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JP2014217043

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DESCRIPTION JP2014217043
Abstract: The present invention relates to a bonding structure of a diaphragm of a micro speaker.
The present invention relates to a suspension structure of a diaphragm of a micro speaker,
including a central portion, an outer peripheral portion, a suspension including a connecting
portion connecting the central portion and the outer peripheral portion, and a central portion
and an outer peripheral portion of the suspension. The peripheral portion and the outer
peripheral portion are joined, and the side diaphragm including the dome portion which is
protruded between the inner peripheral portion and the outer peripheral portion is included, and
the suspension and the side diaphragm are joined by thermocompression bonding. , The bonding
structure of the diaphragm of the micro speaker is provided. [Selected figure] Figure 3
Bonding structure of diaphragm of micro speaker
[0001]
The present invention relates to a bonding structure of a diaphragm of a micro speaker.
[0002]
FIG. 1 is a view showing an example of a conventional micro speaker.
A yoke 21, an inner ring magnet 22, an outer ring magnet 23, an inner ring top plate 24 and an
outer ring top plate 25 are provided in the frame 10, and a voice coil 30 is positioned in an air
gap between the inner ring magnet 22 and the outer ring magnet 23. When power is applied to
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the coil 30, it vibrates up and down. The voice coil 30 is provided on the lower surface of the
suspension 40, the side diaphragm 51 and the center diaphragm 52 are provided on the upper
and lower surfaces of the suspension 40, and the vibration of the voice coil 30 generates sound.
A protector 60 is coupled thereon to protect the components located in the speaker. The
protector 60 is formed by injection molding of a ring-shaped steel portion 61 in which an
opening is formed so as to emit sound at the center and the steel portion 61 inserted, and the
frame 10, the outer peripheral portion of the side diaphragm 51, and the suspension 40 And a
ring-shaped injection part 62 stacked on the outer peripheral part.
[0003]
Conventionally, at the time of joining the side diaphragm 51 and the center diaphragm 52 to the
suspension 40, a bond or double-sided tape is used. However, although the bond is excellent in
bondability, there is a problem that the deviation of the thickness of the application part at the
time of application is large, which causes the deterioration of the completed quality due to the
occurrence of the deviation of the laminate thickness of the acoustic transducer. Moreover, the
double-sided tape has a disadvantage that the bonding property is deteriorated although there is
almost no deviation in thickness.
[0004]
An object of the present invention is to provide a bonding structure of a diaphragm and a
suspension of a microspeaker having excellent bonding properties while minimizing thickness
deviation.
[0005]
The present invention is a suspension structure of a diaphragm of a micro speaker, comprising: a
suspension including a central portion, an outer peripheral portion, and a connecting portion
connecting the central portion and the outer peripheral portion; and an inner peripheral portion
at the central portion and the outer peripheral portion of the suspension. And a side diaphragm
including a dome portion joined to the outer periphery and projecting between the inner
periphery and the outer periphery; wherein the suspension and the side diaphragm are joined by
thermocompression bonding. , The bonding structure of the diaphragm of the micro speaker is
provided.
[0006]
Further, as another example of the present invention, there is provided a bonding structure of a
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diaphragm of a micro speaker characterized in that the suspension is made of an FPCB (flexible
printed circuit board).
[0007]
As another example of the present invention, the suspension includes a base film, a conductive
pattern layer formed on both sides of the base film, and a cover layer bonded thereon, and a
cover layer bonded to the side diaphragm Provides a bonding structure of a diaphragm of a
micro speaker characterized in that it is made of any one of PEEK (polyether ether ketone) film
and PEI-F (polyether imide-F type) film.
[0008]
Further, as another example of the present invention, a side diaphragm is formed by bonding two
or more films together, and provides a bonding structure of a diaphragm of a micro speaker.
[0009]
Also, as another example of the present invention, the bonding surface of the side diaphragm is
made of a TPU (thermoplastic polyurethane) film, and the other surface is made of a PEEK film.
provide.
[0010]
Further, as another example of the present invention, the bonding surface of the side diaphragm
is made of TPU film, and the bonding surface of the suspension is made of any one of PEEK film
and PEI-F film. Provided is a bonding structure of a diaphragm.
[0011]
Further, as another example of the present invention, the semiconductor device further includes
a bonding sheet interposed between the side diaphragm and the suspension, and the suspension
and the side diaphragm are joined by thermocompression bonding with the bonding sheet. A
micro-speaker diaphragm bonding structure is provided.
