close

Вход

Забыли?

вход по аккаунту

?

JP2008263417

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2008263417
An object of the present invention is to improve the productivity of a speaker diaphragm. In
order to achieve this object, a method of manufacturing a resin plate according to the present
invention is characterized in that the first mold 3 and the second mold are opened with the first
mold 3 and the second mold 4 opened. A first step of supporting the resin film 7 between the
molds 4 and forming a sealed chamber 11 by clamping the first mold 3 and the second mold 4
while supporting the resin film 7 Second step, third step in which the resin film 7 is brought into
close contact with the molding die 6 of the first die 3 by operating the piston 5 in the sealed
chamber 11 to generate pressure by the compressed air generated Is included. As a result, the
resin film 7 can be uniformly adhered to the mold 6 by the pressure of compressed air even in
the mold 6 having a complicated shape, and the productivity of the speaker diaphragm can be
enhanced. [Selected figure] Figure 3
Method of manufacturing resin plate and method of manufacturing speaker diaphragm using the
same, speaker diaphragm, speaker, electronic device
[0001]
The present invention relates to a method of manufacturing a resin plate, a method of
manufacturing a speaker diaphragm using the same, a speaker diaphragm, a speaker, and an
electronic device.
[0002]
In recent years, with the increase in demand for mobile phones and notebook computers, high
11-05-2019
1
productivity is also required for speakers used for these.
In order to meet such market requirements, a method of pressing a resin film with a pair of male
and female molds has mainly been used in a method of manufacturing a resin plate used as a
speaker diaphragm.
[0003]
FIG. 4 is a cross-sectional view of a pair of molds used in a conventional method of
manufacturing a speaker diaphragm.
[0004]
That is, in the conventional method for manufacturing a speaker diaphragm, the first mold 1a
having a desired mold and the second mold 1b fitted to the first mold 1a The resin film 2
supported between the metal mold 1a and the second metal mold 1b was hot press molded to
obtain a speaker diaphragm.
[0005]
In addition, as this prior art document, patent document 1 is mentioned, for example.
Unexamined-Japanese-Patent No. 6-133392
[0006]
And in the manufacturing method of the conventional diaphragm for speakers which is a system
which fits the 1st metal mold 1a and the 2nd metal mold 1b, exact accuracy was required at the
time of fitting.
On the other hand, in recent years, since the speaker diaphragms having a complicated shape
have been increasing, moldings by the conventional method for manufacturing a speaker
diaphragm are likely to be defective and the productivity is not excellent.
11-05-2019
2
[0007]
Then, an object of the present invention is to improve the productivity of the speaker diaphragm.
[0008]
And in order to achieve this object, in the method of manufacturing a resin plate according to the
present invention, a first mold having a mold and a second chamber forming a sealed chamber in
cooperation with the first mold are formed. The first mold and the second metal are opened in a
state in which the first mold and the second mold are opened by a molding machine provided
with the first mold and the second mold by the molding machine provided with the first mold and
the second mold. A first step of supporting the resin film between the molds, a second step of
clamping the first mold and the second mold while supporting the resin film and forming a
sealed chamber, A resin plate is manufactured through a third step of bringing a resin film into
close contact with a molding die of the first mold with pressure generated by operating a piston
in a closed chamber and generating compressed air. .
[0009]
By the above-described configuration, in the method of manufacturing a resin plate according to
the present invention, the productivity of the speaker diaphragm can be enhanced.
[0010]
This is because the piston is operated, and the pressure of compressed air brings the resin film
into close contact with the molding die for molding.
That is, in the method of manufacturing a resin plate according to the present invention, it is
possible to closely adhere a resin film to a molding die by the pressure of compressed air even in
a molding die having a complicated shape, and the occurrence of defects in the speaker
diaphragm It can be reduced.
Furthermore, since this compressed air can be generated only by a simple operation of pushing
the piston in the molding die direction, failure of the apparatus is less likely to occur.
[0011]
11-05-2019
3
As a result, the occurrence of defects in the speaker diaphragm can be reduced, and the
productivity can be enhanced.
[0012]
Hereinafter, the configuration of a molding machine used in the method of manufacturing a resin
plate according to an embodiment of the present invention will be described using the drawings.
[0013]
As shown in FIG. 1, a molding machine used in the method of manufacturing a resin plate
according to an embodiment of the present invention comprises a first mold 3, a second mold 4
and a piston 5.
[0014]
On the surface of the first mold 3 is provided a forming die 6 formed in the shape of a desired
