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JPS55155164

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DESCRIPTION JPS55155164
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional side view showing a conventional
speaker system, and FIG. 2 is a sectional side view showing a speaker system according to an
embodiment of the present invention. 1 ...... speaker cabinet, 2 ...... network component, 3 ...... with
up the plate, 4 ...... radiator. In the drawings, the same reference numerals indicate the same or
corresponding parts.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the dissipation of
heat generated from a network of loudspeaker systems. Heretofore, as a speaker system of this
kind, there has been one shown in FIG. In the figure, fi + indicates a cabinet, (2) indicates a
network, and (3) indicates a network (the attachment for attaching the 21 cabinet +++ IC is a
plate. Next, the configuration will be described. The network component +21 configured by
electronic components is housed and attached to the inside of the cabinet i11 by the plate (3).
Since the network part of the conventional speaker system is configured as (1) ? ?, z ? ? иии or
more, the heat dissipation of the network element is bad, and there is a drawback that the
performance of the speaker system can not be improved. This device is designed to eliminate the
disadvantages of the above-mentioned conventional books, and by providing a radiator to the
heat generating parts of the network, the heat radiation effect is better <L, and the performance
of the speaker system is improved. The purpose is to provide something that can be measured.
Hereinafter, an embodiment of the present invention will be described with reference to the
drawings. In FIG. 2, + 11 # i cabinet, +21 is a network, (3) is a network component 12 + mounting
is a plate for attachment, and (4) is a radiator provided in the network component (2) . Next, the
configuration of the speaker system according to the present invention will be described. A
network component (2) provided with a radiator (4) to dissipate heat generated from the
electronic components constituting the network is formed of resin or the like The cabinet is fixed
to the board (3) and stored in the cabinet fi1 (2). As described above, according to this device, the
heat dissipation effect of the network is increased and the performance of the speaker system is
09-05-2019
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improved. In addition, the lifetime of the network element can be extended.
09-05-2019
2
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