close

Вход

Забыли?

вход по аккаунту

?

JPS5610800

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JPS5610800
Description 1, title of the invention
??????????????????
3. Detailed Description of the Invention The present invention relates to an electret condenser
microphone (hereinafter referred to as an ECM), and more particularly to a structure of a
semiconductor element mounting portion for extracting an output signal of the microphone. The
structure of a conventional ECM is shown in FIG. The ECM sandwiches the spacer 3 with a 5electret film 1 and a metal plate 2 (hereinafter referred to as a back electrode plate) to form a
capacitor. The electret film is insulated by the insulator 4 from the cylindrical aluminum case 5
which encloses 100M. In addition, the back surface plate of the back electrode plate 2 fixes the
back effect chamber 6 and a field effect transistor (hereinafter referred to as FET) 7 sealed with a
resin mold in 10 ECM with the insulating ring 8 and silvering the gate lead 9 of the FET 7 It
adheres to the back electrode plate 2 with paste etc. and takes electrical contact. Next, to isolate
the gate lead 9 of the FET 7, the source lead 1510, the drain lead 10 from the cylindrical
aluminum case 5 and the printed circuit board 11, the drain and source lines of the FET 7 are
printed through the insulating rubber plate 12 It fixes to board 11 with solder 13. EndPage: The
operation of this ECM is described below. A charge is given to the electret film, a capacitor is
formed by the electret film 1 and the back electrode plate 2, and the electret film 1 is vibrated by
the sound wave. At this time, the voltage fluctuation associated with the fluctuation of the
distance between the electret film 1 and the back electrode plate 2 is taken as a manual signal
from the gate terminal of the FBT 7 and an output signal is outputted between the drain and
source terminals 10-10. Conventionally, the semiconductor element 7 is susceptible to the
influence of the external atmosphere and is resin-sealed, and it is necessary to form a space and a
back chamber into which the resin-sealed FET is inserted 10, and the shape of the ECM becomes
04-05-2019
1
large. . Also, the ECM has the disadvantage that the manufacturing cost is high because it is
composed of FETs, back plates, and many other parts. SUMMARY OF THE INVENTION The object
of the present invention is to organize the complexity of parts combinations in the vicinity of the
semiconductor element number 15 of the conventional ECM and simplify it into one part unit
centering on the semiconductor elements, and to assemble the ECM parts. It is an object of the
present invention to provide an electret condenser microphone in which the number of
assembling steps is greatly reduced. In the ECM of the present invention, the lead frame is
adhered to the back electrode plate by using a paste of copper paste, etc., using the same process
as the conventional process of sealing a semiconductor element with a mold resin, The back plate
is formed simultaneously with the sealing of the semiconductor chip by combining the electrode
plates and further using a metal rod type. This metal rod type may use a knock out bin which
facilitates the removal of metal to resin from the resin.
As described above, the attachment of the back electrode plate, the formation of the back
chamber, and the sealing of the semiconductor element are simultaneously performed, and these
are integrated to simplify the assembly of the ECM. Next, an embodiment of the invention will be
described with reference to the drawings. FIG. 2 (two shown 15 is a lead frame used for the
semiconductor device according to the present invention. FIG. 3 shows a structure at the time of
resin sealing in the semiconductor device manufacturing process according to the present
invention. Lead frame 15i: The chip 14 of the FET is subjected to die bonding and wire bonding
from the related art; The protrusion 17 of the die bonding portion 16 of the lead frame 15 (the
gate of the -FET chip 14 is connected, and the protrusion 17 is adhered to the back electrode
plate 19 mounted on the mold 18 with a conductive adhesive 20 such as silver paste) Take
electrical contact. Next, the resin 21 is put into the mold 18 to seal the semiconductor element.
At this time, the back chamber is formed simultaneously with the sealing of the semiconductor 5
element by the resin 21 using the metal rod type 22 (from the sealing of the semiconductor
element, the attachment of the back electrode plate, and the formation of the back chamber
simultaneously. Thus, a semiconductor device is obtained. FIG. 4 is a completed view of the ECM
of the present invention using such a semiconductor device. The spacer 3, the electret film 1, and
the insulating plate 4 are attached to the above-described resin-sealed semiconductor device 10
and sealed with a cylindrical aluminum case 5. As described above, according to the present
invention, the manufacturing process is simple as compared with the conventional ECM, the
number of parts is small, and the cost can be reduced (two products can be manufactured). In
addition, since the semiconductor element is directly sealed instead of mounting the molded FET,
the size can be reduced.
4. Brief description of the drawings-5 = Figure 1 is a cross-sectional view of a conventional ECM,
Figure 2 is a plan view of a semiconductor chip attached to a lead frame used in the present
invention, and Figure 3 is a diagram of the present invention FIG. 4 is a cross-sectional view of
04-05-2019
2
one embodiment of the present invention for illustrating the manufacturing process of such a
semiconductor device. 1 ...... electret film, 2.19 ...... back electrode plate, 5 ...... cylindrical
aluminum case, 6 ..... back chamber, 14 ..... и Semiconductor chip, 15 ииииии Lead frame, 18 и и и и и и и и и
и и и и и и и ?19? и и и и и и и и и и и и 20 и и и conductive adhesive, 21 и и и и и Resin for sealing, 22 и и и и и и и
Metal rod type. ?; ? Agent patent attorney Uchihara 4-6-EndPage: ?
04-05-2019
3
Документ
Категория
Без категории
Просмотров
0
Размер файла
10 Кб
Теги
jps5610800
1/--страниц
Пожаловаться на содержимое документа