed board
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2 itself does not vibrate due to the presence of the vibrating body 3, there is little problem with
reliability, and the vibrating plate 3 can be adjusted to a necessary size.
[0020]
Further, as shown in FIG. 1, the external coil 31 can be mounted on the internal coil 12 through
the LSI terminal 13 for WCSP mounting, and as shown in FIG. The QFP mounting can also be
realized by connecting to the internal coil 12 through the lead frame 41 disposed in FIG.
[0021]
It is a figure which shows the cross-section of the semiconductor device of this invention
mounted in WCSP.
It is a figure which shows the other cross-section of the semiconductor device of this invention
mounted in WCSP. It is a figure which shows the further another cross-section of the
semiconductor device of this invention mounted in WCSP. It is a figure which shows the crosssection which is mounted in a normal package, for example, is mounted in QFP.
Explanation of sign
[0022]
DESCRIPTION OF SYMBOLS 1 ... LSI, 2 ... Printed circuit board, 3 ... Diaphragm, 11 ... Sound
signal, 12 ... Internal coil, 13 ... LSI terminal, 31 ... External coil, 41 ... Lead frame
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