[0012]
Further, as another example of the present invention, a diaphragm of a micro speaker, further
including a center diaphragm joined to a central portion of the suspension, wherein the center
diaphragm and the suspension are joined by thermocompression bonding. Provide a joint
structure of
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[0013]
In addition, as another example of the present invention, it further includes a center diaphragm
joined to the upper surface of the inner periphery of the side diaphragm, and the side diaphragm
and the center diaphragm are joined by thermocompression bonding. , The bonding structure of
the diaphragm of the micro speaker is provided.
[0014]
Further, as another example of the present invention, a voice coil is joined to the lower surface of
the center diaphragm, and is joined to the side diaphragm and the suspension at a distance, and
has a joined structure of a diaphragm of a micro speaker provide.
[0015]
Further, as another example of the present invention, in a bonding structure of a diaphragm of a
micro speaker, a side is provided with an inner peripheral portion, an outer peripheral portion,
and a dome portion projected between the inner peripheral portion and the outer peripheral
portion. A diaphragm of a micro speaker including: a diaphragm; and a center diaphragm joined
to an inner peripheral portion of the side diaphragm, wherein the side diaphragm and the center
diaphragm are joined by thermocompression bonding Provide a joint structure of
[0016]
As another example of the present invention, there is provided a bonding structure of a
diaphragm of a micro speaker characterized in that a side diaphragm is bonded to an upper
surface or a lower surface of a center diaphragm.
[0017]
Also, as another example of the present invention, a voice coil is joined to the lower surface of
the center diaphragm, providing a joined structure of a diaphragm of a micro speaker.
[0018]
As another example of the present invention, the dome portion of the side diaphragm is
characterized by being a reverse dome type protruding downward or a forward dome type
protruding upward. Provided is a bonding structure of a diaphragm of a micro speaker.
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[0019]
The bonding structure of the diaphragm of the microspeaker according to the present invention
can minimize the thickness deviation and improve the bonding property by bonding the
diaphragm by thermocompression bonding.
[0020]
It is a figure which shows an example of the conventional micro speaker.
It is a figure which shows the joining process of the diaphragm of the micro speaker which
concerns on the 1st Example of this invention.
It is a figure which shows the joining process of the diaphragm of the micro speaker which
concerns on the 1st Example of this invention.
It is the figure which schematized the cross section of the bonded structure of the diaphragm of
the micro speaker which concerns on the 1st Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
concerns on the 2nd Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
concerns on the 3rd Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
concerns on the 4th Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
concerns on the 5th Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
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concerns on the 6th Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
concerns on the 7th Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
concerns on the 8th Example of this invention.
It is a figure which shows the joining structure of the diaphragm of the micro speaker which
concerns on the 9th Example of this invention.
[0021]
Hereinafter, preferred embodiments of the present invention will be described in detail with
reference to the drawings.
[0022]
FIGS. 2 and 3 are views showing the bonding process of the diaphragm of the micro speaker
according to the first embodiment of the present invention.
The bonding structure of the diaphragm of the microspeaker according to the first embodiment
of the present invention is a structure in which the suspension 140 and the side diaphragm 150
are bonded.
The suspension 140 is formed of an FPCB, and includes a central portion 142, an outer
peripheral portion 144, and a connecting portion 146 that connects the central portion 142 and
the outer peripheral portion 144.
The side diaphragm 150 is in the form of a ring whose center is perforated in its entirety, and an
inner peripheral portion 152 joined to the central portion 142 of the suspension 140, an outer
peripheral portion 154 joined to the outer peripheral portion 144 of the suspension 140, and A
dome portion 156 is provided protruding between the circumferential portion 152 and the outer
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circumferential portion 154.
The central portion 142 of the suspension 140, the inner circumferential portion 152 of the side
diaphragm 150, the outer circumferential portion 144 of the suspension 140, and the outer
circumferential portion 154 of the side diaphragm 150 are mutually joined by
thermocompression bonding.
[0023]
The first pressure-bonding parts (P1) thermally bond the central portion 142 of the suspension
140 and the inner peripheral portion 152 of the side diaphragm 150, which are heat-bonded to
each other by the thermal pressure-bonding press (P). And a second crimping part (P2) for
thermocompression bonding the outer peripheral part 144 of the suspension 140 and the outer
peripheral part 154 of the side diaphragm 150.
[0024]
FIG. 4 is a schematic diagram of a cross section of the bonding structure of the diaphragms of the
microspeaker according to the first embodiment of the present invention.
