вход по аккаунту



код для вставкиСкачать
Patent Translate
Powered by EPO and Google
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
■ Method of manufacturing electret materials O Patent application No. 45-598460 Application
No. 45 (1970) July 10 @ inventor Kamoki Komei Kawasaki city Kokumu Toshiba Town 1 Tokyo
Shibaura Electric Co., Ltd. R & D Labs. @ Applicant Tokyo Shibaura Electric Co., Ltd. Kawasaki
Ward, Kawasaki-ku Horikawacho, 72
[phase] Attorney attorney Tomioka 3 outside
BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 and 2 are cross-sectional views showing
different structural examples of electret materials manufactured by the manufacturing method
according to the present invention, and FIG. 3 is an example of electretization processing of
electret materials according to the present invention. FIG.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of
manufacturing a icklet material mainly composed of a highly insulating solid compound, and
more particularly to a method of manufacturing an electret material exhibiting a large nipple
voltage. As well known, the same as the magnet has permanent magnetism, an insulating
material having electric polarization permanently is called electret. As highly insulating materials
suitable for such electret materials, carnauba wax, beeswax, rosins, or mixtures of these suitable
amounts have long been known and are pure high. Grade alcohols and esters also have such
properties. Recently, it has also been announced that polymers such as polyamide,
polycarbonate, polymethacrylic acid resin, polypropylene, poly (vinyl chloride) and the like
exhibit electret property, and a microphone. Commercialization has been actively carried out for
audio equipment such as [111111] The use of electret materials is a fool that has recently been
set out for the above-mentioned audio equipment and the like, but since it has many
characteristic properties, it has the potential to be used in various fields in the future. The
essential substance required of the 1000-ctret substance in the present availability range is how
to obtain a large electret voltage and to maintain the electret voltage retention rate, ie, prolong
the life. It can be said. The magnitude of the electret voltage is a direct cause of the gain gain as
well as facilitating the device design, and the increase in retention of the electret voltage is
important for the service life of the device. Thus, at least these two improvements greatly expand
the application of the sherett material. For this purpose, attempts have been made to increase the
surface area of the electret material molding or to reduce the thickness of the molding, but this
may lead to an increase in the size of the device, or the generation of pinholes. It has the
disadvantage of losing the function or features of the electret material. The inventors of the
present invention have dealt with such a point and proceeded with research, and as a result, a Fe
* Co or Ni-based metal layer is coated on the surface of a highly insulating material formed in the
form of a film or sheet or film or rod. It has been found that, when the film formation is
performed and the direct current is applied, the electret voltage and the life thereof are
remarkably improved without any deterioration in the physical properties of the high insulation
material. Based on these findings, the present invention is intended to provide a method capable
of easily obtaining a ructret material which has a large gap, a high electret voltage, a long life, a
small size and a small weight, and is suitable for use in the electronics field and the like. It is.
The electret material of the present invention is at least two selected from the group consisting of
KFe * Co * Nt * Mn * Si * Cu and Mo on at least one side of a highly insulating material such as a
film or sheet. However, it is characterized in that a metal layer consisting of Fe, Co, or Ni is
always deposited in one layer [111111] EndPage: 1 minute), and a DC voltage is applied to this
for processing. Generally, it can be easily configured as follows. For example, a highly insulating
material formed into a sheet or tape or film is first prepared. Then, using the highly insulating
material as a deposition target substrate, a desired electret material can be obtained by
depositing a metal layer such as Fe-Ni on one or both surfaces of the deposition target substrate
by a deposition method. 1 and 2 show the constitution of the electret material thus constructed,
1 is a highly insulating material, 2 is Fe--Ni etc. integrally deposited on the surface of the highly
insulating material 1 Shown is a metal layer. Although an example in which the metal layer is
deposited and formed by vapor deposition has been described above, the metal layer may be
deposited and formed by other means such as electroless plating, as a matter of course.