speaker diaphragm, and the shape of the forming die 6 is transferred to the resin film 7.
A back pressure hole 8 is provided penetrating from the surface on which the mold 6 is provided
to the back surface of the first mold 3 and this back pressure hole 8 is used for suction of air and
resin during resin plate molding. Spray the air after plate forming.
Further, although not shown, a heater for heating the first mold 3 is installed on the back of the
first mold 3 before the resin plate is formed.
[0015]
The second mold 4 has a box-like shape having a piston hole 9 for passing the piston 5 in the
inner bottom portion.
The edge 10 of the second mold 4 is in contact with the resin film 7 when the first mold 3 and
the second mold 4 are clamped as shown in FIG. Form 11
11-05-2019
4
Further, as shown in FIG. 3, when pushing the piston 5 in the direction of the arrow, it is
necessary to pull the outer periphery of the resin film 7 from the outside of the chamber 11 to
the inside to some extent in order to prevent breakage or failure of the resin film 7 Further, since
the air does not leak from the contact portion between the edge 10 and the resin film 7, the
material of the edge 10 is selected in consideration of the characteristics of the resin film 7.
Further, like the first mold 3, although not shown, a heater is provided on the side of the second
mold 4.
[0016]
As shown in FIG. 1, the piston 5 is constituted by the shaft 12 and the compression plate 13, has
a T-shaped cross section, and is capable of reciprocating in the vertical direction. Furthermore, a
mold contact portion 14 is provided on the side of the compression plate 13. The mold contact
portion 14 is a portion in contact with the second mold 4 and is formed of a heat resistant rubber
which is effective for sealing the chamber 11 at the time of pressing the piston 5 and is not easily
affected by heat. . Further, since the mold contact portion 14 needs to be replaced when worn
out, it is configured to be removable.
[0017]
Hereafter, the procedure of the manufacturing method of the resin board in one embodiment of
this invention is demonstrated using drawing.
[0018]
First, in the first step, as shown in FIG. 1, desired transfer positions on the mold 6 and the resin
film 7 coincide with each other with the first mold 3 and the second mold 4 opened. The resin
film 7 is supported between the first mold 3 and the second mold 4.
At this time, the compression plate 13 is disposed in the vicinity of the inner bottom portion of
the second mold 4. Before the first step, the first mold 3 and the second mold 4 are heated by a
heater (not shown) to a temperature higher than the glass transition temperature of the resin
film 7. In this embodiment, since PEI (polyether imide) is used for the resin film 7, the heating
temperature of the first mold 3 is set to 230 ° C., which is higher than the glass transition point
(220 ° C.) of PEI.
11-05-2019
5
[0019]
Next, in the second step, as shown in FIG. 2, the first mold 3 and the second mold 4 are clamped,
and a resin film is produced by the first mold 3 and the second mold 4. Hold 7 At this time, the
resin film 7 begins to soften due to the heat carried by the first mold 3 and the second mold 4.
Then, by sucking the air from the back pressure hole 8, the softened resin film 7 is brought into
close contact with the forming die 6 to a certain extent. The edge 10 of the second mold 4 is in
close contact with the first mold 3 via the resin film 7, and the side of the compression plate 13
is the second mold via the mold contact portion 14. It is in close contact with No. 4 and as a
result, a sealed chamber 11 is formed between the piston 5 and the first mold 3.
[0020]
Then, in the third step, pressure is applied to the resin film 7 by the compressed air generated by
pressing the piston 5 in the direction shown by the arrow in FIG. Transfer the shape of Here, the
pressure applied to the resin film 7 by compressed air is at most about 1.0 MPa in order to
reduce the possibility of breakage of the resin film 7. When the piston 5 is pushed, a gap does
not occur between the mold contact portion 14 and the second mold 4, and air does not leak
from the chamber 11 to the outside.
[0021]
Finally, after the temperature of the resin film 7 is lowered to the glass transition point or lower,
the first mold 3 and the second mold 4 are opened. Furthermore, air is jetted from the back
pressure hole 8, and the resin film 7 to which the shape of the mold 6 has been transferred is
peeled off from the first mold 3. As a result, a resin plate of a desired shape can be obtained.
[0022]
Hereinafter, the effect by the manufacturing method of the resin board in one embodiment of the
present invention is explained.
[0023]
11-05-2019
6
First, in the method of manufacturing a resin plate according to an embodiment of the present
invention, the productivity of the speaker diaphragm can be enhanced.
[0024]
This is because the pressure is applied to the resin film 7 by the operation of the piston 5 as
shown in FIG.
[0025]
That is, in the past, the speaker diaphragm was manufactured by fitting the molds to each other,
so it was observed that many molds did not fit correctly and a defect was generated in the
speaker diaphragm. Since the pressure of compressed air is used in the method of manufacturing
