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JPH0414301

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DESCRIPTION JPH0414301
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
dielectric resonance apparatus used for a dielectric resonance electrostatic sensor or the like. 2.
Description of the Related Art In recent years, video disk devices of the VHD system or the like
for detecting information recorded on an information medium as a change in capacitance have
become widespread. In a signal pickup device used in this device, a dielectric resonator having a
large Q as a resonator is used in place of a coaxial resonator using a strip line. The use of
dielectric resonators has the advantage that the pickup device can be configured simply and in a
small size. [Problems to be solved by the invention] However, a very narrow space is required for
use in small video disk devices and similar devices. In order to meet the requirements for such
usage, it is necessary to further miniaturize the electrostatic sensor, and for this purpose, the
case, the circuit board and the dielectric resonator are required. It is necessary to further
miniaturize the dielectric resonance device comprising In order to miniaturize this dielectric
resonance device, first, the length of the dielectric resonator may be shortened, but then the
resonance frequency becomes very high, and a transistor etc. connected to the dielectric
resonator The influence of the impedance with the peripheral circuits and the floating distributed
capacitance, etc. become large, and this also has a limit. In addition, if the cross-sectional area of
the dielectric resonator is reduced, Q is lowered, which causes a problem that the frequency
characteristic is deteriorated. Furthermore, if the dielectric constant of the dielectric resonator is
increased, the length of the dielectric resonator can be shortened and the device can be
miniaturized, but this also has limitations in terms of materials. From such various limitations, the
minimum dimension of the dielectric resonator has been considered to be a limit of 4 mo square.
The present inventor repeated trial manufacture and experiment, and while promoting the
miniaturization of the dielectric resonator, the dielectric resonator is disposed on the ground
plane of the circuit board, and the dielectric resonator is opposed to the ground plane. By
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connecting the plane of to the ground potential, it was possible to prevent the decrease in Q. The
present invention was made in view of this point, and an object of the present invention is to
provide a dielectric resonance device capable of miniaturizing a dielectric resonator. [Means for
Solving the Problems] In order to achieve the above object, the present invention is configured as
follows. That is, the present invention relates to a dielectric resonator device in which a dielectric
resonator is mounted on a ground mounting surface of a conductor formed on a surface of a
circuit board by soldering its bottom side. It is characterized in that at least one point of the
plane is conductively connected to the ground potential point by the conduction means.
[Operation] In the present invention, the dielectric resonator is connected and fixed to the upper
side of the ground mounting surface formed on the surface of the circuit board by soldering, and
the lead wire and the conductor plate are connected to the plane of the dielectric resonator. By
connecting the plane to the ground, Q can be improved, and even when the dielectric resonator is
miniaturized, deterioration of the characteristics of the dielectric resonator can be prevented.
[Principle of the Present Invention] The principle of the dielectric resonator according to the
present invention will be described with reference to FIG. A ground mounting pattern 7 and an
output conductor pattern 8 are formed on the insulating substrate 15 by a conductor such as
copper. On the ground mounting pattern 7, a rectangular dielectric resonator 9 is fixed by
soldering its bottom surface 16 with a solder paste. In the dielectric resonator 9, as is known, the
flat surface, the bottom and the side of the rectangular dielectric sintered body are coated with a
good conductive metal 17, for example, gold, silver, copper or the like, and penetrate from the
front to the back A hole 18 is provided, and the electrode 10 is inserted into and fixed to the
through hole 18 from the front. When the resonator 9 resonates in the ? / 4 mode of the
wavelength ?, the above-described well-conductive metal layer is provided also on the back
surface, and when resonating in the ? / 2 mode, the well-conductive metal layer is not provided.
In the resonance device of the present invention, one end of the auxiliary electrode 19 is
connected to the flat surface 14 of the dielectric resonator 9 by soldering in the above-described
configuration, and the other end of the auxiliary electrode 19 is soldered to the ground mounting
pattern 7. The output electrode 10 is soldered to the output conductor pattern 8. In the above
configuration, when considered as a resonator having a frequency of about 1 to 3 GHz, the plane
14 of the dielectric resonator 9 does not have the same potential as the ground mounting pattern
7 which is the reference potential. This is because the dielectric constant of the dielectric alone is
extremely high relative to the dielectric constant of air of 70 to 90, and there is unevenness on
the sintered surface of the dielectric alone, and an impedance circuit for high frequency current
is formed. Conceivable. In the present invention, the auxiliary electrode 19 is provided to form a
short circuit to the pattern 7 which is the ground potential surface, and the potential of the plane
14 of the resonator 9 is brought close to the ground potential to reduce impedance as a result.
Improve the Q of the vessel. A development of this idea is that the bottom surface 16 of the
resonator 9 is in contact with the ground potential with a certain length from the front to the
back of the resonator, and the auxiliary electrode 19 in the plane 14 is not point connection but
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from the front to the above It can be considered that the Q of the resonator 9 becomes higher by
bringing a provisional having a width longer than the length into contact with the plane 14 of the
resonator 9 and using it as an auxiliary electrode.
