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Specification Cao 1, Title of the Invention]
Piezoelectric transducer component module
3. Detailed Description of the Invention The present invention generally describes a vibration
substrate, and a piezoelectric or ceramic element coupled to the substrate that generates an
audible signal when properly driven by an electronic circuit. With regard to piezoelectric
transducer components of the type including, and more particularly, separate packages of
components that can be readily coupled to microcircuits in which the circuitry necessary to drive
the printed circuit board and transducer components is integrated. About. Briefly stated, the
components of the piezoelectric transducer module of the present invention comprise an
apparatus for the housing of the transducer component and an electrical component and module
on a substrate including a dynamic circuit to place the component in the housing. And a device
for mechanically coupling and, if necessary, a device for providing an acoustical enhancement of
the audio signal generated by the piezoelectric transducer component. As described in U.S. Pat.
No. 8,879,726, piezoelectric transducer components that generate audio signals conventionally
print incorporating electronic circuitry to energize the transducer components in a single module
Both included the circuit board. However, in many applications where a piezoelectric transducer
component is used to emit an audible signal or W signal, the electronics and physics used to
energize the transducer component are used. Separation is desirable and often economical.
Separating the transducer component from its drive circuitry is particularly beneficial and
desirable when incorporating the electronic drive circuitry with other electronic circuitry into an
integrated circuit or into a Relint board. According to U.S. Patent No. 8,785,214? As disclosed in
the prior art, various devices have been developed to carry circuit elements incorporated into
printed circuit boards or integrated circuits. However, these prior art modules are made for
typical circuit elements, ie inductive elements, resistors etc., and do not provide an audible
output, nor do they need special equipment to enable operations related to their operation. do
not do. Various housing arrangements of piezoelectric crystals which act as resonators or band
filters are conventionally disclosed in U.S. Pat. Nos. 8,078,975 and 8,981,888. However, the
primary purpose of these conventional housing devices was to protect the piezoelectric crystal
from external conditions such as humidity, temperature, imaging, and balance, thereby improving
the stability and reliability of the crystal. Thus, as mentioned above, there is no housing device
for piezoelectric transducer components that generates audio signals that can be conventionally
used for embedded circuits.
Therefore, the first object of the present invention is to provide a device for mechanically
attaching individual modules to a built-in circuit, a device for acoustically enhancing an audible
signal generated by a transducer, and a piezoelectric transducer on a single-lint board. A device
electrically coupled to the electronic drive circuit integrated with the other microcircuits, and a
suitable electronic drive circuit which can be integrated with the other electronic circuits in a
separate 79-pin caged piezoelectric deformation cage And flexible equipment that can be used. In
accordance with the present invention, a piezoelectric transducer component of a module is
provided which generates an audible signal which can be used in integrated circuits / types of
embedded circuits which may be included in a package or a seven-lint circuit board assembly.
Thus, the object of the present invention is a related electronic drive. Another object of the
present invention is to provide a piezoelectric transducer component for supplying an audio
signal, which is adaptable to an embedded microcircuit which is separate from the circuit, and
which is suitable for embedded microcircuits. An EndPage: 2 provides a piezoelectric transducer
component module that can be mechanically coupled to a printed circuit board assembly utilizing
minimal space on the circuit board. Another object of the invention is to provide a piezoelectric
transducer component of a module for generating an audible signal which can be used with any
suitable electronic circuit-a further object of the invention A piezoelectric transducer component
of an audio signal generation module having a device for providing acoustical enhancement of an
audio signal generated by the piezoelectric transducer component. The present invention will be
described in detail according to the following examples. Referring to FIGS. 1 and 2, a module 10
is shown containing a piezoelectric transducer component 32. As shown, the module 10 includes
a housing device 12 which is assembled using a suitable insulation material such as 7 rustinok.
In the preferred embodiment 9+ ′ ′, the piezoelectric transducer component 32 includes a
force (at least one wedge 1) surface 14 forming a compartment 15 provided therein. In addition,
the printing device 12 transmits and disperses the audio signal generated by the transducer
component 82, and the printed circuit board assembly utilizing the acoustic signal to minimize
the surface area of the acoustic signal. , A mechanical device 16 for mechanically coupling the
module 10 to the substrate 2, and electrically coupling the transducer component 82 to an
electronic circuit (not shown) that may be included on the substrate 2. And 20, and a device 26
for mounting the transducer component 82 on the housing device 12 which vibrates the
transducer component in response to electrical signals generated by electronic circuitry (not
shown) on the substrate 2. ,including.