a resin plate according to one embodiment, even in the case of a complex-shaped mold, resin film
7 can be uniformly adhered, and the occurrence of defects is reduced. It is possible.
Furthermore, according to the method of manufacturing a resin plate in one embodiment of the
present invention, compressed air can be generated by a simple operation such as reciprocating
motion of the piston 5, and failure of the device hardly occurs and equipment cost can be
suppressed inexpensively. be able to.
As a result, the productivity of the speaker diaphragm can be improved.
[0026]
Furthermore, in the resin plate manufacturing method according to the embodiment of the
present invention, the pressure is applied to the resin film 7 using the piston 5, so that the
pressure applied to the resin film 7 can be controlled stepwise. is there.
That is, if the pressing speed and the pressing position of the piston 5 are adjusted, the pressure
applied to the resin film 7 can be adjusted. Therefore, in the case of a thin material resin film 7 or
the like which is susceptible to breaking of material if pressure is applied rapidly, it can be
formed while being gradually stretched by controlling the applied pressure stepwise. The
occurrence of defects can be suppressed.
11-05-2019
7
[0027]
Moreover, in the manufacturing method of the resin board in one embodiment of this invention,
the 1st metal mold | die 3 is beforehand heated to the temperature more than the glass transition
point of the resin film 7 before a 1st process. As a result, the sheet-like resin film 7 is softened as
the first mold 3 approaches in the second step, and in the third step, the resin film 7 becomes a
temperature higher than the glass transition temperature, thereby forming It becomes possible to
transfer the shape of the mold. Therefore, the productivity of the speaker diaphragm can be
improved.
[0028]
The heating of the first mold 3 is performed by a heater fixed to the back of the first mold 3.
Therefore, in the second and third steps, the temperature of the first mold 3 gradually decreases
because the first mold 3 is separated from the fixed heater. As a result, in the third step, the
temperature of the first mold 3 and the resin film 7 becomes a temperature below the glass
transition point, and the resin film 7 solidifies in a state where the shape of the mold 6 is
transferred. That is, in the method of manufacturing a resin plate according to an embodiment of
the present invention, a resin plate can be manufactured at low cost without the need for a
device for cooling the resin film 7, and a speaker diaphragm is manufactured. It is possible to
improve the quality.
[0029]
Moreover, in the manufacturing method of the resin board in one embodiment of this invention,
the pressure added to the resin film 7 is 0.8 MPa or more. That is, by forming the pressure
applied to the resin film 7 as 0.8 MPa or more, the resin film 7 can be more firmly adhered to the
forming die 6, and even with the forming die 6 having a complicated shape with high accuracy It
is possible to shape. In the method of manufacturing a resin plate in one embodiment of the
present invention, it is possible to apply a pressure of 0.8 MPa or more, as described above, in
the method of manufacturing a resin plate in one embodiment of the present invention This is
because it is possible to apply pressure stepwise.
11-05-2019
8
[0030]
As described above, according to the method of manufacturing a resin plate in one embodiment
of the present invention, the productivity of manufacturing a speaker diaphragm can be
enhanced, and therefore, the method is particularly useful in a method of manufacturing a smallsized speaker diaphragm.
[0031]
Further, according to the method of manufacturing a resin plate in one embodiment of the
present invention, it is possible to provide a speaker diaphragm excellent in quality, and
therefore, it is manufactured by a method of manufacturing a resin plate in one embodiment of
the present invention. It is possible to improve the quality of a speaker using the speaker
diaphragm and an electronic device using the speaker.
[0032]
In addition, since the molding machine used for the manufacturing method of the resin board in
this invention is excellent in cost property and can reduce the cost concerning manufacture of
the diaphragm for speakers, it can contribute to the improvement of the productivity of a
speaker. .
[0033]
According to the resin plate manufacturing method of the present invention, the productivity of
the speaker diaphragm can be improved, and in particular, the speaker diaphragm having a small
and complicated shape or the speaker diaphragm having a deep diaphragm shape. Useful for
production.
[0034]
Sectional view of the molding machine in the first step of the method of manufacturing a resin
plate according to one embodiment of the present invention Sectional view of the molding
machine in the second step Sectional view of the molding machine in the third step Conventional
resin plate Section of mold used for manufacturing method of
Explanation of sign
[0035]
3 first mold 4 second mold 5 piston 6 mold 7 resin film 8 back pressure hole 9 piston hole 10
11-05-2019
9
edge 11 chamber 12 axis 13 compression plate 14 mold contact portion
11-05-2019
10
Документ
Категория
Без категории
Просмотров
0
Размер файла
18 Кб
Теги
jp2008263417
1/--страниц
Пожаловаться на содержимое документа