Generally, a thickness of about 2 to 100 μ is sufficient. After depositing the required metal layer
in this way, a capacitor is formed with two metal electrodes including the above metal layer
sandwiching the material, for example, in a sand-in shape, and a positive or negative electrode is
formed between the two electrodes. Apply a DC voltage. In this case, the applied atmosphere may
be air or gas, and it is usually performed in a heated state. Therefore, if the magnitude of the
applied voltage, the length of the applied time, the cooling rate, etc. are appropriately selected
according to the type of the high insulating material, electret voltage is induced in the high
insulating material. Finally, the desired electret material is obtained. In the present invention, as a
highly insulating compound mainly forming an electret material, for example, vinyl chloride
resin, vinylidene chloride resin, polyester, vinyl chloride-vinyl acetate copolymer, polystyrene,
polyethylene, polypropylene, fluorine resin, acrylic resin, methacrylic resin , Acetal resin,
polyvinylidene fluoride, polyimide, polyethylene terephthalate, polycarbonate, chlorinated
polyether, polyvinylcarbazole, nitrocellulose, acetylcellulose, cellulose, polyamide, allyl resin,
epoxy resin, melamine resin, phenol resin, furan resin, alkyd resin , Waxes, pine wax, organic
compounds such as higher alcohols or esters, inorganic compounds such as quartz, Rochelle salt,
ceramics, ferrites l111111 may either if those capable of forming other like these modified
compounds sheet or film form.
In particular, polyethylene, polystyrene, polypropylene, acrylonitrile-chlorinated polyethylenestyrene, polycarbonate, tetrafluoroethylene resin, copolymer of tetrafluoroethylene and
propylene hexafluoride, etc. can be thinly formed, from the viewpoint of processability, etc. Is
also preferred. On the other hand, the metal layer integrally formed on the surface of the above
sheet-like or tape-like or film-like high-insulation material is, for example, Fe-Ni * Ni-Mo * Ni-Cu *
Ni-Mo-Mn-Mee-Fe-Fe-Ni- Mo-Cu * Ni-Fe-MoeNi-Fe-8i * N1-Fe-CutFe-8i * Fe-Mn. Fe-Co-V * Ni-FeMn etc. are mentioned. Therefore, one metal selected from the group consisting of FeeNi and Co
as a metal layer to be deposited on the surface of the high insulating material is an essential
component, and two or more of these, or at least one of these and Mn * Unless it takes such a
combination to form with at least one selected from the group consisting of Si and Mo, the
desired effect, that is, increase the electret voltage-preferably prolongs its life It has been
experimentally confirmed that it can not be attempted to maintain, and in any case, it is
preferable to select 30 to 90% by weight, preferably 40 to 80% by weight, of essential
components such as FeeCo * Nt. Good. In this manner, at least one surface of the polymer
material formed into a tape or sheet or film is Fe. A metal layer, such as Fe-Ni * Fi-8i * Mo-Ni or
Fe-Ni-Mo, containing Co or Ni as at least one component is integrally deposited, and a direct
current is applied for processing. Generally, the electret voltage of the electret material is
improved by about 20 to 50% as compared to the electret voltage induced in the highly
insulating material as the substrate. Moreover, depending on the choice of the metal layer, the
life of the electret can be increased along with the improvement of the electret voltage, and good
performance can always be exhibited. Therefore, the electret characteristic of the high insulating
material is improved and improved by such a configuration, for example, because Fe is not
effective when such a layer is formed by depositing only a layer of only Fe or a layer of only Ni. It
is considered that at least one of CcsNi and the like is an essential component, and an alloy of
these alloys, or a complex of at least one of these and MneSi and the like is influenced by the
ferromagnetism of the metal layer by binary conversion. Thus, the electret material according to
the present invention can be said to be suitable for use as an electric component such as an
acoustic element in combination with its good processability, easy small size and light weight,
and the like.