The suspension 140 includes a base film 140a, conductive pattern layers 140b and 140c formed
on both sides of the base film, and cover layers 140d and 140e bonded thereon.
The side diaphragm 150 is preferably made of a low rigidity TPU film so as to improve low-pass
characteristics.
At this time, of the both surfaces of the suspension 140, the cover layer 140d of the surface to be
bonded to the side diaphragm 150 is one of PEEK film and PEI-F film having excellent bonding
strength after thermocompression bonding with the TPU film. Preferably consisting of
[0025]
FIG. 5 is a view showing a bonding structure of a diaphragm of a micro speaker according to a
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second embodiment of the present invention. In the bonding structure of the diaphragm of the
microspeaker according to the second embodiment of the present invention, the side diaphragm
250 is formed by bonding two films together. The first film 251 to be joined to the suspension
240 is made of a material that is easy to thermocompression bond to the suspension 240, and
the second film 252 to be joined to the first film 251 is easy to thermocompression bond to the
first film 251 It is made of material. At this time, it is preferable that any one of the first film 251
and the second film 252 be a material with low rigidity in order to strengthen low-pass
characteristics.
[0026]
As an example, the first film 251 is made of a low rigidity TPU film, and the second film 252 is
made of a PEEK film or a PEI-F film having excellent bonding strength after thermocompression
bonding with the TPU film. Is preferred. If the first film 251 is made of TPU film, the suspension
240 is also preferably made of PEEK film or PEI-F film for bonding strength.
[0027]
FIG. 6 is a view showing a bonding structure of a diaphragm of a micro speaker according to a
third embodiment of the present invention. The bonding structure of the diaphragm of the micro
speaker according to the third embodiment of the present invention further includes the bonding
sheet 360 between the bonding surface of the suspension 340 and the side diaphragm 350.
Thereafter, the suspension 340 and the side diaphragm 350 can be joined by the bonding sheet
360 by thermocompression bonding using the thermocompression bonding press (P; see FIG. 2)
of the first embodiment. When the bonding sheet 360 is separately interposed for the
thermocompression bonding, there is an advantage that the range of material selection of the
suspension 340 and the side diaphragm 350 becomes wider.
[0028]
FIG. 7 is a view showing a bonding structure of a diaphragm of a micro speaker according to a
fourth embodiment of the present invention. The bonding structure of the diaphragm of the
microspeaker according to the fourth embodiment of the present invention is characterized in
that the side diaphragm 450 and the center diaphragm 458 are all bonded to the suspension
440. Similar to the first embodiment, the suspension 440 includes a central portion 442, an
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outer peripheral portion 444, and a connecting portion 446, and the inner peripheral portion
452 of the side diaphragm 450 is thermocompression-bonded to the central portion 442 of the
suspension 440, and side vibration is generated. The outer periphery 454 of the plate 450 is
thermocompression-bonded to the outer periphery 444 of the suspension 440. At this time, the
side diaphragm 450 is joined to the lower surface of the suspension 440.
[0029]
The center diaphragm 458 is joined to the central portion 442 of the suspension 440 and is
thermocompression-bonded similarly to the side diaphragm 450. At this time, the center
diaphragm 458 is joined to the upper surface of the suspension 440.
[0030]
The voice coil 430 is joined to the lower surface of the suspension 440, and is joined to the
joining position of the side diaphragm 450 at a predetermined distance.
[0031]
In the fourth embodiment, the bonding surfaces of the side diaphragm 450 and the center
diaphragm 458 are different from each other, that is, the center diaphragm 458 is bonded to the
lower surface of the suspension 440, and the side diaphragm 450 is mounted on the upper
surface of the suspension 440. A form in which the two are joined is also feasible.
[0032]
FIG. 8 is a view showing a bonding structure of a diaphragm of a micro speaker according to a
fifth embodiment of the present invention.
The shape of each part is the same as that of the fourth embodiment of the present invention, but
the bonding position between the side diaphragm 450 'and the center diaphragm 458' is
different from that of the fourth embodiment.
In the bonding structure of the diaphragms of the microspeaker according to the fifth
embodiment of the present invention, the side diaphragm 450 'is first laminated on the upper
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surface of the suspension 440, and the center diaphragm 458' is laminated on the top thereof. It
is thermocompression-bonded. As a result, the side diaphragm 450 'and the suspension 440, the
side diaphragm 450' and the center diaphragm 458 'are thermocompression-bonded to each
other.