Embodiments of the present invention will be described below with reference to the drawings. 1
and 2 show a first embodiment of a dielectric resonator according to the present invention. In
these drawings, a ground mounting surface 7 and an output conductor pattern 8 are formed on
the upper surface side of the printed board 6 functioning as a circuit board in a state of being
separated and insulated from each other by a conductor such as copper foil. An appropriate
number of ground lead patterns 12 for connecting the surface 7 to the ground are branched on
the ground mounting surface 7. A ceramic resonator 9 as a dielectric resonator is mounted on
the ground mounting surface 7 and fixed by solder connection. At the time of this soldering, for
example, a solder paste is provided in advance on the bottom surface side of the ceramic
resonator 9, and the bottom surface of the ceramic resonator 9 is placed on the ground mounting
surface 7 and heated with a soldering iron or heated air is blown. In some cases, the solder
connection is achieved. In the mounted state of the ceramic resonator 9, the electrode 10 of the
output terminal of the ceramic resonator 9 is connected to the output conductor pattern 8 using
a solder or the like. The printed circuit board 6 on which the ceramic resonator 9 is mounted is
fixed to the conductor case 11 made of a metal plate such as copper. In this fixed state, the
ground mounting surface 7 uses the ground lead pattern 12 to make the conductor case 11 It is
connected by soldering at more than one point. The connection location (the number of ground
lead patterns) between the ground mounting surface 7 and the conductor case 11 is
appropriately determined by the resonance frequency of the ceramic resonator 9, and when the
resonance frequency is large, the number of connection locations is increased. In the present
embodiment, the resonance frequency is set to 7 GHz to 3 GHz, and in this case, it is preferable to
configure connection at at least three or more points. The conductor case 11 is connected to the
chassis ground to be a ground as a reference potential, and is fixed to the side surface of the
conductor case 11 by the base end side of the auxiliary electrode 13 formed of a plate of
conductor metal or by solder connection The tip end of the auxiliary electrode 3 extends to the
plane 14 of the ceramic resonator 9 and is connected to the plane 14 by soldering. That is, the
plane 14 of the ceramic resonator 9 is connected to the ground through the auxiliary electrode
13. According to the present embodiment configured as described above, the bottom side of the
ceramic resonator 9 is connected and fixed on the ground mounting surface 7, and the plane 14
side is conductively connected to the ground by the auxiliary electrode 13. , And Q of the ceramic
resonator 9 can be greatly improved.
In this embodiment, although the ceramic resonator 9 is miniaturized to a size of 3 mm square
far beyond the conventionally limited size, the conventional mounting method, ie, the flat surface
of the ceramic resonator 9 is used as a ground. Q is improved by 30% or more and overall
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characteristics are improved by 50% or more compared to the mounting method in which
conductive connection is not performed. As a result, it was possible to obtain the same
characteristics as in the case where a 5 mm square ceramic resonator is mounted by the
conventional mounting method, and it was possible to achieve the miniaturization of the ceramic
resonator without causing any deterioration in the characteristics. . FIG. 3 shows the main
configuration of a second embodiment of the dielectric resonator according to the present
invention. The difference between the second embodiment and the first embodiment is that the
flat surface 14 of the ceramic resonator 9 is connected to the ground by a lead 'i19. The other
configuration is the first embodiment. Is the same as Also in the second embodiment, by
connecting the plane 14 to the ground, a significant improvement in Q is achieved, and as in the
first embodiment, a microminiature ceramic is obtained without causing any deterioration in the
characteristics. It was possible to create a resonant device. The present invention is not limited to
the above embodiments, and various embodiments can be adopted. For example, in each of the
above embodiments, a printed circuit board is used as a circuit board, but a multilayer board may
be used instead of the printed circuit board. In the second embodiment, the flat surface 14 of the
ceramic resonator 9 is connected to the ground mounting surface 7 using a lead wire, but the flat
surface 14 may be connected to any of the grounds (for example, You may connect to the
conductor case 11 side. According to the present invention, since the dielectric resonator is
mounted on the ground mounting surface and the plane of the dielectric resonator is
conductively connected to the ground, the Q of the dielectric resonator is greatly improved. Even
if the dielectric resonator is miniaturized, which has never been considered in the prior art, the
characteristics are not significantly degraded. From this, it becomes possible to provide a highly
sensitive ultra-compact dielectric resonator device, and with this, it becomes possible to
miniaturize various devices using the dielectric resonator device of the present invention. In
addition, the miniaturization of the device can reduce the weight of the device, and the handling
of the device becomes very easy. Furthermore, since the improvement of Q can be achieved with
a simple configuration in which the flat surface of the dielectric resonator is connected to the
ground, the dielectric resonance device of the present invention having excellent performance
can be easily manufactured and made inexpensive. It becomes possible to offer.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is a longitudinal sectional view showing a first embodiment of a dielectric resonator
according to the present invention, FIG. 2 is a perspective view showing the main part of the
same embodiment, and FIG. 3 is a dielectric resonance according to the present invention. It is a
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principal part perspective view which shows the 2nd Example of an apparatus.
6 ... printed circuit board, 7 ... ground mounting surface (ground mounting pattern), 8 ... output
conductor pattern, 9 ... dielectric resonator, 10 ... electrode, 11 ... conductive integral case , 12:
ground lead pattern, 13: auxiliary electrode, 14: flat surface, 15: insulating substrate, 1G: bottom
surface, 17: good conductive metal, 18: through hole, 19 иии Auxiliary electrode (lead wire). Fu
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