Examples of the invention will now be described. Example 1 Polystyrene film, polypropylene film,
polyvinylidene fluoride film, copolymer of tetrafluoroethylene and hexafluoropropylene (FEP),
polyvinyl chloride film and polyethylene terephthalate film having a thickness of about 20 μ
without pinholes I prepared each. As evaporation sources, Fe-Ni alloy (Fe 55% * N 145%), Ni-Mo
alloy (Ni 78.5%, Mo 21.5%), Ni-Fe-Mo-Mn alloy (Ni 79%, Fe 15.5%, Mo5 %, Mn 0.5% Ni-Fe-Cu-Mo
alloy (Ni 75% * Fe 10%). CulO%, Mo5% χNi-8i-Fe alloy (Ni 43% Si 3%, Fe 5.4%) and At were
prepared. Then io-! On both sides of each film above. Vacuum evaporation was carried out using
the above-mentioned alloy under high altitude of 5 Hg as an evaporation source, and a metal film
of 2 μm to 5 μm in thickness was integrally deposited. After that, heating is performed at a
temperature rising rate of 5 ° C. for 1 minute in a state where a predetermined DC voltage is
applied to the metal film surface formed by deposition, and kept at each constant temperature
(electretization temperature) for 20 minutes. The temperature was lowered at a rate of about 10
° C. for 1 minute, cooled to room temperature, and an applied voltage was removed to obtain a
sieve elect material. The electret voltage and the electret voltage respectively measured by an
ordinary method under an atmosphere of 23 ° C. and a relative humidity of 55 to 58% are
required for the respective electret materials thus manufactured to drop to a retention of 75% in
the indoor environment. The following table shows the results of lifetime estimation based on the
life measurement results at 50 ° C., 60 ° C. and 70 ° C. by the Siarenius method. As a
reference example, the above-mentioned deposited metal is selected as At, and the samples
measured under the same conditions are also shown in the table. In either case, however, the
measured values have slight variations, so they were repeatedly calculated as an average of 10
numbers. [111111 EndPage: 3 Ni-Fe * Ni-M as apparent from the above example. In the case
where a metal layer such as is deposited, as compared with the case where only At is deposited,
the voltage and life time of the electret are significantly improved. Similar good results were
obtained for ceramic compounds such as BaTi0a * Ba (Ti-8n) 03 and inorganic compounds such
as ferrite materials such as MnZn instead of the above-mentioned high insulating organic
polymer material. EXAMPLE 2 Fe (63%)-Ni (37%) was deposited on one side of a polypropylene
film about 8 microns thick to deposit an alloy 2-3 microns thick.
The polymer material thus obtained was cut into pieces of 30 × 4011 L1 JL, and thin lead wires
were electrically connected to the alloy layer of each of the cut pieces. After that, these five
pieces were put on top of each other so as to make the alloy layers alternate, and light pressure
bonding was carried out at 80 to 90 ° C. FIG. 3 shows the pressure-bonded ones in cross
section, in which 1 indicates a polypropylene film layer, 2 indicates an alloy layer, and 3 indicates
a lead. On the other hand, the same alloy layer as described above was similarly deposited and
formed on the surface (shown in FIG. 4 ') of the pressure-bonded one but not provided with the
alloy layer, and the lead wire 3 was connected to constitute a type of capacitor. In this manner,
electretization treatment is performed at a high electric field of 4,000 volts under a temperature
of 100 ° C. as in Example 1 with the connection L (shown by a dotted line in FIG. 3) so that the
[111111] polypropylene film layers are in parallel. As a result, it was confirmed that a much
larger electret voltage was induced along with a longer life as compared with the case where the
At layer was provided instead of the above-mentioned alloy layer, and the electret voltage was 2
to 10 times at 200-1160 V. . In the above, when using a 1 mil thick polyethylene terephthalate
film, polytetrafluoroethylene film (TFE) i- and FEP fluorocarbon film (trade name of DuPont) as a
substitute for polypropylene film, electret 'clay It is about 3 to 6 times (compared to the case
where the At layer is provided), and the time to reach 75% retention at room temperature was 4
to 5 years.
Без категории
Размер файла
15 Кб
Пожаловаться на содержимое документа