[0033]
Of course, the center diaphragm 458 'may be stacked on the suspension 440 by changing the
stacking order, and then the side diaphragm 450' may be stacked and thermocompression
bonded.
[0034]
After the three layers of the suspension 440, the side diaphragm 450 'and the center diaphragm
458' are thermocompression-bonded together, the voice coil 430 is joined to the lower surface of
the suspension 440.
[0035]
FIG. 9 is a view showing a bonding structure of a diaphragm of a micro speaker according to a
sixth embodiment of the present invention.
The thermocompression bonding method is the same as that of the fifth embodiment of the
present invention, but the bonding position of the voice coil 430 is different from that of the fifth
embodiment.
The side diaphragm 550 and the center diaphragm 558 are stacked on the upper surface of the
suspension 540, and the three layers are thermocompression-bonded together. However, the
voice coil 530 is joined not to the lower surface of the suspension 540 but to the lower surface of
the center diaphragm 558. The voice coil 530 is joined to the lower surface of the center
diaphragm 558 at a predetermined distance from the side diaphragm 550 and the inner
circumferential portion 542 of the suspension 540.
[0036]
Unlike the example shown in FIG. 9, the center diaphragm 558 is first laminated on the upper
surface of the suspension 540, the side diaphragm 550 is laminated thereon, and after
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thermocompression bonding, the voice coil is formed on the lower surface of the center
diaphragm 558. 530 can also be joined.
[0037]
FIG. 10 is a view showing a bonding structure of a diaphragm of a micro speaker according to a
seventh embodiment of the present invention.
A side diaphragm 650 having a central hole and having an inner periphery 652, an outer
periphery 654, and a dome 656 projecting between the inner periphery 652 and the outer
periphery 654, and an inner periphery 652 of the side diaphragm 650. The side diaphragm 650
and the center diaphragm 658 are joined by thermo compression bonding. The side diaphragm
650 is joined to the upper surface of the center diaphragm 658, and the voice coil 630 is joined
to the lower surface of the center diaphragm 658. However, the bonding position of the side
diaphragm 650 and the bonding position of the voice coil 630 have a predetermined distance so
as not to overlap each other.
[0038]
FIG. 11 is a view showing a bonding structure of a diaphragm of a micro speaker according to an
eighth embodiment of the present invention. A side diaphragm 650 'having a central hole and
having an inner periphery 652', an outer periphery 654 ', and a dome portion 656' projecting
between the inner periphery 652 'and the outer periphery 654', and a side diaphragm The center
diaphragm 658 'is joined to the inner circumferential portion 652' of the 650 ', and the side
diaphragm 650' and the center diaphragm 658 'are joined by thermocompression bonding. The
side diaphragm 650 'and the voice coil 630 are all joined to the lower surface of the center
diaphragm 658', but the joining position of the side diaphragm 650 'and the joining position of
the voice coil 630 are predetermined so that they do not overlap each other. Bonded at intervals.
[0039]
FIG. 12 is a view showing a bonding structure of a diaphragm of a micro speaker according to a
ninth embodiment of the present invention. A side diaphragm 750 having a central hole and
having an inner periphery 752, an outer periphery 754, and a dome 756 projecting between the
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inner periphery 752 and the outer periphery 754, and an inner periphery 752 of the side
diaphragm 750. The side diaphragm 750 and the center diaphragm 758 are joined by
thermocompression bonding. At this time, unlike the seventh and eighth embodiments, the dome
portion 756 is a reverse dome type that protrudes downward. The side diaphragm 750 and the
center diaphragm 758 are joined to the upper surface of the center diaphragm 758 as shown in
FIG. 12, but may be joined to the lower surface of the center diaphragm 758. Further, the voice
coil 730 is joined to the lower surface of the center diaphragm 758, and the voice coil 730 has a
predetermined distance from the inner circumferential portion 752 of the side diaphragm 750,
and the inner periphery 752 of the side diaphragm 750. Bonded so as not to overlap.
[0040]
140, 240, 340, 440, 540 Suspension 140a Base film 140b, 140c Conductive pattern layer 140d,
140e Cover layer 142, 442 Central part 144, 444 Outer peripheral part 146, 446 Connecting
part P Thermo-compression bonding P1 First crimping part P2 second crimping portion 150,
250, 350, 450, 450 ', 550, 650 side diaphragm 360 bonding sheet 458, 458', 558, 658, 658 ',
758 center diaphragm 530 voice coil 652, 652', 752 Inner circumference 654, 654 ', 754 Outer
circumference 656, 656', 756 dome
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