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FIELD OF THE INVENTION The present invention relates to a frusto-conical or dome-shaped
foam resin diaphragm used for a speaker. 2. Description of the Related Art Conventionally, this
type of speaker diaphragm is easy to form by heating and pressing, is lightweight, and as a
diaphragm, it has both a suitable internal loss and rigidity, as disclosed in Japanese Patent
Publication Sho 63-13633. U.S. Pat. No. 5,015,015, which is said to consist of a foam of a
copolymer of styrene and maleic anhydride. Therefore, in the conventional diaphragm for this
type of speaker, the thermal contraction rate is rapidly increased from about 98 ° C., and there
is a property that up to about 110 ° C. is the heat resistance limit. there were. Recently, further
heat resistance has been required for automobiles, outdoors, large inputs, etc., and there is a
problem that heat resistance is insufficient in practical use. Then, in order to solve the subject
which such a conventional foamed resin diaphragm had, this invention tends to provide the
diaphragm for loudspeakers made of foamed resin whose heat | fever deformation temperature
is high. [Means for Solving the Problems] To explain the constitution of the present invention for
achieving the object, the present invention provides a loudspeaker diaphragm formed by foaming
and molding a synthetic resin, comprising a mixture of polyphenylene oxide and polystyrene. It is
a diaphragm for a speaker having a configuration in which a foam film or a foam sheet formed
by extrusion molding is formed into a diaphragm shape. Thus, the speaker diaphragm of the
present invention can be a diaphragm formed by using a film or sheet of a foamed resin obtained
by extruding a novel mixture of polyphenylene oxide and polystyrene excellent in heat
resistance. . As a result, heat resistance up to about 125 ° C. can be obtained, and it is
lightweight even in a high temperature environment which can not be put into practical use with
conventional foam resin diaphragms, and has appropriate internal loss and rigidity. It can be
used as a foamed resin diaphragm. EXAMPLES Examples of the present invention will be
described below. In the present invention, a foamed resin sheet having a bulk specific gravity of
0.1 and a thickness of 1.5 mm obtained by adding and mixing a foaming agent to a mixture of
polyphenylene oxide and polystyrene is extruded at a temperature of about 125 ° C to 135 °
C. It is a diaphragm for a speaker formed by heating with an infrared heater and clamping for
about 5 seconds with a conical or dome-shaped mold at about 30 to 50 ° C. for molding. As a
means for forming the sheet or film in a foamed state into a diaphragm shape, a known pressure
forming method may be applied other than the above-mentioned mold.
Although the embodiments considered to be representative of the present invention have been
described above, the present invention is not necessarily limited to only the structure of these
embodiments, and includes the above-described components according to the present invention,
and the present invention In order to achieve the purpose mentioned above, the present
invention can be suitably modified and implemented within the range having the effects
mentioned below. As is apparent from the above description, according to the present invention,
a foam film or a foam sheet formed by extruding a mixture of polyphenylene oxide and
polystyrene is formed into a diaphragm shape. Because of this, in terms of heat resistance, as
described below with reference to FIG. 1, it has a remarkable effect that can not be expected from
the conventional one. According to FIG. 1 showing the results of the experimental example, the
figure shows that the diaphragm is left for about 24 hours after leaving it in the temperature
chamber for 96 hours at each temperature in order to observe the dimensional change due to the
temperature. It is the result of measuring contraction rate. In FIG. 1, the solid line is a graph of
the shrinkage rate with respect to temperature, and the dotted line is a graph of the contraction
rate with respect to temperature of the diaphragm of the embodiment of the present invention.
According to this result, the heat shrinkage rate rapidly increases from 98 ° C. in the
conventional example, and the heat resistance limit is up to about 110 ° C. However, the heat
shrinkage rate is small in at least 120 ° C. in the present embodiment. Since the heat resistance
limit temperature also exceeds 130 ° C., it is clear that the heat resistance of the speaker
diaphragm of the configuration of the present invention is superior to that of the conventional
example, and in the high temperature environment such as for automobiles and outdoors It is
possible to obtain a reliable speaker not seen.
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