Devices 16.18, and 20 include powder that is fixed to the side 14 of the housing 12 and is
attachable. Devices 16.18, and 20 have, in history, a fastener device 17 of sufficient length and
yet incorporated so that the housing device 12 can be lifted from the surface of the circuit board
with a predetermined optimum distance, the electronic circuit For the bottom area. Use as much
as possible. As shown in FIGS. 1 and 2, the audio signal output aperture 28 has an acoustic
enhancer 25 coupled thereto. The sound enhancer 25 can include devices such as an open end, a
resonant chamber, a slot, or a horn. As shown in the preferred embodiment, the sound enhancing
device 25 includes the resonance chamber 22 and the open end 24, and the sound enhancing
device 25 may be included in the mold of the /% + 7 gaging device 12. Alternatively, it may be a
separate device attached to the housing device 12 after being molded. In order to acoustically
intensify the sound supplied by the piezoelectric transducer component 32, the respective device
forces (applicable to the present invention are shown in FIGS. 1 and 2). It is not limited to 25.
Referring to FIGS. 1 and 3, any piezoelectric transducer component 32 that provides an audible
signal is housed in module 讐 0. The piezoelectric transducer 4 is supported by a vibrating
substrate 28, typically a piezoelectric force, a piezoelectric ceramic element 30 mechanically
coupled to the substrate, and a piezoelectric ceramic element 80. At least two electrodes 40 and
42 (not shown). In FIGS. 1 and 3 there is shown a piezoelectric transducer component 32 for
providing a soft axis signal, comprising, by way of example, three electrodes, two of which are
shown as electrodes 40 and 42 in FIG. An electrode (not shown) is typically included between the
piezoelectric ceramic element 30 and the imaging substrate 28 and the electronic drive circuitry
is electrically coupled thereto by coupling the electrical lead 38 to the substrate 28 Be done.
Further, electrodes 40 and 42 are electrically coupled to the electronic drive circuit by leads 34
and 86, respectively. As shown in FIG. 1, leads 34.36 and 38 are electrically coupled to devices
16.18 and 20 to mechanically couple the module to one substrate 2. Although not shown, if
substrate 2 is a printed circuit board assembly, electrical connections can be made to substrate
16.18 and 20 by soldering devices 16.18 and 20 to substrate 2. It will be apparent to those
skilled in the art that this is done between the circuits included above.
Thus, by coupling leads 34.36 and 88 to devices 16.18 and 20, the piezoelectric transducer
structure EndPage: 3 component 82 is electrically coupled to the electronic drive circuitry
contained on substrate 2 Ru. Piezoelectric transducer component 82 further includes a basic
stationary point (node) diameter 44 which is the point that does not vibrate when transducer
component 82 is driven at its fundamental resonant frequency. As shown in FIG. 1 because of the
transducer component 821i, it is attached to the waging device 12 at the basic resting point
diameter 44 by the mounting device 26. For this embodiment, the mounting device 26 may be
any resilient adhesive material. Furthermore, as shown in FIG. 1, section 11115 of housing device
12 is enclosed by coupling plate 39 to the bottom or input opening of housing device 12 and
also for slate to make the necessary electrical connections Extend leads 84. 86 and 38 through
89. It will be appreciated that the objects of the invention have been achieved and that further
modifications can be made without departing from the scope of the invention, as described
4. Brief Description of the Drawings] FIG. 1 is a view of the output end of the transducer
component module shown in FIG. 1 and FIG. 2 of the transducer component module of the
present invention. FIG. 8 is a view showing the end of the transducer component module shown
in FIG. 1; (Code explanation) '10: module 12: housing housing ftk22: resonance room 24: opening
end 25: acoustic strengthening device 28: vibration substrate 80: piezoelectric ceramic element
32: piezoelectric transducer component module 40. 42: electrode agent Patent Attorney Yuasa
Yuzo (one outside) EndPage: 4
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